LCMXO3L-2100C-6BG324C

The LCMXO3L-2100C-6BG324C is a commercial-grade MachXO3 FPGA IC designed for flexible system control and glue-logic tasks. It provides a compact, non-volatile FPGA architecture with programmable logic, embedded memory, and a high I/O count for board-level integration and system interfacing.

Built around 2,112 logic elements and approximately 0.076 Mbits (75,776 bits) of embedded RAM, the device targets applications that require moderate logic density, many I/O channels, and reliable non-volatile configuration in a 324-LFBGA package.

Key Features

• Logic Capacity — 2,112 logic elements suitable for mid-density programmable logic tasks and glue logic.
• Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for FIFOs, small buffers, and state storage.
• High Pin Count I/O — 279 I/O pins to support dense peripheral interfacing and board-level signal routing.
• Non-volatile, Multi-time Programmable Configuration — On-device non-volatile configuration for field reprogrammability and simplified system boot without external configuration memory.
• Flexible I/O and Source-Synchronous Support — Datasheet notes pre-engineered source-synchronous I/O and flexible I/O buffer options for interfacing with a range of signaling standards.
• On-chip Clocking and PLLs — Integrated clocking resources and sysCLOCK PLLs for internal clock generation and distribution.
• Hardened IP Blocks — Datasheet references hardened I²C and SPI IP cores plus timer/counter functions for common peripheral tasks.
• Package and Mounting — Surface-mount 324-LFBGA (supplier package: 324-CABGA, 15 × 15 mm) for compact board designs.
• Operating Range — Voltage supply range 2.375 V to 3.465 V and commercial temperature rating from 0 °C to 85 °C.
• Power and System Features — On-chip oscillator, user flash memory (UFM), and power-saving/standby modes described in the family datasheet for system-level power control.
• Standards and Testability — Includes boundary-scan testability features and configuration/test support as outlined in the MachXO3 family datasheet.

Typical Applications

• System Glue Logic — Replace multiple discrete logic ICs with a reprogrammable device for board-level control and signal conditioning, leveraging the device's logic elements and high I/O count.
• Peripheral and Interface Bridging — Protocol bridging and signal adaptation using the flexible I/O buffers, many I/O pins, and hardened SPI/I²C IP blocks.
• Control and Sequencing — On-board control functions, state machines, and timing using embedded RAM, timers/counters, and on-chip oscillators for deterministic control tasks.
• Configuration-Dependent Systems — Designs that benefit from non-volatile, multi-time programmable configuration to simplify system boot and field updates without external configuration memory.

Unique Advantages

• Compact, Reprogrammable Integration: Combines logic, embedded RAM, and hardened IP in a single 324-LFBGA package to reduce BOM and board area.
• High I/O Density: 279 available I/O pins enable direct interfacing to multiple peripherals and sensors without additional multiplexing hardware.
• Non-volatile Configuration: Multi-time programmable on-chip configuration removes the need for external configuration PROM and simplifies system startup.
• Flexible Power and Clocking: Integrated on-chip oscillator and PLLs provide local clocking options and power-saving modes referenced in the family datasheet.
• Commercial Temperature and Supply Flexibility: Rated for 0 °C to 85 °C operation and a wide VCC range (2.375 V–3.465 V) to match common board power rails.
• Embedded Peripheral IP: Hardened I²C/SPI and timer/counter functions reduce design effort for common control and interface tasks.

Why Choose LCMXO3L-2100C-6BG324C?

The LCMXO3L-2100C-6BG324C positions itself as a versatile, commercial-grade FPGA for mid-density logic tasks where non-volatile configuration, a high I/O count, and compact board-level integration are important. Its combination of 2,112 logic elements, embedded RAM, hardened peripheral IP, and flexible I/O makes it suitable for designers who need reprogrammable logic to replace glue logic, implement interface bridging, or consolidate control functions.

Engineers looking for a scalable MachXO3 family solution will find this part aligns with moderate logic and memory needs while offering system-level conveniences described in the MachXO3 family datasheet (on-chip clocking, configuration features, and embedded IP). The 324-LFBGA package and surface-mount mounting support compact PCB layouts and robust assembly processes.

If you would like a quote or pricing information for the LCMXO3L-2100C-6BG324C, please submit your request and include required quantities and delivery timeframe for a prompt response.