LCMXO3L-1300E-6MG121I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 100 65536 1280 121-VFBGA, CSPBGA |
|---|---|
| Quantity | 735 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-CSFBGA (6x6) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-VFBGA, CSPBGA | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3L-1300E-6MG121I – MachXO3 FPGA, 100 I/O, 1.14–1.26 V, 121‑VFBGA
The LCMXO3L-1300E-6MG121I is a MachXO3 family Field Programmable Gate Array (FPGA) IC in a 121‑ball VFBGA / CSPBGA package. It integrates 1,280 logic elements, approximately 65,536 bits of embedded RAM, and up to 100 I/O pins in a compact surface‑mount package targeted for industrial applications.
Designed for flexible system glue logic, interface bridging and embedded control tasks, this device combines non‑volatile, multi‑time programmability and on‑chip system features to simplify board design and reduce system BOM in industrial environments.
Key Features
- Logic Capacity 1,280 logic elements provide a compact programmable fabric for glue logic, control finite state machines, and small‑to‑medium logic functions.
- Embedded Memory Approximately 65,536 bits (≈64 Kbit) of on‑chip RAM for FIFOs, small data buffers and control state storage.
- I/O and Interfaces Up to 100 I/O pins support flexible interfacing; datasheet references include pre‑engineered source‑synchronous I/O and a high‑performance, flexible I/O buffer architecture.
- Configuration & Non‑Volatile Storage Non‑volatile, multi‑time programmable configuration with TransFR reconfiguration options and user flash memory capability described in the MachXO3 family datasheet.
- Clocking and Timing On‑chip flexible clocking including PLLs and an on‑chip oscillator are available for system clock generation and timing management.
- Embedded Hardened IP Datasheet material lists hardened I2C, SPI and timer/counter IP blocks for common system functions and peripheral control.
- Power and Supply Specified supply range: 1.14 V to 1.26 V, enabling straightforward power planning for embedded systems.
- Package and Mounting 121‑VFBGA / CSPBGA (supplier package: 121‑CSFBGA, 6×6) surface‑mount package for space‑constrained designs.
- Industrial Grade Operating temperature range from −40 °C to 100 °C, suitable for industrial environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Use as embedded glue logic and local control for sensors, actuators and peripheral coordination within industrial equipment where the −40 °C to 100 °C range is required.
- Interface Bridging and Protocol Conversion Flexible I/O and pre‑engineered source‑synchronous I/O capabilities support bridging between subsystems and custom interface adaptation.
- Configuration and System Management Non‑volatile, multi‑time programmability and on‑chip user flash memory enable in‑field updates and configuration storage for system boot or management tasks.
Unique Advantages
- Compact, Integrated FPGA Fabric: 1,280 logic elements and embedded RAM reduce the need for discrete glue logic and external memory in small systems.
- Robust Industrial Operating Range: Specified −40 °C to 100 °C operation makes it suitable for harsh industrial deployments.
- Flexible I/O Count and Packaging: Up to 100 I/Os in a 121‑ball VFBGA/CSPBGA (121‑CSFBGA, 6×6) footprint for dense, space‑constrained PCBs.
- On‑Chip System IP: Hardened I2C, SPI and timer/counter functions plus PLLs and an on‑chip oscillator reduce development time for common system tasks.
- Non‑volatile, Reprogrammable Configuration: Multi‑time programmability and TransFR reconfiguration support updateable designs and iterative development workflows.
- Low‑level Power Specification: Narrow supply window (1.14–1.26 V) simplifies power supply selection and margin planning.
Why Choose LCMXO3L-1300E-6MG121I?
The LCMXO3L-1300E-6MG121I positions itself as a compact, industrial‑grade FPGA suited for designers who need moderate logic capacity, flexible I/O and built‑in system features in a small surface‑mount package. Its combination of non‑volatile configuration, embedded memory, hardened peripheral IP and on‑chip clock resources enables streamlined system architecture and reduced component count.
This device is a fit for customers building industrial controllers, interface bridges and embedded management functions who require reliable operation across a wide temperature range, RoHS compliance, and the design flexibility provided by the MachXO3 family architecture.
Request a quote or submit a quote for the LCMXO3L-1300E-6MG121I to evaluate how this MachXO3 FPGA can simplify your design and reduce system complexity.
