LCMXO3L-4300C-6BG324I

The LCMXO3L-4300C-6BG324I is a MachXO3 family FPGA optimized for flexible system integration and I/O-centric designs. It delivers a balanced combination of programmable logic, embedded memory, and a high-density I/O complement in a 324‑LFBGA package suitable for industrial applications.

Built with features described in the MachXO3 family data sheet—including flexible on-chip clocking, non-volatile multi-time programmability, and hardened system IP—this device targets designs that require reconfigurable logic, extensive I/O, and dependable operation across a wide temperature range.

Key Features

• Programmable Logic — Approximately 4,320 logic elements to implement control, glue logic, and moderate complexity state machines.
• Embedded Memory — Approximately 94 Kbits (94,208 bits) of on-chip RAM for small FIFOs, buffering, and control/state storage.
• High-Density I/O — 279 general-purpose I/Os to support extensive peripheral interfacing and board-level connectivity.
• Non-volatile, Multi-time Programmable Configuration — MachXO3 family configuration options including multi-time programming and TransFR reconfiguration capabilities as described in the datasheet.
• Clocking and Timing — Flexible on-chip clocking with PLLs and clock distribution features to support synchronized and source-synchronous I/O modes.
• Embedded Hardened IP — Built-in IP blocks including hardened I²C and SPI cores, timer/counter functions, and user flash memory (UFM) as cited in the datasheet.
• System and Test Support — IEEE 1149.1-compliant boundary-scan testability and configuration/testing features referenced in the family data sheet.
• Package and Mounting — 324‑LFBGA (324‑CABGA, 15 × 15 mm) surface-mount package for compact PCB integration.
• Voltage and Temperature — Recommended supply range of 2.375 V to 3.465 V and industrial operating temperature range of −40 °C to 100 °C.
• Environment — RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the extensive I/O count and flexible clocking to implement board-level protocol translation and signal conditioning.
• Control and Sequencing — Leverage the 4,320 logic elements and on-chip timers/counters for device control, state machines, and control path consolidation.
• Small-Scale Buffering and FIFOs — Embedded memory and FIFO modes support short buffer storage and data staging between subsystems.
• System-Level IP Integration — Hardened I²C and SPI cores simplify peripheral interfacing while reducing external components.

Unique Advantages

• Highly configurable I/O and timing: 279 I/Os combined with flexible on-chip clocking and PLLs streamline integration of diverse peripheral interfaces.
• Non-volatile programmability: Multi-time programmable configuration removes the need for an external configuration PROM for many use cases, simplifying BOM and board design.
• Embedded system IP: Hardened I²C, SPI, and timer/counter blocks reduce development time and free up logic resources for application-specific functions.
• Industrial temperature rating: −40 °C to 100 °C qualification supports deployment in industrial environments that require extended temperature operation.
• Compact, high-density packaging: 324‑LFBGA (15 × 15 mm) package enables high pin count in a small footprint for space-constrained PCBs.
• Designed for testability and system integration: Boundary-scan support and configuration/testing features assist manufacturing test and field diagnostics.

Why Choose LCMXO3L-4300C-6BG324I?

The LCMXO3L-4300C-6BG324I positions itself as a flexible, industrial-grade FPGA option for designs that need a balance of programmable logic, substantial I/O, and embedded system features without relying on external configuration devices. Its MachXO3 family capabilities—such as hardened peripheral IP, flexible clocking, and non-volatile configuration—help reduce BOM complexity and speed integration.

This device is well suited to engineering teams building I/O-rich control, interface, or system integration functions where compact packaging, industrial temperature operation, and on-chip test/configuration features add tangible design and manufacturing value.

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