LCMXO3L-2100C-6BG324I

The LCMXO3L-2100C-6BG324I is a MachXO3 family FPGA offering on-chip, non-volatile programmable logic in a compact 324-LFBGA package. It provides 2,112 logic elements, approximately 0.076 Mbits of embedded memory, and up to 279 I/O pins for dense interface and glue-logic applications.

Designed for industrial environments, this device supports a 2.375 V to 3.465 V supply range and an operating temperature span of −40 °C to 100 °C. The MachXO3 architecture includes flexible on-chip clocking (PLLs), programmable I/O cells, hardened peripheral IP, and multi-time programmable non-volatile configuration—features that simplify system integration and configuration management.

Key Features

• Core Logic — 2,112 logic elements provide a programmable fabric for glue logic, control finite-state machines, and simple data-path implementations.
• Embedded Memory — Approximately 0.076 Mbits of on-chip RAM for small FIFOs, buffers, and local data storage.
• Rich I/O — Up to 279 I/O pins with programmable I/O cells and support for source-synchronous interfaces to ease high-pin-count interface implementations.
• Configuration and IP — Non-volatile, multi-time programmable configuration and embedded hardened IP blocks including I²C, SPI, timers/counters and on-chip oscillator for reliable system functions.
• Clocking and Timing — Flexible on-chip clocking with PLLs to support system clock generation and domain management.
• Power and Modes — Support for standby and power-saving options to help manage system-level power consumption.
• Industrial Grade Package — 324-LFBGA (supplier package: 324-CABGA, 15×15 mm) surface-mount device rated for industrial temperature operation (−40 °C to 100 °C).
• Supply Range and Compliance — Operates from 2.375 V to 3.465 V and is RoHS compliant.

Typical Applications

• Interface Bridging and I/O Aggregation — Use the 279 programmable I/Os and I/O cell flexibility to consolidate and bridge multiple peripheral buses and interfaces.
• System Control and Glue Logic — Leverage 2,112 logic elements and embedded RAM for control state machines, bus arbitration, and protocol conversion.
• Embedded Peripheral Offload — Employ hardened I²C and SPI IP blocks and timers to offload routine peripheral management from the host MCU or processor.
• Industrial Automation — The industrial temperature rating and robust packaging make this device suitable for control and monitoring functions in industrial applications.

Unique Advantages

• Highly integrated programmable logic: 2,112 logic elements with on-chip RAM reduce external component count for compact designs.
• Large, flexible I/O count: 279 I/Os enable high-density signal routing and multi-bus interfacing without additional switch devices.
• Non-volatile multi-time programmability: Built-in non-volatile configuration simplifies deployment and field updates without external configuration memory.
• Embedded hardened IP and clocking: On-chip I²C/SPI, timers, oscillator and PLLs speed development of system-level functions and timing domains.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact LFBGA packaging: 324-LFBGA (324-CABGA, 15×15 mm) balances high pin count with a small board footprint for space-constrained designs.

Why Choose LCMXO3L-2100C-6BG324I?

The LCMXO3L-2100C-6BG324I positions itself as a flexible, non-volatile FPGA option for engineers needing a balance of logic density, embedded memory, and a very large I/O complement in a compact industrial-grade package. Its MachXO3 family architecture—featuring programmable I/O, on-chip clocking, hardened peripheral IP, and power management options—helps accelerate system integration and reduce BOM complexity.

This device suits designers building industrial control, interface bridging, and system glue logic who require field-updateable configuration and robust temperature performance. The combination of logic resources, embedded memory, and extensive I/O provides a practical platform for consolidating discrete logic and peripheral handling into a single programmable device.

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