LCMXO3L-4300C-5BG256C

The LCMXO3L-4300C-5BG256C is a MachXO3 family Field Programmable Gate Array (FPGA) designed for commercial embedded applications that require flexible on-chip logic, abundant I/O, and non-volatile configuration. It combines programmable fabric with on-chip memory and system-level features drawn from the MachXO3 architecture.

As a surface-mount, 256-LFBGA packaged device, this part targets designs needing up to 206 general-purpose I/O, approximately 4,320 logic elements, and integrated system functions such as hardened IP cores and on-chip clocking. The device operates over a 2.375 V to 3.465 V supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Programmable Core  Approximately 4,320 logic elements to implement custom logic, glue logic, state machines and small to medium complexity functions.
• Embedded Memory  Approximately 0.094 Mbits of embedded memory (94,208 bits) for LUT RAM, FIFOs or small buffers and data storage.
• I/O Capacity & Packaging  206 I/O pins in a 256-LFBGA (256-CABGA, 14×14) package; surface-mount package suitable for compact board layouts.
• Power and Supply  Supports supply voltages from 2.375 V to 3.465 V to accommodate a range of common system rails.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial embedded applications.
• Non-volatile, Multi-time Programmable Architecture  MachXO3 family features include non-volatile, multi-time programmable configuration for retained logic after power cycles.
• On-chip System IP  MachXO3 family documentation highlights embedded hardened IP such as I²C and SPI cores, timers/counters, and on-chip oscillators to simplify system integration.
• Flexible Clocking and Reconfiguration  Family-level features include flexible on-chip clocking (PLLs) and support for TransFR reconfiguration modes to adapt to evolving system requirements.
• Standards and Compliance  RoHS compliant; designed for surface-mount assembly in compact BGA footprint.

Typical Applications

• Interface Bridging  Use the device to implement protocol translation and signal-level interfacing between peripherals, leveraging the high I/O count and embedded memory for buffering.
• Control & Glue Logic  Integrate control sequencing, state machines and system glue logic in a single programmable device to reduce discrete component count.
• User Interface & Peripheral Management  Drive and manage multiple user-interface lines or peripheral buses where numerous GPIOs and on-chip IP accelerate development.
• Prototyping and Low-Volume Production  Commercial-grade, reprogrammable logic suited for development platforms and low- to mid-volume products requiring field-updatable logic.

Unique Advantages

• High I/O Density: 206 available I/O pins enable integration of multiple interfaces and peripherals without external GPIO expanders.
• Compact Board Integration: 256-LFBGA (14×14) package provides a small footprint and surface-mount mounting for space-constrained PCBs.
• Non-volatile Configuration: MachXO3 family non-volatile, multi-time programmable architecture preserves configuration after power cycles and supports in-field updates.
• Integrated System IP: Hardened I²C, SPI and timer resources reduce software and logic overhead, helping shrink BOM and accelerate time-to-market.
• Flexible Power Options: Wide supply range (2.375 V to 3.465 V) allows compatibility with common system rails and simplifies power-supply choices.
• Commercial Temperature Rating: Specified for 0 °C to 85 °C operation for typical commercial embedded environments.

Why Choose LCMXO3L-4300C-5BG256C?

The LCMXO3L-4300C-5BG256C combines a compact BGA package, substantial I/O, and a programmable fabric sized at approximately 4,320 logic elements with embedded memory, making it a practical choice for designers who need reprogrammable logic, interface integration, and on-chip system features in commercial embedded products. Family-level capabilities such as non-volatile configuration, hardened peripheral IP, and flexible clocking enhance system integration and development velocity.

This device is well suited to teams building control logic, interface bridges, or user-facing peripheral control where commercial temperature range, RoHS compliance, and surface-mount packaging are required. Its specification set supports scalable designs that can be updated in the field while keeping board-level complexity and part count low.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO3L-4300C-5BG256C and to discuss how it fits your design requirements.