LCMXO3L-2100E-5UWG49CTR50

IC FPGA 38 I/O 49WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 38 75776 2112 49-UFBGA, WLCSP

Quantity 642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package49-WLCSP (3.11x3.19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case49-UFBGA, WLCSPNumber of I/O38Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3L-2100E-5UWG49CTR50 – MachXO3 Field Programmable Gate Array, 2112 logic elements, 38 I/Os, 49-WLCSP

The LCMXO3L-2100E-5UWG49CTR50 is a MachXO3 family Field Programmable Gate Array (FPGA) in a compact 49‑ball WLCSP / UFBGA package. It combines a flexible FPGA architecture with non-volatile, multi-time programmable configuration and on-chip system features to address compact, low-voltage embedded designs.

With 2,112 logic elements, approximately 0.076 Mbits of embedded RAM and 38 I/O, this device is suited to small form-factor applications that require on-chip memory, programmable I/O and integrated system-level functions while operating from a 1.14–1.26 V supply within commercial temperature limits.

Key Features

  • Core Capacity — 2,112 logic elements providing a modest FPGA fabric for glue logic, protocol bridging and control functions.
  • Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for small buffers, FIFOs and state storage.
  • I/O and Packaging — 38 programmable I/Os in a 49‑ball WLCSP (3.11 × 3.19 mm) surface‑mount package for space‑constrained designs.
  • Non-volatile Configuration — Multi-time programmable, non-volatile configuration capability (MachXO3 family feature) for in-system reconfiguration and persistent boot behavior.
  • Clocking and PLLs — Flexible on-chip clocking with phase‑locked loop support as part of the MachXO3 architecture for stable clock generation and domain management.
  • On-chip Peripherals — Hardened IP building blocks referenced in the MachXO3 family including I²C, SPI and timer/counter functions to reduce external components.
  • System and Power Options — On‑chip oscillator, User Flash Memory (UFM), standby mode and power‑saving options documented for the MachXO3 family to support low-power system states.
  • Supply and Temperature — Operates from 1.14 V to 1.26 V and rated for commercial temperature operation from 0 °C to 85 °C.
  • Standards and Compliance — RoHS‑compliant lead‑free manufacturing.

Typical Applications

  • Consumer and IoT Devices — Compact interface logic, sensor aggregation and peripheral control where small package size and non‑volatile configuration are important.
  • Communications Peripherals — Protocol bridging, level translation and I/O adaptation using on‑chip memory and programmable I/O resources.
  • Embedded System Control — Board-level control, reset sequencing and custom state machines leveraging the device’s logic elements and embedded timers.
  • Compact Module Integration — Space-constrained modules and mezzanine cards that benefit from the 49‑ball WLCSP package and surface-mount mounting type.

Unique Advantages

  • Non-volatile, reprogrammable logic: Multi-time programmable configuration retains designs without external configuration memory and enables in-field updates.
  • Small footprint packaging: 49‑ball WLCSP (3.11 × 3.19 mm) provides a high-density, surface-mount solution for constrained PCB real estate.
  • Integrated system features: On-chip oscillator, UFM, hardened I²C/SPI and timers reduce BOM and simplify board-level integration.
  • Low-voltage operation: Narrow supply range (1.14–1.26 V) suitable for low-voltage system rails and power domains.
  • Right-sized capacity: 2,112 logic elements and ~0.076 Mbits of RAM deliver sufficient resources for control, interfacing and modest data buffering without excess die area.
  • Commercial grade: Rated for 0 °C to 85 °C operation to match typical consumer and general-purpose embedded use cases.

Why Choose LCMXO3L-2100E-5UWG49CTR50?

This MachXO3 device positions itself as a compact, non‑volatile FPGA option for designs that require modest logic capacity, integrated peripherals and a very small package footprint. Its combination of programmable logic, embedded RAM and hardened IP functions supports consolidation of glue logic and peripheral interfaces while reducing external components.

Choose this part for board-level designs and module integrations where low-voltage operation, RoHS compliance and a commercial operating temperature range meet product requirements and where compact WLCSP packaging is a priority.

If you would like pricing, availability or to submit a purchase request for LCMXO3L-2100E-5UWG49CTR50, request a quote or send an inquiry to begin the procurement process.

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