LCMXO3L-4300C-6BG256C

The LCMXO3L-4300C-6BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It provides a flexible, non-volatile FPGA architecture in a compact 256-LFBGA package with up to 206 I/O pins and 4320 logic elements for system control, interface bridging, and on-board logic functions.

This device targets commercial-grade designs with a supply voltage range of 2.375 V to 3.465 V and an operating temperature range of 0 °C to 85 °C. Key on-chip capabilities documented in the datasheet include embedded block RAM, programmable I/O, PLL-based clocking, hardened I2C/SPI IP cores, and multi-time programmable non-volatile configuration.

Key Features

• Core Logic  4320 logic elements and approximately 540 logic blocks provide fabric for implementing custom glue logic, state machines, and control functions.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM with sysMEM support, including single/dual/ pseudo-dual port and FIFO modes for buffering and small data storage.
• I/O and Interfaces  206 general-purpose I/O pins with pre‑engineered source synchronous I/O and high-performance configurable I/O buffers for diverse signaling needs.
• Clocking and Timing  Flexible on-chip clocking including sysCLOCK PLLs and an on-chip oscillator for local clock generation and frequency management.
• Hardened IP Functions  Embedded hardened I2C and SPI IP cores and a hardened timer/counter reduce external component count and simplify peripheral interfacing.
• Configuration and Memory  Non-volatile, multi-time programmable configuration with TransFR reconfiguration and User Flash Memory (UFM) for persistent settings.
• Power and Packaging  Surface-mount 256-LFBGA (256-CABGA 14×14) package; supply range 2.375 V to 3.465 V; commercial operating range 0 °C to 85 °C.
• Compliance  RoHS-compliant manufacturing status for environmental regulatory alignment.

Typical Applications

• Peripheral interface bridging  Use the hardened I2C and SPI IP cores and flexible I/O to implement sensor and peripheral interfaces with reduced external logic.
• Clock management and timing  Leverage on-chip PLLs and oscillator for local clock generation, distribution, and timing functions within embedded systems.
• Data buffering and FIFO  Employ sysMEM block RAM in FIFO or single/dual-port modes to buffer data between subsystems or for small on-board storage.
• Non-volatile configuration and control  Use the multi-time programmable non-volatile configuration and UFM to store system settings and enable field reconfiguration.

Unique Advantages

• Flexible integration: A combination of 4320 logic elements and 206 I/Os lets you consolidate glue logic, interfaces, and control functions into a single device.
• Reduced external components: Hardened I2C/SPI cores and on-chip memory reduce BOM and simplify board-level design.
• Non-volatile deployment: Multi-time programmable non-volatile configuration and UFM enable persistent settings and field updates without external configuration flash.
• Compact, surface-mount package: The 256-LFBGA (14×14) package supports dense board layouts while providing ample I/O for system connectivity.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for a wide range of commercial electronic products.
• Configurable clocking and memory modes: Integrated PLLs, oscillator, and versatile sysMEM modes (including FIFO) enable tailored clock and data-flow solutions.

Why Choose LCMXO3L-4300C-6BG256C?

The LCMXO3L-4300C-6BG256C positions itself as a compact, commercially rated MachXO3 FPGA option for designs that require a blend of programmable logic, embedded memory, and built‑in peripheral IP. Its combination of 4320 logic elements, approximately 94,208 bits of embedded RAM, and 206 I/Os allows system designers to reduce board-level complexity and integrate control, interface, and buffering functions into a single, RoHS-compliant device.

This part is well suited to engineers seeking a non-volatile, reprogrammable solution with flexible clocking, hardened interfaces, and small-footprint packaging. It delivers scalability and on-board integration while matching the documented commercial operating and power-supply requirements.

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