LCMXO3L-2100C-5BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 919 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3L-2100C-5BG256I – MachXO3 Field Programmable Gate Array (FPGA) IC, 256-LFBGA
The LCMXO3L-2100C-5BG256I is a member of the MachXO3 family of FPGAs, delivering a compact, reprogrammable logic device tailored for embedded and industrial applications. Its architecture provides a mix of logic, embedded memory, and flexible I/O suited for integration, control, and interface tasks within systems that require reconfigurable hardware.
Designed for surface-mount assembly in a 256-LFBGA package, this device combines 2,112 logic elements, approximately 75,776 bits of embedded memory, and 206 I/Os while supporting a 2.375 V to 3.465 V supply range and industrial operating temperatures from -40 °C to 100 °C.
Key Features
- Core Logic — 2,112 logic elements providing reprogrammable logic capacity for glue logic, finite state machines, and medium-complexity datapaths.
- Logic Clusters (CLBs) — 264 CLBs to organize and implement combinatorial and sequential logic structures.
- Embedded Memory — Approximately 75,776 bits of on-chip RAM for buffering, FIFOs, and small lookup tables.
- I/O Capacity — 206 general-purpose I/Os for dense peripheral interfacing, bus bridging, and signal aggregation.
- Power and Voltage — Supports a supply range of 2.375 V to 3.465 V for compatibility with a variety of system power rails.
- Package and Mounting — Surface mount 256-LFBGA package (supplier device package: 256-CABGA, 14×14) for compact board-level integration.
- Industrial Temperature Grade — Specified operating range from -40 °C to 100 °C for industrial environments.
- Non-volatile, Multi-time Programmable Configuration — Family-level feature enabling field reconfiguration without external configuration memory.
- Flexible On-chip Clocking and I/O — MachXO3 family features include flexible clocking and pre-engineered source-synchronous I/O and high-performance I/O buffering (described in the MachXO3 family data sheet).
- Embedded Hardened IP — Family documentation references hardened I2C and SPI cores and timers/counters for common system functions.
- Standards and Compliance — RoHS compliant.
Typical Applications
- Industrial Control and Automation — Use the device’s industrial temperature rating, 206 I/Os, and on-chip memory for I/O aggregation, protocol bridging, and control logic in automation equipment.
- Embedded System Glue Logic — Implement interface translation, bus multiplexing, and custom control functions using 2,112 logic elements and flexible I/O buffering.
- Prototyping and Development — Reprogrammable logic and multi-time programmable configuration make the device suitable for iterative hardware development and system verification.
Unique Advantages
- Balanced Resource Set: Combines a moderate logic element count with substantial I/O (206 pins) and embedded memory (≈75,776 bits), enabling compact designs with both control and interface functions on a single device.
- Industrial Operating Range: Rated from -40 °C to 100 °C, permitting deployment in a broad range of industrial environments.
- Flexible Power Support: Broad supply range (2.375 V to 3.465 V) aids integration with existing system power rails.
- Compact, Board-Ready Package: 256-LFBGA (supplier 256-CABGA, 14×14) supports high-density PCBs while providing the pin count required for complex interfaces.
- On-chip Hardened Functions: The MachXO3 family includes hardened I2C and SPI cores plus timers/counters that reduce external component count and simplify design.
- RoHS Compliant: Conforms to RoHS requirements for lead-free assemblies and global manufacturing compliance.
Why Choose LCMXO3L-2100C-5BG256I?
The LCMXO3L-2100C-5BG256I positions itself as a versatile FPGA choice for designs that need a dependable combination of logic capacity, I/O density, and on-chip memory in a compact, industrial-grade package. Its support for multi-time programmable, non-volatile configuration and MachXO3 family clocking and I/O features make it suitable for engineers seeking a reprogrammable, integratable device for embedded control, interface consolidation, and iterative development.
Customers targeting industrial systems, embedded controllers, or board-level prototypes will find the device’s operating range, supply flexibility, and integrated peripherals offer long-term value through reduced BOM complexity and design adaptability backed by the MachXO3 family documentation.
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