LCMXO3L-2100E-5MG324C

The LCMXO3L-2100E-5MG324C is a MachXO3 family FPGA offering a non-volatile, multi-time programmable architecture tailored for commercial applications. It combines a compact logic fabric with embedded memory and a high I/O count in a 324-VFBGA package.

Designed for system control, interface integration and on-board logic consolidation, this device delivers flexible I/O, on-chip memory and hardened peripheral IP to simplify embedded designs while supporting field reprogramming and configuration features documented in the MachXO3 family datasheet.

Key Features

• Logic Capacity  Approximately 2,112 logic elements (cells) for implementing glue logic, control functions and moderate-density finite state machines.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM (sysMEM embedded block RAM) for small data buffers, FIFOs and local storage.
• I/O Density  268 programmable I/O pins, enabling broad peripheral connectivity and signal routing on dense PCBs.
• Package & Mounting  324-VFBGA (supplier device package: 324-CSFBGA 10×10) designed for surface-mount assembly.
• Power  Core voltage support from 1.14 V to 1.26 V as specified for device operation.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C (commercial temperature range).
• Non-volatile, Multi-time Programmable  On-chip non-volatile configuration that supports multiple reprogramming cycles for field updates and design iteration.
• Embedded Hardened IP  Includes hardened I2C and SPI IP cores plus a timer/counter block as described in the MachXO3 family documentation to accelerate common peripheral tasks.
• Clocking & Reconfiguration  Flexible on-chip clocking with PLLs and TransFR reconfiguration options referenced in the family datasheet for dynamic system integration.
• System-level Features  Programmable I/O cells, source synchronous I/O support, on-chip oscillator, hot-socketing considerations and user flash memory (UFM) capabilities detailed in the datasheet.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Interface Bridging and Protocol Glue  Leverage the device’s high I/O count and hardened SPI/I2C IP to implement protocol translation and peripheral bridging on compact boards.
• System Control and Sequencing  Use the logic fabric, timers and on-chip memory for control logic, startup sequencing and state-machine implementations.
• Local Buffering and FIFO Functions  Embedded block RAM and FIFO modes enable small buffering and data handling close to peripherals.
• Field-Upgradeable Logic  Non-volatile multi-time programmability and UFM support enable in-field updates and configuration storage without external configuration PROMs.

Unique Advantages

• Compact, Integrated Solution:  Combines logic, embedded RAM and a high pin count in a single 324-VFBGA package to reduce external components and PCB area.
• Field Reprogrammability:  Non-volatile, multi-time programmable architecture supports design updates and iterative development without replacing hardware.
• Hardened Peripheral IP:  Built-in I2C and SPI cores plus timer/counter blocks reduce development time for common interface and control tasks.
• Flexible Clocking and I/O:  On-chip PLLs, programmable I/O cells and source-synchronous I/O options provide design flexibility for timing-critical interfaces.
• Commercial-Grade Reliability:  Specified operating range of 0 °C to 85 °C and RoHS compliance make it suitable for mainstream commercial electronic products.

Why Choose LCMXO3L-2100E-5MG324C?

The LCMXO3L-2100E-5MG324C positions itself as a versatile, compact FPGA for commercial embedded designs that require programmable logic, embedded memory and extensive I/O in a single, non-volatile device. Its MachXO3 family features—such as multi-time programmability, hardened peripheral IP and flexible clocking—help streamline board-level integration and accelerate time-to-market.

This device is well suited to engineers and procurement teams looking for a reliable, field-upgradeable FPGA option for control, interface and buffering roles where commercial temperature operation and a 324-VFBGA footprint meet project requirements.

Request a quote or submit a procurement inquiry to check availability and pricing for the LCMXO3L-2100E-5MG324C.