LCMXO3L-2100E-6MG324C

The LCMXO3L-2100E-6MG324C is a MachXO3 family Field Programmable Gate Array (FPGA) in a 324‑VFBGA surface‑mount package. It combines a flexible FPGA architecture with non‑volatile, multi‑time programmable configuration and a mix of embedded resources designed for low‑to‑mid density logic and I/O‑centric designs.

With 2,112 logic elements, 75,776 bits of embedded RAM, and 268 general‑purpose I/O pins, this device targets system glue logic, interface bridging, and compact designs that require a high I/O count, on‑chip memory, and low‑voltage operation in a commercial temperature range.

Key Features

• Logic Capacity — 2,112 logic elements and 264 logic array blocks provide a practical resource set for control, glue logic, and mid‑density FPGA functions.
• Embedded Memory — 75,776 bits of total RAM (approximately 0.076 Mbits) for buffering, FIFOs, and small data storage needs.
• High I/O Count — 268 I/O pins support dense peripheral interfaces and board‑level signal aggregation.
• Non‑volatile, Multi‑time Programmable Configuration — MachXO3 family configuration supports on‑board reprogramming and persistent configuration without external volatile memory.
• On‑chip System IP — Family datasheet documents embedded hardened IP including I²C and SPI cores, timers/counters, on‑chip oscillator, and PLL‑based clocking options for flexible system integration.
• Low‑Voltage Operation — Core supply specified from 1.14 V to 1.26 V to match low‑voltage system architectures.
• Packaging and Mounting — 324‑VFBGA (supplier package: 324‑CSFBGA, 10×10) in a surface‑mount form factor for compact PCB layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• Regulatory — RoHS compliant.

Typical Applications

• Interface and System Glue Logic — Use the 268 I/Os and 2,112 logic elements to aggregate, translate, and manage signals between multiple subsystems on a PCB.
• Protocol Bridging and Peripheral Interfaces — Embedded SPI and I²C IP plus flexible I/O make the device suitable for protocol adaptors and peripheral control.
• Embedded Buffering and FIFO Functions — 75,776 bits of on‑chip RAM can be used for small FIFOs, packet buffering, and temporary data storage.
• Prototyping and Low‑to‑Mid Density Designs — The combination of logic elements, memory, and plentiful I/O supports iterative development and deployment of compact FPGA solutions.

Unique Advantages

• Balanced Resource Mix: 2,112 logic elements together with embedded RAM and a high I/O count deliver a pragmatic balance for control and interfacing tasks without excessive device overhead.
• Persistent Configuration: Non‑volatile, multi‑time programmable configuration removes the need for external volatile configuration storage, simplifying BOM and system design.
• Compact, High‑I/O Package: The 324‑VFBGA package provides a dense I/O footprint in a compact surface‑mount form factor for space‑constrained PCBs.
• Integrated System IP: Hardened I²C, SPI, timers/counters, PLLs and on‑chip oscillator accelerate system development and reduce reliance on external components.
• Low‑Voltage Core: Core operation at 1.14–1.26 V aligns with modern low‑voltage power rails for efficient integration into contemporary designs.
• RoHS Compliant: Meets RoHS requirements to support environmentally conscious product designs.

Why Choose LCMXO3L-2100E-6MG324C?

The LCMXO3L-2100E-6MG324C positions itself as a capable MachXO3 family device for designers needing a compact, I/O‑rich FPGA with non‑volatile configuration and integrated system IP. Its mix of 2,112 logic elements, 75,776 bits of embedded RAM, and 268 I/Os makes it well suited to interface‑heavy and control applications where board‑level integration and persistent configuration are priorities.

This device is a solid choice for teams developing commercial‑grade products that require dependable FPGA functionality, straightforward configuration management, and a compact BGA footprint. The MachXO3 family feature set documented in the datasheet—PLLs, on‑chip oscillator, hardened interfaces, and flexible I/O—supports scalable designs and reduces external component count.

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