LCMXO3L-2100E-5UWG49ITR1K

The LCMXO3L-2100E-5UWG49ITR1K is a MachXO3 family FPGA in a compact 49‑WLCSP (3.11 × 3.19 mm) package designed for industrial applications. It provides a flexible, non-volatile FPGA fabric with approximately 2,112 logic elements, 75,776 bits of embedded RAM, and 38 general‑purpose I/O, enabling on‑board glue logic, protocol bridging and control functions within space-constrained systems.

Configured to operate across an industrial temperature range (−40 °C to 100 °C) and a core supply window of 1.14 V to 1.26 V, this device targets robust embedded designs that require multi-time programmable, non-volatile configuration and compact advanced packaging.

Key Features

• Core Capacity  Approximately 2,112 logic elements provide the programmable fabric for implementing control logic, state machines, and small to medium glue logic functions.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM support small FIFOs, buffers, and temporary data storage for deterministic on‑chip processing.
• I/O Flexibility  38 I/Os with a flexible I/O buffer architecture and pre‑engineered source‑synchronous I/O options for interfacing to external peripherals and buses.
• Non‑volatile, Multi‑time Programmable  MachXO3 family support for non‑volatile configuration and multi‑time programmability simplifies field updates and configuration management.
• Clocking and Timing  On‑chip clocking features including PLLs enable flexible clock management for local timing domains and source‑synchronous interfaces.
• Embedded IP and System Support  Family documentation describes hardened IP blocks such as I²C and SPI controllers, timers/counters, on‑chip oscillator, and user flash memory (UFM) to accelerate system integration.
• Advanced Packaging  49‑WLCSP (3.11 × 3.19 mm) supplier device package provides a compact footprint for space-constrained boards.
• Industrial Grade Operation  Specified operating temperature from −40 °C to 100 °C to meet industrial environment requirements.
• Power and Configuration  Core supply recommended range of 1.14 V to 1.26 V with family features for safe power sequencing, power‑on reset, and power‑saving standby modes described in the datasheet.
• Design for Test and Reliability  IEEE 1149.1‑compliant boundary scan testability and on‑chip configuration/test features facilitate manufacturing test and in-system validation.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature rating, compact package, and flexible I/O to implement local control logic, interface translation, and sensor aggregation in factory and process environments.
• Embedded Glue Logic  Deploy as protocol bridging, bus glue, and bespoke logic functions where a small non‑volatile FPGA with modest logic and RAM is required.
• Interface and Timing Management  Implement source‑synchronous interfaces, clock domain crossing, and local clocking/PLL functions to manage timing between on‑board subsystems.

Unique Advantages

• Highly integrated, compact footprint: The 49‑WLCSP package (3.11 × 3.19 mm) reduces board space while providing the necessary I/O and logic for small embedded tasks.
• Non‑volatile, field‑reprogrammable: Multi‑time programmability and non‑volatile configuration simplify field updates and reduce the need for external configuration memory.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation to support deployment in demanding environmental conditions.
• On‑chip system features: Hardened IP blocks (I²C, SPI, timers), on‑chip oscillator, PLLs and UFM described in the family datasheet accelerate system integration and reduce BOM count.
• Design‑for‑test support: Boundary scan and documented configuration/test mechanisms enable predictable manufacturing test and in‑system diagnostics.

Why Choose LCMXO3L-2100E-5UWG49ITR1K?

The LCMXO3L-2100E-5UWG49ITR1K positions itself as a compact, industrial‑rated non‑volatile FPGA well suited for embedded designs that need reliable control, interface bridging, and small‑scale programmable logic in a space‑constrained package. Its combination of approximately 2,112 logic elements, 75,776 bits of embedded RAM, flexible I/O and family‑level embedded IP provides a balanced solution for designers seeking on‑board programmability with industrial temperature capability.

Backed by the MachXO3 family architecture and documented system features (clocking, configuration, testability and power management), this device delivers a scalable building block for designs that require field reprogrammability, reduced external components and predictable production testability.

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