LCMXO3L-2100C-6BG256C

The LCMXO3L-2100C-6BG256C is a MachXO3 family FPGA from Lattice Semiconductor designed for commercial embedded designs that require flexible I/O, on-chip configuration and modest logic and memory resources. It combines a multi-time programmable, non-volatile architecture with integrated I/O features and on-chip memory to support interface bridging, system control and embedded peripheral handling.

This device is delivered in a 256‑LFBGA package with surface-mount mounting, supports a 2.375 V to 3.465 V supply range, and operates across a commercial temperature range of 0 °C to 85 °C, making it suitable for a wide range of commercial electronic applications.

Key Features

• Logic  Approximately 2,112 logic elements organized across 264 logic blocks for implementing glue logic, state machines and small-to-medium combinational/sequential functions.
• Embedded Memory  Approximately 0.076 Mbits of embedded RAM (75,776 total bits) for buffering, FIFOs and small data stores.
• I/O Density & Package  206 programmable I/O pins in a compact 256‑LFBGA (supplier package listed as 256‑CABGA, 14×14 mm) surface-mount package.
• Non-volatile, Multi-time Programmable Configuration  On-chip non-volatile configuration enables field reprogramming and retains configuration without external configuration memory.
• Flexible On-Chip Clocking  sysCLOCK PLLs and on-chip oscillator provide flexible clocking and timing options for system-level designs.
• High-performance, Flexible I/O  Pre‑engineered source-synchronous I/O and programmable I/O cells enable robust interface support and signal conditioning at the I/O boundary.
• Embedded Hardened IP  Includes hardened peripheral IP elements noted in the family data sheet (examples include I2C and SPI cores and timer/counter functions) to simplify peripheral interfacing and control tasks.
• System and Power Options  Standby mode, power saving options and TransFR reconfiguration capabilities are included in the MachXO3 family architecture.
• Testability and Reliability  Features such as IEEE 1149.1-compliant boundary-scan and hot-socketing behavior are documented in the family data sheet for system-level test and maintenance.
• Compliance  RoHS compliant; commercial grade device (0 °C to 85 °C).

Typical Applications

• Interface bridging and glue logic  Use the device’s 206 programmable I/Os and flexible I/O buffers to implement protocol translation, bus interfacing and board-level glue logic.
• Peripheral protocol handling  Embedded hardened I2C/SPI IP and programmable logic let the device manage sensor and peripheral interfaces without adding discrete controller ICs.
• System control and configuration  Non-volatile, multi-time programmable configuration and User Flash Memory support retained device settings, configuration sequencing and field updates.
• Timing and data buffering  On-chip RAM and sysCLOCK PLLs provide buffering and clocking resources for small FIFOs, data alignment and timing-critical interface designs.

Unique Advantages

• High I/O count in a compact package: 206 I/Os in a 256‑LFBGA (14×14) provide substantial interface density for space-constrained boards.
• Integrated non-volatile configuration: Multi-time programmable on-chip configuration eliminates the mandatory external configuration flash for many designs.
• Embedded peripheral IP: Hardened I2C, SPI and timer/counter blocks reduce the need for external peripheral controllers and simplify firmware.
• Flexible clocking and reconfiguration: sysCLOCK PLLs and TransFR reconfiguration let you tailor clocking and update device logic in the field.
• Power and test features: Standby and power saving modes plus IEEE 1149.1 boundary-scan support ease system power management and manufacturing test.
• Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C and RoHS compliant for broad commercial deployment.

Why Choose LCMXO3L-2100C-6BG256C?

The LCMXO3L-2100C-6BG256C delivers a balanced mix of programmable logic, embedded memory and high-density I/O in a compact, surface-mount 256‑LFBGA package. Its non-volatile, multi-time programmable architecture and embedded peripheral IP make it well suited for commercial embedded systems that require reliable interface handling, configuration retention and modest on-chip resources.

As a member of the MachXO3 family, the device provides system-level features such as flexible clocking, reconfiguration options and testability features that help streamline board integration and system bring-up for applications needing interface bridging, peripheral control and system management.

Request a quote or submit a quote for LCMXO3L-2100C-6BG256C to check current availability and pricing for your design.