LCMXO3L-2100C-5BG256C

The LCMXO3L-2100C-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor designed as a non-volatile, multi-time programmable logic device for embedded system integration. It combines programmable logic, on-chip memory, and flexible I/O in a 256-LFBGA package to support glue logic, interface bridging, and system control functions in commercial-temperature applications.

With 2,112 logic elements, 75,776 bits of embedded RAM and 206 I/O pins, this device targets designs that need compact, reconfigurable logic and a broad I/O set while operating from a 2.375 V to 3.465 V supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• Core / Architecture  Non-volatile, multi-time programmable MachXO3 family FPGA architecture offering reconfigurable logic and on-chip system support as described in the MachXO3 family data sheet.
• Logic Capacity  2,112 logic elements suitable for glue logic, control functions and small- to medium-scale programmable logic tasks.
• Embedded Memory  75,776 bits of on-chip RAM for data buffering, state storage and small memory-mapped functions.
• I/O  206 user I/O pins to support broad peripheral connectivity and interface consolidation.
• Power & Supply  Operates from a 2.375 V to 3.465 V supply range to accommodate common system rail configurations.
• Package & Mounting  256-LFBGA (supplier device package: 256-CABGA 14×14) in a surface-mount form factor for compact PCB designs.
• Operating Grade & Temperature  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• System-Level Features (from MachXO3 family)  Family-level capabilities include programmable I/O buffering, on-chip clocking and PLLs, embedded hardened IP (I²C, SPI, timers), on-chip oscillator, standby/power-saving options, configuration and boundary-scan support as documented in the MachXO3 data sheet.
• Compliance  RoHS compliant.

Typical Applications

• Interface Bridging  Use the device’s 206 I/Os and reconfigurable logic to translate, aggregate or bridge between different digital interfaces on a compact PCB footprint.
• Glue Logic & System Control  Deploy the 2,112 logic elements and on-chip RAM to implement control sequencers, reset managers and peripheral glue logic in embedded systems.
• Peripheral and Sensor Hubs  Combine programmable I/O and embedded memory to manage multiple sensors, handle buffering and implement lightweight preprocessing close to the sensor domain.
• Prototyping and Low- to Mid-Volume Production  The MachXO3 non-volatile architecture supports iterative development and reprogramming without external configuration flash.

Unique Advantages

• Non-volatile, reprogrammable logic: Multi-time programmable MachXO3 family architecture enables field updates and iterative development without separate configuration storage.
• Compact integration: High I/O count (206 pins) and 2,112 logic elements in a 256-LFBGA package reduce board-level routing and BOM complexity for space-constrained designs.
• Embedded memory for buffering: 75,776 bits of on-chip RAM provide local storage for FIFOs, small tables or temporary buffers, lowering external memory requirements.
• Flexible supply compatibility: Broad supply range (2.375 V–3.465 V) accommodates common system rails and simplifies power supply design.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match mainstream commercial electronics deployments.
• Eco- and compliance-ready: RoHS compliance supports environmental and regulatory requirements in many production environments.

Why Choose LCMXO3L-2100C-5BG256C?

The LCMXO3L-2100C-5BG256C offers a combination of non-volatile reprogrammability, a substantial I/O complement and embedded memory in a compact 256-LFBGA package—designed for engineers who need flexible, updatable logic without added configuration components. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of mainstream embedded and interface-control designs.

This device is well suited for design teams requiring field-updatable logic, moderate logic density, and a large number of I/Os while keeping board area and BOM count low. The MachXO3 family-level features described in the datasheet (programmable I/O, on-chip clocking/PLLs, hardened peripheral IP and power-saving modes) support practical system-level integration and iterative development.

Request a quote or submit an inquiry to receive pricing, availability and support information for the LCMXO3L-2100C-5BG256C. Our team can provide procurement and technical details to help you move from evaluation to production.