LCMXO3L-4300C-6BG400I

The LCMXO3L-4300C-6BG400I is a MachXO3 family Field Programmable Gate Array from Lattice Semiconductor Corporation. It provides a flexible, non-volatile FPGA architecture with 4320 logic elements and 94,208 bits of embedded RAM for glue logic, I/O aggregation, and control functions.

With 335 available I/Os, on-chip hardened peripherals and configurable clocking, this industrial-grade device (‑40 °C to 100 °C) targets designs that need high I/O density, non-volatile configuration and robust system-level integration.

Key Features

• Core Logic 4320 logic elements organized into 540 logic blocks provide capacity for combinational and sequential logic, state machines and glue logic functions.
• Embedded Memory Approximately 94,208 bits of on-chip RAM (sysMEM) supporting single/dual/pseudo-dual port and FIFO modes for data buffering and small on-chip storage.
• I/O and Interface Up to 335 I/Os with pre‑engineered source-synchronous I/O and flexible I/O buffering to support a wide range of parallel and serial interfacing needs.
• Programmability and Configuration Non-volatile, multi-time programmable fabric with TransFR reconfiguration and user flash memory (UFM) for configuration and small data storage.
• Embedded Hardened IP Built-in hardened peripherals including I²C, SPI and timer/counter blocks to offload common functions from fabric logic.
• Clocking and Timing Flexible on-chip clocking with sysCLOCK PLLs and an on-chip oscillator to simplify timing architectures and reduce external components.
• Package and Environmental 400‑LFBGA (17×17) surface-mount package, industrial temperature grade (‑40 °C to 100 °C) and wide supply range (2.375 V to 3.465 V).
• System and Test IEEE‑1149.1 boundary-scan testability and configuration/testing features for easier board bring-up and diagnostics.

Typical Applications

• Industrial Control — Use the industrial temperature rating and 335 I/Os to implement sensor interfacing, motor control logic and I/O aggregation in factory and process-control equipment.
• Interface Bridging — High I/O count and flexible I/O buffering make the device suitable for protocol translation and bus bridging between disparate subsystems.
• Embedded System Glue Logic — 4320 logic elements and on-chip RAM enable consolidation of glue logic, state machines and small data buffers in consumer and industrial embedded designs.
• Peripheral Offload — Hardened I²C, SPI and timer/counter IP reduce fabric usage for common peripheral tasks, simplifying firmware and freeing logic resources.

Unique Advantages

• Non‑volatile, multi‑time programmable fabric: Retains configuration without external flash and supports in-system reprogramming for field updates and iterative development.
• High I/O density: 335 I/Os allow direct connection to numerous peripherals and buses, reducing the need for external I/O expanders.
• Integrated hardened peripherals: On-chip I²C, SPI and timers lower BOM and free programmable fabric for application‑specific logic.
• Flexible on‑chip clocking: sysCLOCK PLLs and an internal oscillator enable adaptable clock architectures with fewer external components.
• Industrial operating range: Rated for ‑40 °C to 100 °C, supporting deployment in harsh or temperature-variable environments.
• Compact, advanced packaging: 400‑LFBGA (17×17) surface-mount package provides high pin density in a compact footprint.

Why Choose LCMXO3L-4300C-6BG400I?

The LCMXO3L-4300C-6BG400I combines non‑volatile configuration, a balanced mix of logic resources and embedded memory, and a very high I/O count to address a wide range of control, interfacing and glue-logic roles. Its hardened peripheral IP and flexible clocking reduce system complexity and BOM while the industrial temperature rating supports deployment in demanding environments.

This part is suitable for engineering teams seeking a compact, integrative FPGA solution where on-chip peripherals, reprogrammability and robust I/O are priorities. The MachXO3 family features and system-level capabilities provide a stable platform for designs that require long-term maintainability and field reconfiguration.

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