LCMXO3L-2100E-5MG121C

The LCMXO3L-2100E-5MG121C is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for compact, low-power system control and interface tasks. It combines a matrix of programmable logic with embedded memory, flexible on-chip clocking and hardened peripheral IP to address a range of commercial embedded applications.

With 2,112 logic elements, approximately 75.8 kbits of embedded RAM (75,776 total RAM bits), and 100 I/O, this surface-mount 121‑VFBGA (6×6) package offers a balance of integration and small form factor for designs that require configurable glue logic, protocol adaptation and system-level integration within a commercial temperature range.

Key Features

• Core Logic — 2,112 logic elements provide the programmable fabric for custom logic, state machines and glue logic integration.
• Embedded Memory — Approximately 75.8 kbits of on-chip RAM (75,776 total RAM bits) for FIFOs, buffers and small data storage close to logic.
• I/O and Interfaces — 100 user I/O pins support a variety of interface implementations; datasheet describes pre‑engineered source synchronous I/O and flexible I/O buffering options.
• Clocking and Timing — Flexible on‑chip clocking with sysCLOCK PLLs and distribution network for synchronized designs and managed clock domains.
• Hardened IP — Embedded hardened functions noted in the family datasheet including I2C, SPI and timer/counter primitives for offloading common serial and timing tasks.
• Non‑volatile Configuration — MachXO3 family supports non‑volatile, multi‑time programmable configuration and TransFR reconfiguration capability as described in the datasheet.
• Package and Power — 121‑VFBGA (CSPBGA) 6×6 supplier package; core voltage supply 1.14 V to 1.26 V; surface‑mount mounting type.
• Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C and RoHS‑compliant construction for standard commercial applications.
• System Features — On‑chip oscillator, user flash memory (UFM), standby and power saving options, and support for boundary scan and device configuration as outlined in the datasheet.

Typical Applications

• Interface Bridging and Glue Logic — Implement protocol adapters, bus bridging and custom control logic using the programmable fabric and 100 I/O pins.
• Embedded Control and Sequencing — Use the logic elements, timers and on‑chip memory for system management, state machines and control tasks.
• Peripheral Aggregation — Hardened I2C/SPI IP and flexible I/O make the device suitable for aggregating sensors, actuators and serial peripherals.
• Low‑profile, High‑integration Designs — The 6×6 121‑VFBGA package enables compact board layouts where small package size and surface‑mount mounting are required.

Unique Advantages

• Highly configurable logic density: 2,112 logic elements provide the capacity to consolidate discrete glue logic and small SoC functions into a single device, reducing BOM complexity.
• Embedded memory on‑chip: Approximately 75.8 kbits of RAM supports FIFOs and local buffering without external memory, simplifying board design.
• Flexible I/O and clocking: 100 I/O and on‑chip PLLs allow designers to implement multiple interfaces and synchronized data paths within a compact solution.
• Pre‑hardened peripherals: Built‑in I2C, SPI and timer/counter primitives reduce development time by providing common functions in hardware.
• Non‑volatile configuration: Multi‑time programmable non‑volatile configuration and TransFR reconfiguration enable field updates and flexible deployment scenarios.
• Compact, RoHS‑compliant package: The 121‑VFBGA (6×6) package and surface‑mount construction fit space‑constrained commercial designs and meet RoHS requirements.

Why Choose LCMXO3L-2100E-5MG121C?

The LCMXO3L-2100E-5MG121C delivers a practical combination of programmable logic, embedded memory and hardened peripheral IP in a small 121‑VFBGA package. Its electrical and thermal specifications—1.14–1.26 V core supply and 0 °C to 85 °C operating range—make it well suited to commercial embedded systems that require on‑board configurability and interface consolidation.

For teams designing compact controllers, interface bridges or peripheral aggregators, this MachXO3 device offers an integrated route to reduce component count and speed development, backed by the family-level features documented in the MachXO3 datasheet.

If you would like pricing, availability or to request a quote for the LCMXO3L-2100E-5MG121C, please submit your request and our team will respond with a formal quote and lead‑time information.