LCMXO3L-2100E-5UWG49ITR50

IC FPGA 38 I/O 49WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 38 75776 2112 49-UFBGA, WLCSP

Quantity 760 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package49-WLCSP (3.11x3.19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case49-UFBGA, WLCSPNumber of I/O38Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3L-2100E-5UWG49ITR50 – MachXO3 Field Programmable Gate Array, 49‑WLCSP

The LCMXO3L-2100E-5UWG49ITR50 is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a compact, non-volatile FPGA fabric with embedded memory and programmable I/O intended for system-level integration and control functions.

Targeted at industrial applications, this device combines 2,112 logic elements, approximately 0.076 Mbits of embedded RAM, 38 I/O pins, and a 49‑ball WLCSP package to deliver a small-footprint, reprogrammable building block for control, interface, and glue-logic tasks. It operates over a 1.14–1.26 V supply range and an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  2,112 logic elements provide the programmable fabric for custom glue logic, state machines, and simple accelerators.
  • Embedded Memory  Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for FIFOs, buffers, and small data stores.
  • I/O and Interfaces  38 programmable I/O pins in flexible I/O banks support a range of system interfacing needs.
  • Non-volatile Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration for in-system updates.
  • Hardened IP and System Blocks  Family-level features listed in the datasheet include hardened I²C and SPI IP cores, timers/counters, on-chip oscillator, PLLs, and user flash memory (UFM) to reduce external component count.
  • Package & Mounting  49‑WLCSP (3.11 × 3.19 mm) surface-mount package for compact PCB integration and minimal board area.
  • Power  Supported supply voltage range: 1.14 V to 1.26 V, enabling compatibility with common low-voltage system rails.
  • Industrial Temperature Grade  Guaranteed operation from −40 °C to 100 °C for industrial environments.
  • Standards and Testability  Family documentation includes features for device configuration, boundary-scan testability, and power-saving/standby options.
  • Compliance  RoHS compliant for regulatory environmental requirements.

Typical Applications

  • Industrial Control  Small programmable logic for control, sequencing, and glue logic in factory automation and instrumentation systems.
  • Sensor and Interface Aggregation  Aggregating and conditioning sensor signals or bridging interfaces where moderate logic and embedded RAM are required.
  • Board-Level Glue Logic  Replacing discrete logic and microcontroller peripherals to simplify BOM and consolidate control functions.
  • Embedded System Integration  Implementing custom finite state machines, protocol adapters, and I/O control in compact, low‑power sectors of a design.

Unique Advantages

  • Compact, low‑profile package: The 49‑WLCSP (3.11 × 3.19 mm) package minimizes PCB area for space-constrained designs.
  • Non‑volatile, in‑system programmability: MachXO3 family configuration is multi-time programmable and supports in-field updates via TransFR reconfiguration.
  • Integrated system IP: Hardened I²C, SPI, timers, PLLs, oscillator, and UFM reduce the need for external peripherals and simplify design.
  • Industrial temperature range: −40 °C to 100 °C operation supports deployments in demanding ambient conditions.
  • Right‑sized resources for control tasks: 2,112 logic elements and 75,776 bits of embedded RAM balance capability and cost for glue-logic and interface tasks.
  • Low-voltage operation: 1.14–1.26 V supply compatibility aligns with modern low-voltage system rails.

Why Choose LCMXO3L-2100E-5UWG49ITR50?

The LCMXO3L-2100E-5UWG49ITR50 delivers a practical mix of programmable logic, on-chip memory, and flexible I/O in a compact WLCSP package, making it suitable for industrial embedded designs that need reprogrammable control and interface logic without a large PCB footprint. Its family-level features—non-volatile configuration, hardened peripheral IP, clocking resources, and power management options—help reduce external components and simplify system architectures.

This part is well suited to engineers and procurement teams looking for a small, industrial-grade FPGA building block for board-level glue logic, protocol bridging, sensor aggregation, and other system control tasks where programmability and compact integration are priorities.

Request a quote or submit an inquiry for pricing and availability to evaluate the LCMXO3L-2100E-5UWG49ITR50 for your next design.

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