LCMXO3L-2100C-5BG324C

The LCMXO3L-2100C-5BG324C is a MachXO3 family FPGA offering a balance of on-chip logic, I/O capacity and embedded memory for commercial applications. It combines reconfigurable logic resources with system-level peripherals and multi-time programmable configuration, aimed at designs that require flexible I/O, mid-range logic capacity and integrated system support.

With 2,112 logic elements, 279 I/O pins and approximately 75,776 bits of embedded memory, this surface-mount 324-LFBGA device supports a wide range of commercial embedded and system-control use cases where compact packaging and on-chip peripherals simplify board-level design.

Key Features

• Logic Capacity  2,112 logic elements and 264 CLBs provide mid-range programmable logic for glue logic, control and sequencing tasks.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM (sysMEM) for FIFOs, buffers and small data storage requirements.
• I/O Density  279 I/O pins support complex board-level interfacing and signal aggregation in a single device.
• On-chip Peripherals  Hardened IP including I²C and SPI cores, timer/counter functions and an on-chip oscillator simplify common system functions.
• Configuration & Reprogrammability  Non-volatile, multi-time programmable configuration with TransFR reconfiguration capabilities described in the MachXO3 family data sheet.
• Clocking & Timing  Integrated PLLs and flexible on-chip clocking resources support a variety of synchronous interfaces and timing architectures.
• Package & Mounting  324-LFBGA (supplier package: 324-CABGA, 15×15) in a surface-mount form factor for high-density PCB designs.
• Power & Operating Range  Supported supply range from 2.375 V to 3.465 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
• Standards & Compliance  RoHS-compliant component suitable for commercial production environments.

Typical Applications

• Interface consolidation  High I/O count and integrated peripherals make the device suitable for consolidating multiple board-level interfaces into a single package.
• Glue logic and system control  Mid-range logic capacity and embedded memory support control, sequencing and glue logic functions in commercial embedded systems.
• Protocol bridging and serial interfaces  Hardened I²C/SPI IP and flexible I/O buffering enable protocol bridging and peripheral interfacing tasks.
• Prototyping and development  Reprogrammable, non-volatile configuration and on-chip resources provide a practical platform for iterative development of commercial products.

Unique Advantages

• Balanced integration: Combines 2,112 logic elements, embedded RAM and 279 I/Os in a single 324-LFBGA package to reduce board complexity and BOM count.
• On-chip system IP: Hardened I²C and SPI cores plus timers and oscillator reduce need for discrete peripheral components.
• Reconfigurable, non-volatile design: Multi-time programmable configuration enables field updates and design iteration without external FLASH.
• Flexible clocking: Integrated PLLs and on-chip clock resources support a variety of synchronous interfaces, easing timing design.
• Commercial-grade reliability: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard production requirements.

Why Choose LCMXO3L-2100C-5BG324C?

This MachXO3 family FPGA is positioned for commercial embedded and system-control designs that need a practical combination of logic, memory and I/O in a compact surface-mount package. Its on-chip peripherals and non-volatile, reprogrammable configuration simplify system integration and reduce the need for external components.

Designers seeking a field-programmable solution for interface consolidation, glue logic, protocol bridging or iterative product development will find the LCMXO3L-2100C-5BG324C offers a verifiable balance of resources, package density and commercial-grade operating conditions.

Request a quote or submit a purchase inquiry to evaluate the LCMXO3L-2100C-5BG324C for your next commercial embedded design.