LCMXO3D-9400ZC-2BG400I

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

Quantity 847 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3D-9400ZC-2BG400I – MachXO3D Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

The LCMXO3D-9400ZC-2BG400I is a MachXO3D family FPGA from Lattice Semiconductor Corporation offering reconfigurable, non-volatile logic in a compact 400-LFBGA package. It provides a balanced combination of logic capacity, embedded memory and a high I/O count for industrial applications.

Designed for industrial environments, this device delivers 9,400 logic elements, approximately 0.42 Mbits of embedded RAM (442,368 bits), and 335 I/Os, with a supply voltage range of 2.375 V to 3.465 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  9,400 logic elements organized across 1,175 configurable logic blocks (CLBs) to implement custom logic, glue functions, and control engines.
  • Embedded Memory  Approximately 0.42 Mbits (442,368 bits) of on-chip RAM suitable for FIFOs, buffers and state storage without external memory.
  • I/O Density  335 general-purpose I/Os provide extensive connectivity for parallel interfaces, signal aggregation, and board-level integration.
  • Power and Supply Flexibility  Operates from 2.375 V to 3.465 V, allowing compatibility with multiple system voltage domains.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation for reliability in harsh or extended-temperature deployments.
  • Non-volatile, Reconfigurable Architecture  MachXO3D family features include non-volatile configuration and reconfiguration capabilities for adaptable system designs.
  • Embedded Security & Hardened IP  Family datasheet documents dedicated embedded security blocks and hardened IP functions for secure configuration and common peripherals (refer to MachXO3D family datasheet for details).
  • On-chip Clocking and Peripherals  Flexible on-chip clocking (PLLs) and integrated peripherals are included in the MachXO3D family architecture to simplify timing and control tasks.
  • Advanced Packaging  Supplied in a 400-LFBGA (400-CABGA, 17×17 mm) surface-mount package for compact board-level integration.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Industrial Control and Automation  Implement custom control logic, I/O expansion and signal conditioning in equipment that requires industrial temperature operation.
  • System Glue and Interface Bridging  Serve as a flexible interface hub between multiple buses and peripherals using a high I/O count and on-chip logic resources.
  • Secure Configuration and Boot  Use the MachXO3D family's embedded security features and non-volatile reconfiguration to manage device configuration and system startup routines.
  • Embedded System Integration  Consolidate CPLD-like control functions, timers and protocol handling into a single device to reduce BOM and board complexity.

Unique Advantages

  • High Integration  Combines 9,400 logic elements, on-chip RAM and 335 I/Os in a single 400-LFBGA package to reduce external components and simplify PCB design.
  • Industrial Reliability  Rated for −40 °C to 100 °C, enabling deployment in demanding environmental conditions without additional qualification claims.
  • Flexible Power Options  Wide supply range (2.375 V–3.465 V) supports multiple system voltage schemes and eases interfacing with diverse components.
  • Non-volatile Configuration  Retains configuration without external flash, streamlining system boot and reducing dependency on external non-volatile memory.
  • Compact Advanced Package  400-CABGA (17×17) package provides high pin count and density for space-constrained designs.
  • Ecosystem and Documentation  MachXO3D family datasheet provides detailed architecture and feature descriptions to support engineering integration and verification.

Why Choose LCMXO3D-9400ZC-2BG400I?

The LCMXO3D-9400ZC-2BG400I positions itself as a robust, industrial-grade FPGA solution combining substantial logic capacity and on-chip memory with a very high I/O count. Its non-volatile, reconfigurable architecture and family-level security and peripheral features make it well suited for designs that require flexible control, interface consolidation, and reliable operation across extended temperatures.

This device is a practical choice for engineers and procurement teams seeking a compact, surface-mount FPGA with clear electrical and environmental specifications, supported by comprehensive MachXO3D family documentation for streamlined integration and long-term deployment.

Request a quote or submit an inquiry to purchase the LCMXO3D-9400ZC-2BG400I and specify your quantity and lead-time requirements to begin the procurement process.

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