LCMXO3L-4300C-5BG324I

The LCMXO3L-4300C-5BG324I is a MachXO3 family FPGA packaged in a 324-LFBGA (324-CABGA, 15×15) offering industrial-grade operation. It provides 4,320 logic elements, a high I/O count and on-chip embedded memory, making it suitable for embedded control, I/O expansion and industrial system glue logic.

Built with flexible on-chip resources and family-level features such as programmable I/O, on-chip clocking, non-volatile multi-time programmable configuration and embedded hardened IP blocks, this device targets designs that need moderate logic capacity combined with broad I/O and reliable industrial temperature operation.

Key Features

• Logic Capacity  4,320 logic elements for implementing control, glue logic and moderate-density FPGA functions.
• Embedded Memory  Approximately 0.094 Mbits of embedded RAM (94,208 bits) for data buffering, small FIFOs and state storage.
• High I/O Count  279 I/O pins to support extensive interfacing to sensors, actuators, memory and external peripherals.
• Flexible I/O and Standards  Family-level documentation specifies high-performance, flexible I/O buffers and pre‑engineered source‑synchronous I/O, enabling a range of interface options (see datasheet for supported standards).
• Clocking and Timing  On-chip clocking features including PLLs and an on-chip oscillator are included in the MachXO3 family for flexible clock-domain management.
• Non-volatile Configuration & UFM  MachXO3 family supports non-volatile, multi-time programmable configuration and user flash memory (UFM) for persistent configuration and small data storage.
• Embedded Hardened IP  Family-level hardened IP cores such as I²C, SPI and timer/counter functions are available in the MachXO3 family.
• Power and Temperature  Operates from 2.375 V to 3.465 V and rated for industrial temperatures from −40 °C to 100 °C.
• Package  324-LFBGA (supplier package: 324-CABGA, 15×15) surface-mount package optimized for compact system integration.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Industrial Control  Use the industrial temperature rating and broad I/O to implement control logic, sensor interfacing and field I/O aggregation in factory and process equipment.
• I/O Expansion and Glue Logic  High pin count and flexible I/O make the device suitable for board-level protocol bridging, bus interfacing and consolidating peripheral interfaces.
• Embedded Systems  Combine on-chip memory, non-volatile configuration and embedded IP (I²C/SPI/timers) for compact embedded controllers and system management functions.
• Configuration and System Utilities  Leverage UFM and multi-time programmable configuration for in-field updates, identification storage and small persistent data needs.

Unique Advantages

• Highly integrated logic and I/O  4,320 logic elements with 279 I/Os reduce external glue components and simplify board-level design.
• Non-volatile configuration  Multi-time programmable, non-volatile configuration and UFM reduce the need for external configuration memory and simplify system boot.
• Industrial-ready operation  Rated from −40 °C to 100 °C to support demanding environmental conditions common in industrial deployments.
• Flexible power rails  Wide supply range (2.375 V–3.465 V) enables compatibility with common system power architectures.
• Family-level system features  On-chip PLLs, oscillator and hardened IP (I²C/SPI/timers) provide building blocks that speed development and reduce BOM.
• Compact, surface-mount package  324-LFBGA (15×15) package balances I/O density and PCB area for space-constrained applications.

Why Choose LCMXO3L-4300C-5BG324I?

The LCMXO3L-4300C-5BG324I positions the MachXO3 family’s system-level features in an industrial-grade FPGA device with a strong balance of logic capacity, high I/O count and embedded memory. It is well suited for embedded and industrial designs that require non-volatile configuration, a large number of interfaces and robust temperature performance.

Choosing this part provides designers with family-level capabilities—flexible I/O, on-chip clocking, UFM and hardened peripheral IP—combined with a compact 324-LFBGA package and RoHS compliance, helping to streamline board-level integration and long-term deployment in industrial environments.

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