LCMXO3L-2100C-5BG324I

The LCMXO3L-2100C-5BG324I is a MachXO3 family FPGA from Lattice Semiconductor designed as a flexible, non-volatile programmable logic device. It integrates 2,112 logic elements, approximately 75.8 kbits of embedded RAM, and a high-density I/O fabric with 279 usable I/Os in a 324-ball LFBGA (324-CABGA, 15×15) surface-mount package.

Targeted for industrial applications, the device supports operation from 2.375 V to 3.465 V and an operating temperature range of −40 °C to 100 °C, delivering programmable logic, on-chip memory, and embedded IP building blocks suitable for control, interface, and system glue functions.

Key Features

• Core Logic 2,112 logic elements (LEs) provide programmable resources for glue logic, finite-state machines, and combinational/sequential logic implementations.
• Embedded Memory Approximately 75.8 kbits of on-chip RAM (sysMEM embedded block RAM) for data buffering, FIFOs, and small lookup tables.
• High I/O Density 279 I/O pins allow broad peripheral and bus interfacing without added external components.
• Non-volatile, Multi-time Programmable Configuration MachXO3 family configuration supports non-volatile programming and multiple reconfigurations for in-field updates and flexible deployment.
• Embedded Hardened IP Integrated IP blocks include hardened I²C and SPI controllers and a timer/counter, reducing external logic and simplifying common interface tasks.
• Flexible On-chip Clocking and Oscillator Built-in clocking resources and an on-chip oscillator support internal timing and clocking needs without external oscillators for many use cases.
• Package and Mounting 324-LFBGA (324-CABGA, 15×15) surface-mount package enables compact board integration for space-constrained designs.
• Industrial Grade Temperature Range Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Supply Voltage Range Operates from 2.375 V to 3.465 V to accommodate common system power rails.
• Standards and Design Support MachXO3 family documentation and architecture include features for configuration, boundary-scan testability, and system-level support.

Typical Applications

• Industrial Control Implement control logic, protocol translation, and I/O aggregation in factory automation and process control systems using the device’s I/O count and industrial temperature rating.
• Interface Bridging and Glue Logic Use the programmable logic and hardened I/O/IP blocks to bridge peripherals, implement bus adapters, and centralize system initialization tasks.
• Sensor Aggregation and Preprocessing Collect and preprocess signals from multiple sensors with abundant I/Os and embedded RAM for short-term buffering and FIFO operations.
• System Configuration and Sequencing Non-volatile, multi-time programmable configuration is suited to handle boot sequencing, device configuration, and field updates without external configuration memory.

Unique Advantages

• High I/O Count: 279 I/Os reduce external multiplexers and expanders, simplifying board design for complex interfacing.
• Balanced Logic and Memory: 2,112 logic elements paired with approximately 75.8 kbits of embedded RAM enable compact implementations of control state machines with local buffering.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust surface-mount BGA package for industrial deployments.
• On-chip Peripheral IP: Hardened I²C, SPI, and timer/counter blocks reduce BOM and accelerate development of common interface functions.
• Flexible Supply Range: 2.375 V to 3.465 V operation allows easy integration with common system rails.
• Compact Integration: 324-ball LFBGA (15×15) packaging enables high-density system designs while maintaining a small PCB footprint.

Why Choose LCMXO3L-2100C-5BG324I?

The LCMXO3L-2100C-5BG324I delivers a pragmatic balance of programmable logic, on-chip memory, and a high I/O count in a compact industrial-grade package. It suits designs that require dependable field-programmable control, interface consolidation, and on-board peripheral support without relying on external non-volatile configuration devices.

Engineers and procurement teams will find this MachXO3 device well-suited for mid-density logic tasks in industrial and embedded systems where integration, temperature resilience, and flexible configuration are priorities. The combination of hardened IP, flexible clocking, and non-volatile programmability supports scalable designs and straightforward in-field updates.

Request a quote or submit a sales inquiry to receive pricing and availability for LCMXO3L-2100C-5BG324I and to discuss volume, lead times, or technical questions about integrating this MachXO3 FPGA into your design.