LCMXO3L-2100C-5BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 919 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3L-2100C-5BG256I – MachXO3 Field Programmable Gate Array (FPGA) IC, 256-LFBGA

The LCMXO3L-2100C-5BG256I is a member of the MachXO3 family of FPGAs, delivering a compact, reprogrammable logic device tailored for embedded and industrial applications. Its architecture provides a mix of logic, embedded memory, and flexible I/O suited for integration, control, and interface tasks within systems that require reconfigurable hardware.

Designed for surface-mount assembly in a 256-LFBGA package, this device combines 2,112 logic elements, approximately 75,776 bits of embedded memory, and 206 I/Os while supporting a 2.375 V to 3.465 V supply range and industrial operating temperatures from -40 °C to 100 °C.

Key Features

  • Core Logic — 2,112 logic elements providing reprogrammable logic capacity for glue logic, finite state machines, and medium-complexity datapaths.
  • Logic Clusters (CLBs) — 264 CLBs to organize and implement combinatorial and sequential logic structures.
  • Embedded Memory — Approximately 75,776 bits of on-chip RAM for buffering, FIFOs, and small lookup tables.
  • I/O Capacity — 206 general-purpose I/Os for dense peripheral interfacing, bus bridging, and signal aggregation.
  • Power and Voltage — Supports a supply range of 2.375 V to 3.465 V for compatibility with a variety of system power rails.
  • Package and Mounting — Surface mount 256-LFBGA package (supplier device package: 256-CABGA, 14×14) for compact board-level integration.
  • Industrial Temperature Grade — Specified operating range from -40 °C to 100 °C for industrial environments.
  • Non-volatile, Multi-time Programmable Configuration — Family-level feature enabling field reconfiguration without external configuration memory.
  • Flexible On-chip Clocking and I/O — MachXO3 family features include flexible clocking and pre-engineered source-synchronous I/O and high-performance I/O buffering (described in the MachXO3 family data sheet).
  • Embedded Hardened IP — Family documentation references hardened I2C and SPI cores and timers/counters for common system functions.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Use the device’s industrial temperature rating, 206 I/Os, and on-chip memory for I/O aggregation, protocol bridging, and control logic in automation equipment.
  • Embedded System Glue Logic — Implement interface translation, bus multiplexing, and custom control functions using 2,112 logic elements and flexible I/O buffering.
  • Prototyping and Development — Reprogrammable logic and multi-time programmable configuration make the device suitable for iterative hardware development and system verification.

Unique Advantages

  • Balanced Resource Set: Combines a moderate logic element count with substantial I/O (206 pins) and embedded memory (≈75,776 bits), enabling compact designs with both control and interface functions on a single device.
  • Industrial Operating Range: Rated from -40 °C to 100 °C, permitting deployment in a broad range of industrial environments.
  • Flexible Power Support: Broad supply range (2.375 V to 3.465 V) aids integration with existing system power rails.
  • Compact, Board-Ready Package: 256-LFBGA (supplier 256-CABGA, 14×14) supports high-density PCBs while providing the pin count required for complex interfaces.
  • On-chip Hardened Functions: The MachXO3 family includes hardened I2C and SPI cores plus timers/counters that reduce external component count and simplify design.
  • RoHS Compliant: Conforms to RoHS requirements for lead-free assemblies and global manufacturing compliance.

Why Choose LCMXO3L-2100C-5BG256I?

The LCMXO3L-2100C-5BG256I positions itself as a versatile FPGA choice for designs that need a dependable combination of logic capacity, I/O density, and on-chip memory in a compact, industrial-grade package. Its support for multi-time programmable, non-volatile configuration and MachXO3 family clocking and I/O features make it suitable for engineers seeking a reprogrammable, integratable device for embedded control, interface consolidation, and iterative development.

Customers targeting industrial systems, embedded controllers, or board-level prototypes will find the device’s operating range, supply flexibility, and integrated peripherals offer long-term value through reduced BOM complexity and design adaptability backed by the MachXO3 family documentation.

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