LCMXO3L-2100E-5UWG49ITR50
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 38 75776 2112 49-UFBGA, WLCSP |
|---|---|
| Quantity | 760 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 49-WLCSP (3.11x3.19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 49-UFBGA, WLCSP | Number of I/O | 38 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3L-2100E-5UWG49ITR50 – MachXO3 Field Programmable Gate Array, 49‑WLCSP
The LCMXO3L-2100E-5UWG49ITR50 is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a compact, non-volatile FPGA fabric with embedded memory and programmable I/O intended for system-level integration and control functions.
Targeted at industrial applications, this device combines 2,112 logic elements, approximately 0.076 Mbits of embedded RAM, 38 I/O pins, and a 49‑ball WLCSP package to deliver a small-footprint, reprogrammable building block for control, interface, and glue-logic tasks. It operates over a 1.14–1.26 V supply range and an industrial temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 2,112 logic elements provide the programmable fabric for custom glue logic, state machines, and simple accelerators.
- Embedded Memory Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for FIFOs, buffers, and small data stores.
- I/O and Interfaces 38 programmable I/O pins in flexible I/O banks support a range of system interfacing needs.
- Non-volatile Configuration MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration for in-system updates.
- Hardened IP and System Blocks Family-level features listed in the datasheet include hardened I²C and SPI IP cores, timers/counters, on-chip oscillator, PLLs, and user flash memory (UFM) to reduce external component count.
- Package & Mounting 49‑WLCSP (3.11 × 3.19 mm) surface-mount package for compact PCB integration and minimal board area.
- Power Supported supply voltage range: 1.14 V to 1.26 V, enabling compatibility with common low-voltage system rails.
- Industrial Temperature Grade Guaranteed operation from −40 °C to 100 °C for industrial environments.
- Standards and Testability Family documentation includes features for device configuration, boundary-scan testability, and power-saving/standby options.
- Compliance RoHS compliant for regulatory environmental requirements.
Typical Applications
- Industrial Control Small programmable logic for control, sequencing, and glue logic in factory automation and instrumentation systems.
- Sensor and Interface Aggregation Aggregating and conditioning sensor signals or bridging interfaces where moderate logic and embedded RAM are required.
- Board-Level Glue Logic Replacing discrete logic and microcontroller peripherals to simplify BOM and consolidate control functions.
- Embedded System Integration Implementing custom finite state machines, protocol adapters, and I/O control in compact, low‑power sectors of a design.
Unique Advantages
- Compact, low‑profile package: The 49‑WLCSP (3.11 × 3.19 mm) package minimizes PCB area for space-constrained designs.
- Non‑volatile, in‑system programmability: MachXO3 family configuration is multi-time programmable and supports in-field updates via TransFR reconfiguration.
- Integrated system IP: Hardened I²C, SPI, timers, PLLs, oscillator, and UFM reduce the need for external peripherals and simplify design.
- Industrial temperature range: −40 °C to 100 °C operation supports deployments in demanding ambient conditions.
- Right‑sized resources for control tasks: 2,112 logic elements and 75,776 bits of embedded RAM balance capability and cost for glue-logic and interface tasks.
- Low-voltage operation: 1.14–1.26 V supply compatibility aligns with modern low-voltage system rails.
Why Choose LCMXO3L-2100E-5UWG49ITR50?
The LCMXO3L-2100E-5UWG49ITR50 delivers a practical mix of programmable logic, on-chip memory, and flexible I/O in a compact WLCSP package, making it suitable for industrial embedded designs that need reprogrammable control and interface logic without a large PCB footprint. Its family-level features—non-volatile configuration, hardened peripheral IP, clocking resources, and power management options—help reduce external components and simplify system architectures.
This part is well suited to engineers and procurement teams looking for a small, industrial-grade FPGA building block for board-level glue logic, protocol bridging, sensor aggregation, and other system control tasks where programmability and compact integration are priorities.
Request a quote or submit an inquiry for pricing and availability to evaluate the LCMXO3L-2100E-5UWG49ITR50 for your next design.