LCMXO3L-4300C-5BG324C

The LCMXO3L-4300C-5BG324C is a MachXO3 family FPGA device in a 324-LFBGA (15×15) package, offering a balance of programmable logic, embedded memory, and high I/O density for board-level integration. With 4,320 logic elements, approximately 94 kbits of on-chip RAM, and up to 279 I/O pins, this commercial-grade, surface-mount device fits applications that require flexible I/O, on-chip peripherals, and non-volatile configuration.

Key Features

• Logic Capacity  4,320 logic elements for implementing state machines, glue logic, and moderate-density programmable functions.
• Embedded Memory  Approximately 94 kbits of on-chip RAM (94,208 total RAM bits) for FIFOs, buffers, and local data storage.
• I/O Density  Up to 279 I/O pins to support high pin-count interfacing and board-level signal aggregation.
• Package & Mounting  324-LFBGA (supplier package 324-CABGA, 15×15) in a surface-mount form factor for compact PCB designs.
• Power  Supports a supply voltage range of 2.375 V to 3.465 V, enabling integration with a variety of board power rails.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Non-volatile, Multi-time Programmable Configuration  MachXO3 family features listed in the datasheet include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities.
• Clocking and Timing  On-chip clocking features including sysCLOCK PLLs and flexible clock distribution for synchronized designs (as described in the MachXO3 family datasheet).
• Programmable I/O and Protocol IP  Programmable I/O cells, hardened IP blocks (Hardened I²C, SPI, and Timer/Counter cores), and configurable I/O buffer support are documented for the MachXO3 family.
• System and Memory Blocks  sysMEM embedded block RAM with single/dual/pseudo-dual port and FIFO configuration options is described in the family datasheet.
• RoHS Compliant  Device is RoHS compliant for environmental compliance on standard builds.

Typical Applications

• I/O Expansion and Glue Logic  High I/O count (279 pins) and 4,320 logic elements make this device suitable for consolidating board-level glue logic and I/O aggregation.
• Interface Bridging and Protocol Handling  Embedded memory and hardened protocol IP (I²C, SPI) support intermediate buffering and protocol adaptation on-system.
• Control and Sequencing  On-chip RAM and logic resources enable implementation of control state machines, timers, and sequencing functions close to sensors and actuators.

Unique Advantages

• High I/O Count  279 available I/Os reduce external multiplexing and simplify board interconnects.
• Integrated Memory and IP  Approximately 94 kbits of embedded RAM plus documented hardened IP blocks lower BOM and accelerate development of common interfaces.
• Flexible Clocking  On-chip PLLs and a documented clock distribution network help implement source-synchronous interfaces and system timing without external clocking complexity.
• Non-volatile Configuration  Multi-time programmable, non-volatile configuration options in the MachXO3 family provide reprogrammability and configuration persistence across power cycles.
• Compact, Surface-Mount Package  324-LFBGA (15×15) provides high integration density for space-constrained PCBs while supporting standard surface-mount assembly.
• Commercial Temperature Grade  Rated 0 °C to 85 °C for typical commercial applications and environments.

Why Choose LCMXO3L-4300C-5BG324C?

This MachXO3 family device combines a balanced mix of programmable logic, embedded RAM, and a high number of I/Os in a compact 324-LFBGA package, making it appropriate for designers who need board-level integration without external programmable devices. Its documented on-chip clocking, programmable I/O cells, and hardened IP cores support faster time-to-market and lower system BOM.

The commercial-grade operating range, RoHS compliance, and surface-mount package align the device to mainstream embedded designs that require reprogrammability, flexible interfacing, and moderate logic density. The MachXO3 family datasheet details configuration, memory, and peripheral capabilities to support integration and verification efforts.

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