LCMXO3L-2100E-6MG121C

IC FPGA 100 I/O 121CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA

Quantity 969 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package121-CSFBGA (6x6)GradeCommercialOperating Temperature0°C – 85°C
Package / Case121-VFBGA, CSPBGANumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3L-2100E-6MG121C – MachXO3 Field Programmable Gate Array (FPGA), 100 I/O, 2,112 LEs

The LCMXO3L-2100E-6MG121C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It delivers a compact, non-volatile programmable fabric with 2,112 logic elements, approximately 75,776 bits of embedded RAM, and up to 100 I/O pins in a 121-ball VFBGA (6×6 mm) surface-mount package.

Designed for commercial electronics and system glue logic, this device combines flexible on-chip resources and configuration features suited to I/O bridging, control and interface tasks where compact packaging and reprogrammability are required.

Key Features

  • Logic and Fabric  Approximately 2,112 logic elements organized across 264 logic blocks, providing a compact programmable fabric for control, glue logic, and peripheral integration.
  • On-chip Memory  About 75,776 bits of embedded RAM for FIFOs, small data buffers, and local storage requirements.
  • I/O Capability  Up to 100 user I/Os with support for pre‑engineered source‑synchronous I/O and flexible I/O buffering as described in the MachXO3 family documentation.
  • Non-volatile Configuration  MachXO3 family-level features include non-volatile, multi-time programmable configuration and TransFR reconfiguration to simplify in-field updates.
  • Embedded Peripherals and IP  Family datasheet references include hardened I²C and SPI IP cores, timers/counters, and on-chip oscillator resources for common peripheral needs.
  • Clocking  Flexible on-chip clocking and PLL resources are available per the MachXO3 family architecture for clock distribution and domain management.
  • Power and Supply  Specifies a core supply range of 1.14 V to 1.26 V and includes family-level power saving and standby mode options.
  • Package and Mounting  121-VFBGA (121-CSFBGA, 6×6 mm) surface-mount package; commercial grade with operating range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Consumer & Commercial Electronics  Use as system glue logic, peripheral aggregation, or user-interface control in compact, surface-mount designs.
  • I/O Bridging and Protocol Translation  Leverage flexible I/O and embedded IP to bridge between controllers, peripherals, and sensors in board-level designs.
  • Embedded Control and Timing  Utilize on-chip timers, PLLs, and the oscillator for control loops, event timing, and local clock management.

Unique Advantages

  • Compact, reprogrammable solution: With 2,112 logic elements and non-volatile configuration, the device provides reprogrammable logic in a small 6×6 mm package to minimize board area.
  • Ample I/O for board-level integration: Up to 100 I/Os enable versatile interfacing without large packages or external I/O expanders.
  • On-chip memory for buffering: Approximately 75,776 bits of embedded RAM support FIFOs and small data storage directly in the FPGA fabric.
  • Flexible clocking and peripheral support: Family-level PLLs, on-chip oscillator, and hardened I²C/SPI IP reduce external component count for many designs.
  • Commercial-grade temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for broad commercial applications.
  • Surface-mount 121-VFBGA packaging: Provides a high-density, solderable solution for automated assembly in space-constrained designs.

Why Choose LCMXO3L-2100E-6MG121C?

The LCMXO3L-2100E-6MG121C positions itself as a compact, reprogrammable building block for commercial designs that require flexible I/O, embedded memory, and non-volatile configuration in a small surface-mount package. Its combination of approximately 2,112 logic elements, ~75.8kbits of on-chip RAM, and 100 I/Os makes it well suited for board-level glue logic, interface bridging, and control functions.

As a member of the MachXO3 family from Lattice Semiconductor Corporation, the device inherits family-level features such as flexible on-chip clocking, hardened peripheral IP, and configuration options that help simplify design integration and in-field reconfiguration for evolving product requirements.

To request pricing or submit a quote for the LCMXO3L-2100E-6MG121C, please request a quote or contact sales through your usual procurement channel. Include the part number and required quantities for a prompt response.

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