LCMXO3L-2100E-6MG121C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 100 75776 2112 121-VFBGA, CSPBGA |
|---|---|
| Quantity | 969 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-CSFBGA (6x6) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-VFBGA, CSPBGA | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO3L-2100E-6MG121C – MachXO3 Field Programmable Gate Array (FPGA), 100 I/O, 2,112 LEs
The LCMXO3L-2100E-6MG121C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It delivers a compact, non-volatile programmable fabric with 2,112 logic elements, approximately 75,776 bits of embedded RAM, and up to 100 I/O pins in a 121-ball VFBGA (6×6 mm) surface-mount package.
Designed for commercial electronics and system glue logic, this device combines flexible on-chip resources and configuration features suited to I/O bridging, control and interface tasks where compact packaging and reprogrammability are required.
Key Features
- Logic and Fabric Approximately 2,112 logic elements organized across 264 logic blocks, providing a compact programmable fabric for control, glue logic, and peripheral integration.
- On-chip Memory About 75,776 bits of embedded RAM for FIFOs, small data buffers, and local storage requirements.
- I/O Capability Up to 100 user I/Os with support for pre‑engineered source‑synchronous I/O and flexible I/O buffering as described in the MachXO3 family documentation.
- Non-volatile Configuration MachXO3 family-level features include non-volatile, multi-time programmable configuration and TransFR reconfiguration to simplify in-field updates.
- Embedded Peripherals and IP Family datasheet references include hardened I²C and SPI IP cores, timers/counters, and on-chip oscillator resources for common peripheral needs.
- Clocking Flexible on-chip clocking and PLL resources are available per the MachXO3 family architecture for clock distribution and domain management.
- Power and Supply Specifies a core supply range of 1.14 V to 1.26 V and includes family-level power saving and standby mode options.
- Package and Mounting 121-VFBGA (121-CSFBGA, 6×6 mm) surface-mount package; commercial grade with operating range 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Consumer & Commercial Electronics Use as system glue logic, peripheral aggregation, or user-interface control in compact, surface-mount designs.
- I/O Bridging and Protocol Translation Leverage flexible I/O and embedded IP to bridge between controllers, peripherals, and sensors in board-level designs.
- Embedded Control and Timing Utilize on-chip timers, PLLs, and the oscillator for control loops, event timing, and local clock management.
Unique Advantages
- Compact, reprogrammable solution: With 2,112 logic elements and non-volatile configuration, the device provides reprogrammable logic in a small 6×6 mm package to minimize board area.
- Ample I/O for board-level integration: Up to 100 I/Os enable versatile interfacing without large packages or external I/O expanders.
- On-chip memory for buffering: Approximately 75,776 bits of embedded RAM support FIFOs and small data storage directly in the FPGA fabric.
- Flexible clocking and peripheral support: Family-level PLLs, on-chip oscillator, and hardened I²C/SPI IP reduce external component count for many designs.
- Commercial-grade temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for broad commercial applications.
- Surface-mount 121-VFBGA packaging: Provides a high-density, solderable solution for automated assembly in space-constrained designs.
Why Choose LCMXO3L-2100E-6MG121C?
The LCMXO3L-2100E-6MG121C positions itself as a compact, reprogrammable building block for commercial designs that require flexible I/O, embedded memory, and non-volatile configuration in a small surface-mount package. Its combination of approximately 2,112 logic elements, ~75.8kbits of on-chip RAM, and 100 I/Os makes it well suited for board-level glue logic, interface bridging, and control functions.
As a member of the MachXO3 family from Lattice Semiconductor Corporation, the device inherits family-level features such as flexible on-chip clocking, hardened peripheral IP, and configuration options that help simplify design integration and in-field reconfiguration for evolving product requirements.
To request pricing or submit a quote for the LCMXO3L-2100E-6MG121C, please request a quote or contact sales through your usual procurement channel. Include the part number and required quantities for a prompt response.

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