LCMXO3L-4300E-5MG256C

The LCMXO3L-4300E-5MG256C is a member of the MachXO3 family of field programmable gate arrays from Lattice Semiconductor. It provides a flexible, non-volatile FPGA architecture with on-chip memory and a broad I/O complement suited for programmable logic, control and interface tasks.

This device integrates approximately 4,320 logic elements, approximately 94,208 bits of embedded RAM, and up to 206 I/Os in a 256-VFBGA (9×9) surface-mount package, making it suitable for designs that require moderate logic capacity, dense I/O, and non-volatile reprogrammability within a commercial temperature range.

Key Features

• Core Capacity — Approximately 4,320 logic elements provide flexible programmable logic resources for glue logic, control state machines, and moderate-complexity FPGA tasks.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM allow for local buffering, FIFOs, and small data storage without external memory.
• High I/O Density — Up to 206 I/Os support complex interfacing and multiple peripheral connections in a single device.
• Non-volatile, Multi-time Programmable — MachXO3 family features include non-volatile configuration and multi-time programmability for field updates and iterative development.
• I/O and Clocking — The MachXO3 family datasheet lists pre-engineered source-synchronous I/O, flexible on-chip clocking, and high-performance I/O buffer architecture to simplify timing and interface design.
• Embedded Hardened IP — Family documentation includes hardened IP functions such as I2C, SPI, and timer/counter primitives for common system tasks.
• Package and Mounting — 256-VFBGA, CSPBGA package (256-CSFBGA, 9×9) in a surface-mount form factor for compact PCB integration.
• Supply and Temperature — Operates from 1.14 V to 1.26 V and is specified for commercial grade operation from 0 °C to 85 °C.
• RoHS Compliant — Device is RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Interface Bridging — Use the device’s high I/O count and flexible I/O buffering to implement protocol conversion and signal aggregation between subsystems.
• System Glue Logic — Leverage the logic elements and on-chip RAM for control logic, state machines, and small buffering functions that reduce external components.
• Embedded Control — Employ built-in timers, counters and hardened peripheral interfaces for board-level control and management tasks.

Unique Advantages

• Highly Integrated Solution: Combines ~4,320 logic elements, ~94,208 bits of embedded RAM and 206 I/Os to minimize external logic and simplify board design.
• Non-volatile Configuration: Multi-time programmable, non-volatile architecture supports field updates and reconfiguration without external configuration memory.
• Flexible I/O and Clocking: Pre-engineered source-synchronous I/O and flexible on-chip clocking reduce timing complexity for high-speed interfaces.
• Compact Packaging: 256-VFBGA (9×9) CSPBGA surface-mount package provides dense integration for space-constrained PCBs.
• Commercial Grade Reliability: Rated for operation from 0 °C to 85 °C for a wide range of commercial electronic applications.
• Standards-aware IP: Embedded hardened IP (I2C, SPI, timers) accelerates common design functions and helps reduce development time.

Why Choose LCMXO3L-4300E-5MG256C?

The LCMXO3L-4300E-5MG256C delivers a balanced combination of programmable logic, on-chip memory, and dense I/O in a compact 256-VFBGA package. As part of the MachXO3 family, it provides non-volatile, multi-time programmable configuration and a set of architecture features tailored to simplify interfacing and control functions.

This device is well suited to designers needing a commercial-grade, reprogrammable logic element for system glue, interface bridging, and embedded control where moderate logic capacity, ample I/O, and on-chip RAM reduce overall BOM and speed development. Family-level documentation and on-chip IP primitives help accelerate integration and verification.

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