LCMXO3L-1300E-6MG256I

The LCMXO3L-1300E-6MG256I is a member of the MachXO3 family of field-programmable gate arrays from Lattice Semiconductor Corporation. It provides a compact, non-volatile, multi-time programmable FPGA architecture targeted at industrial applications that require flexible I/O, embedded memory and on-chip system functions.

Built with 1,280 logic elements, 65,536 bits of embedded RAM and 206 general-purpose I/Os in a 256-VFBGA (9×9) surface-mount package, this device is suited for control logic, interface bridging and system glue functionality where integration and configurability reduce BOM and simplify board design.

Key Features

• Core / Logic  Approximately 1,280 logic elements for implementing glue logic, control state machines and small datapaths.
• Embedded Memory  Approximately 0.065 Mbits of embedded RAM (65,536 bits) configurable for single/dual-port RAM and FIFO modes as described in the MachXO3 family architecture.
• I/O and Interfaces  206 I/O pins with flexible, high-performance I/O buffering and pre‑engineered source‑synchronous I/O options to support a wide range of external interfaces.
• Clocking & Timing  On-chip clocking resources including phase-locked loops (PLLs) and flexible clock distribution to support system timing and source-synchronous interfaces.
• Embedded IP & Configuration  Non-volatile, multi-time programmable configuration with TransFR reconfiguration support and embedded hardened IP such as I²C and SPI controllers and timer/counter blocks.
• System & Power Options  Standby mode and power-saving features are part of the MachXO3 family architecture to support system-level power management.
• Package & Mounting  256‑VFBGA (CSPBGA, 256‑CSFBGA 9×9) surface-mount package for compact board integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation and specified supply range of 1.14 V to 1.26 V for reliable operation in industrial environments.
• Design & Testability  MachXO3 family features include configuration and testing capabilities such as IEEE 1149.1-compliant boundary scan support (see family datasheet for details).

Typical Applications

• Industrial Control  Implements control logic, safety interlocks, and interface glue between sensors, actuators and microcontrollers in industrial equipment.
• Interface Bridging  Acts as a protocol translator or I/O expander where flexible I/O and embedded peripherals simplify board-level interfacing.
• User Interface Control  Manages buttons, LEDs, displays and local control logic with compact on-chip resources and plentiful I/Os.
• Embedded System Glue  Replaces discrete logic and CPLDs to consolidate glue logic, reset/clock handling and configuration management on a single device.

Unique Advantages

• Highly integrated solution: 1,280 logic elements plus on-chip memory and 206 I/Os reduce external components and lower board complexity.
• Non-volatile, reprogrammable configuration: Multi-time programmable, non-volatile configuration simplifies manufacturing and field updates without external flash.
• Flexible I/O and timing: Pre-engineered source-synchronous I/O and on-chip PLLs enable straightforward interfacing to a broad range of peripherals and buses.
• Industrial-ready thermal range: Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
• Compact, board-friendly package: 256‑VFBGA (9×9) surface-mount package balances pin count and PCB space for dense designs.
• Embedded peripheral set: Hardened I²C, SPI and timer/counter resources on the MachXO3 architecture minimize the need for external controllers.

Why Choose LCMXO3L-1300E-6MG256I?

The LCMXO3L-1300E-6MG256I combines MachXO3 family system features—non-volatile reprogrammability, flexible I/O, on-chip clocking and embedded peripherals—with a compact 256‑VFBGA package and an industrial temperature rating. It is well-suited for engineers designing control, interface and system-glue functions who need a small, reconfigurable device that consolidates logic, memory and I/O without adding external configuration flash.

Backed by the MachXO3 family architecture and technical documentation, this device provides a predictable integration path for mid-density FPGA requirements in industrial applications where space, configurability and robust temperature range matter.

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