LCMXO3D-9400HE-5UTG69ITR1K

The LCMXO3D-9400HE-5UTG69ITR1K is a MachXO3D field programmable gate array (FPGA) in a compact 69-WLCSP package. It combines 9,400 logic elements with 1,175 configurable logic blocks and embedded RAM to enable custom digital logic implementation for space-constrained industrial designs.

Designed for surface-mount assembly and operation across a broad industrial temperature range, this device is suited to applications that require low-voltage operation, on-chip memory, and a moderate number of I/O signals.

Key Features

• Core Logic  9,400 logic elements and 1,175 CLBs provide a flexible fabric for implementing custom logic, state machines, and glue logic.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM for buffering, small FIFOs, and local data storage without external memory.
• I/O Count  58 general-purpose I/O pins to interface with sensors, peripherals, and external controllers.
• Power  Operates from a core supply range of 1.14 V to 1.26 V to match low-voltage system domains.
• Package and Mounting  Available in a 69-WFBGA / 69-WLCSP package (supplier package size 5.19 × 6.22 mm) optimized for surface-mount assembly in compact designs.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Implement custom logic for motor control, protocol bridging, and I/O consolidation within industrial equipment operating across −40 °C to 100 °C.
• Embedded Systems  Provide glue logic, peripheral control, and small data buffering in space-constrained embedded products using the compact 69-WLCSP package.
• Instrumentation and Test  Create custom timing, trigger logic, and local data storage using the device’s logic elements and embedded RAM.

Unique Advantages

• Moderate logic capacity: 9,400 logic elements and 1,175 CLBs deliver the resources needed for mid-range customization without excessive board area.
• On-chip memory: Approximately 0.44 Mbits of embedded RAM reduces dependency on external memory for small buffers and FIFOs.
• Low-voltage operation: 1.14 V to 1.26 V core supply enables integration into modern low-voltage systems.
• Compact package: 69-WLCSP (5.19 × 6.22 mm) minimizes PCB footprint for size-constrained designs.
• Industrial temperature range: Rated from −40 °C to 100 °C for use in harsh or variable environments.
• RoHS compliant: Meets standard environmental and manufacturing requirements.

Why Choose LCMXO3D-9400HE-5UTG69ITR1K?

The LCMXO3D-9400HE-5UTG69ITR1K positions itself as a compact, industrial-grade FPGA solution for designers needing mid-level logic capacity, embedded RAM, and a moderate I/O count in a small WLCSP footprint. Its low-voltage core and extended operating temperature make it suitable for industrial and embedded applications where board space, power efficiency, and environmental resilience matter.

This device is a practical choice for engineers implementing custom control, interfacing, or buffering functions who require on-chip memory and flexible I/O without moving to larger packages or more complex devices.

Request a quote or submit an inquiry to get pricing, availability, and lead-time details for the LCMXO3D-9400HE-5UTG69ITR1K. Our team can assist with ordering and provide additional technical resources upon request.