LCMXO3L-2100E-6MG324I

The LCMXO3L-2100E-6MG324I is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a flexible, non-volatile FPGA fabric with embedded memory, programmable I/O and on-chip system resources for control, interface and glue-logic functions in industrial and embedded designs.

With 2,112 logic elements across 264 logic blocks, up to 268 I/Os, and approximately 75,776 bits (≈0.076 Mbits) of embedded RAM, this device targets applications that require reconfigurable logic, integrated peripheral interfaces and a compact 324‑VFBGA surface-mount package. The device supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 264 logic blocks delivering 2,112 logic elements for implementing glue logic, protocol handling and control functions.
• On-chip Memory — Approximately 75,776 bits (≈0.076 Mbits) of embedded RAM supporting single/dual-port and FIFO modes as described in the MachXO3 family datasheet.
• I/O Density & Flexibility — Up to 268 I/O pins with programmable I/O cells and support for source-synchronous I/O and flexible I/O buffering options (per family documentation).
• Clocking & Timing — Integrated on-chip oscillator and sysCLOCK PLLs for flexible on-chip clock generation and distribution (MachXO3 family features).
• Embedded Hardened IP — Family-level hardened IP functions including I²C, SPI and timer/counter blocks for common peripheral interfacing and timing tasks.
• Non‑volatile Configuration & Reconfiguration — Multi-time programmable non-volatile configuration and TransFR reconfiguration capability as described in the MachXO3 family data sheet.
• Package & Mounting — 324‑VFBGA (supplier package listed as 324‑CSFBGA, 10×10) optimized for surface-mount PCB assembly.
• Power & Environmental — Core supply range 1.14 V to 1.26 V; RoHS compliant; industrial-grade operating range −40 °C to 100 °C.
• System Resources — User Flash Memory (UFM), standby and power saving options, and TraceID support are included at the family level for system integration and configuration management.

Typical Applications

• Interface Bridging and Glue Logic — Implement protocol conversion, bus bridging and board-level glue logic using the device’s programmable I/O and logic resources.
• Peripheral and Sensor Interfacing — Use hardened I²C/SPI IP and multiple I/Os to connect and control sensors, ADC/DAC front-ends, and peripheral devices.
• On-board Control and Configuration — Manage system configuration, device sequencing and low-latency control functions leveraging non-volatile configuration and UFM.
• Timing and Data Buffering — Employ the embedded RAM and PLL-based clocking for small FIFOs, data buffering and clock-domain crossing tasks.

Unique Advantages

• Compact, high-density I/O: 268 I/Os in a 324‑VFBGA package let you integrate extensive interface capabilities in a small footprint.
• Non-volatile, reprogrammable configuration: Multi-time programmable on-chip configuration eliminates the need for external configuration flash while enabling field updates.
• Integrated peripheral IP: Hardened I²C, SPI and timers reduce external component count and simplify firmware and hardware integration.
• Industrial operating range: Rated for −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Flexible clocking and memory modes: On-chip oscillator, PLLs and configurable embedded RAM modes support diverse timing and buffering requirements.

Why Choose LCMXO3L-2100E-6MG324I?

The LCMXO3L-2100E-6MG324I provides a balanced combination of logic capacity, I/O count and embedded system resources in a compact 324‑VFBGA package. Its non-volatile reprogrammable fabric, integrated peripheral IP blocks and flexible clocking/memory options make it suitable for designs that need reliable on-board control, interface consolidation and field reconfiguration.

This part is positioned for engineers and procurement teams seeking an industrial-grade, surface-mount FPGA solution with explicit core supply and temperature operating windows, RoHS compliance, and a clear set of family-level features documented in the MachXO3 data sheet.

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