LCMXO3L-1300E-5UWG36ITR1K

The LCMXO3L-1300E-5UWG36ITR1K is a MachXO3 family FPGA IC from Lattice Semiconductor. It integrates low-density programmable logic with on-chip memory and hardened peripheral IP in a compact 36‑WLCSP (2.54 × 2.59 mm) package for space-constrained designs.

Designed for industrial operating conditions, the device provides approximately 1,280 logic elements, about 65,536 bits of embedded RAM, 28 general-purpose I/O pins, and non-volatile multi-time programmable configuration — useful for embedded control, interface bridging, and small-scale system integration where low power and compact packaging are priorities.

Key Features

• Core Logic — Approximately 1,280 logic elements provide the programmable resources for glue logic, control functions, and modest combinational/sequential logic implementations.
• Embedded Memory — Approximately 65,536 bits of on-chip RAM supporting single, dual, pseudo-dual port and FIFO modes as documented for the MachXO3 family.
• I/O and Packaging — 28 I/O pins in a 36‑WLCSP (2.54 × 2.59 mm) package with surface-mount mounting for compact board integration.
• Voltage and Temperature — Low-voltage core operation with a supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, suitable for industrial environments.
• Non‑volatile, Multi‑time Programmable Configuration — On-device non-volatile configuration and user flash memory (UFM) enable persistent programming and reconfiguration without external configuration memory.
• Hardened Peripheral IP and On‑chip Resources — MachXO3 family documentation includes hardened I2C and SPI IP, timer/counter, on-chip oscillator, PLLs and other system-level resources to simplify peripheral interfacing and clocking.
• Advanced Architecture Options — Family-level features such as programmable I/O cells, input/output gearboxes, embedded block RAM memory modes, and flexible clock/control distribution are part of the MachXO3 architecture.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Monitoring — Industrial-grade temperature tolerance (−40 °C to 100 °C) and compact packaging make this device suitable for control logic, sensor interfacing, and condition monitoring applications requiring modest logic and I/O counts.
• Interface Bridging and Glue Logic — With 28 I/O and flexible on-chip resources, the device is well suited for protocol bridging, bus adaptation, and board-level glue logic where a small, reprogrammable FPGA is needed.
• Embedded Peripheral Offload — Hardened I2C/SPI IP, timers and on-chip memory allow offloading peripheral management and simple state-machine functions from a host MCU while minimizing external components.

Unique Advantages

• Compact, low‑profile package — 36‑WLCSP (2.54 × 2.59 mm) reduces PCB area and enables dense board-level integration.
• Non‑volatile configuration — Multi-time programmable on-device configuration and UFM provide persistent programming without mandatory external flash.
• Industrial temperature range — Rated from −40 °C to 100 °C to support designs exposed to harsh ambient conditions.
• Low-voltage operation — Core supply between 1.14 V and 1.26 V aligns with modern low-voltage system domains.
• Embedded peripherals and clocking — Hardened IP blocks and on-chip PLLs and oscillator reduce the need for external components and speed integration of system functions.
• RoHS compliant — Meets standard restrictions on hazardous substances for broad manufacturability.

Why Choose LCMXO3L-1300E-5UWG36ITR1K?

This MachXO3 device balances compact packaging, non-volatile configuration, and a modest set of programmable resources to address space-constrained embedded designs that require reliable operation across industrial temperature ranges. The combination of approximately 1,280 logic elements, ~65 kbits of embedded RAM, 28 I/O, and hardened peripheral IP provides a ready platform for interface logic, peripheral offload, and system glue functions.

Engineers seeking a small-footprint, industrial-grade FPGA with on-chip configuration and system-level resources will find this device a practical choice for reducing BOM complexity and accelerating integration in low- to mid-density programmable logic applications.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LCMXO3L-1300E-5UWG36ITR1K.