LCMXO3L-2100C-6BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 235 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3L-2100C-6BG256I – MachXO3 FPGA, 2,112 logic elements
The LCMXO3L-2100C-6BG256I is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a compact, non-volatile programmable logic device with 2,112 logic elements, approximately 75,776 bits of embedded RAM, and up to 206 user I/Os for flexible system integration.
Designed for industrial applications, this surface-mount 256-LFBGA (256-CABGA, 14×14) device supports a 2.375 V to 3.465 V supply range and an operating temperature range of −40 °C to 100 °C, delivering configuration flexibility, embedded peripherals, and system-level support for a wide range of control and interface tasks.
Key Features
- Programmable Logic Core 2,112 logic elements with an architecture from the MachXO3 family, suitable for implementing glue logic, state machines, and configurable control paths.
- Embedded Memory Approximately 75,776 bits of on-chip RAM (sysMEM embedded block RAM) for buffering, FIFOs, and small data stores.
- I/O Capacity & Flexibility Up to 206 user I/Os with pre‑engineered source synchronous I/O and flexible I/O buffering to support diverse interface requirements.
- Non-volatile, Multi-time Programmable On-chip non-volatile configuration storage enabling multiple reprogramming cycles and persistent configuration on power-up.
- On-chip Peripherals & Hardened IP Family features include embedded hardened IP such as I²C and SPI cores and timer/counter functionality, plus an on-chip oscillator and PLLs for clocking needs.
- System Reliability & Power Options Features listed in the MachXO3 family include standby mode and power-saving options, power-on-reset, and support for hot socketing behaviors.
- Package & Temperature 256-LFBGA (supplier package 256-CABGA, 14×14) surface-mount package rated for industrial operation from −40 °C to 100 °C and RoHS compliance.
- Supply Voltage Range Operates from 2.375 V to 3.465 V, enabling use across common single-supply system rails.
Typical Applications
- Interface Bridging Use the device’s flexible I/O and hardened serial/peripheral IP to implement protocol translation and interface bridging between subsystems.
- System Control & Sequencing Implement control logic, state machines, and supervisory functions using the programmable logic core and embedded timers/counters.
- I/O Expansion & Buffering Leverage up to 206 I/Os and embedded RAM for GPIO expansion, buffering, and small FIFO implementations in embedded systems.
- Configuration & Security Functions Non-volatile, multi-time programmable configuration storage supports persistent device configuration and in-field updates.
Unique Advantages
- Compact, High‑I/O Package: 256-LFBGA (14×14) package provides a dense footprint with up to 206 I/Os for space-constrained designs.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to meet industrial environmental requirements.
- Integrated Memory Resources: Approximately 75,776 bits of embedded RAM simplify buffering and FIFO implementations without external memory.
- Non-volatile Configuration: Multi-time programmable, on-chip non-volatile storage removes the need for an external configuration memory for persistent boot-up behavior.
- Rich System-Level Features: Family-level features such as PLLs, on-chip oscillator, hardened I²C/SPI IP, and power-saving modes reduce external component count and speed time-to-market.
- Wide Supply Range: 2.375 V to 3.465 V operation supports integration with common system supply rails.
Why Choose LCMXO3L-2100C-6BG256I?
The LCMXO3L-2100C-6BG256I positions itself as a flexible, non-volatile FPGA solution within the MachXO3 family—providing a balance of logic density, embedded memory, and high I/O count in a compact 256-LFBGA package. Its industrial temperature rating and supply voltage flexibility make it suitable for industrial control, interface bridging, and system management roles where persistent configuration and reliable operation are required.
Family features such as embedded hardened IP, on-chip clocking (PLLs and oscillator), standby and power-saving options, and an available low-cost migration path across the MachXO3 family support scalable designs and application portability across related devices.
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