LCMXO3L-4300E-5MG324I

The LCMXO3L-4300E-5MG324I is a MachXO3 family non-volatile FPGA in a 324-VFBGA package designed for industrial embedded systems. It combines reprogrammable logic, on-chip embedded memory and a high I/O count to deliver flexible glue‑logic, interface bridging and control functions in compact surface‑mount form factors.

With 4,320 logic elements, approximately 94,208 bits of embedded RAM and 268 I/O pins, this device targets use cases that require moderate logic density, robust I/O capability and operation across an industrial temperature range while operating on a low core supply voltage.

Key Features

• Logic Capacity — 4,320 logic elements provide reprogrammable logic resources suitable for glue logic, control and moderate-density FPGA functions.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM for FIFOs, small buffers and local data storage.
• High I/O Count — 268 available I/O pins to support multiple peripheral interfaces, bus bridges and complex board-level routing.
• Non-volatile, Multi-time Programmable Architecture — MachXO3 family features listed in the product datasheet include non‑volatile configuration and multi-time programmability for in‑field updates and flexible development workflows.
• Flexible On‑Chip Clocking & Peripherals — Datasheet references include flexible clocking and embedded hardened IP (I2C, SPI, timers) to simplify system integration and timing control.
• Low-Voltage Core — Core supply operates from 1.14 V to 1.26 V, supporting low-power supply domains and modern system power architectures.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, supporting industrial and harsh-environment deployments.
• Advanced Packaging — 324-VFBGA (supplier device package: 324-CSFBGA, 10×10) surface-mount package for dense board layouts and automated assembly.
• Surface Mount — Designed for surface-mount assembly to integrate into compact, automated production environments.

Typical Applications

• Industrial Control — Implement control logic, protocol conversion and deterministic interfacing while meeting industrial temperature requirements.
• Interface Bridging and Glue Logic — High I/O count enables board-level signal aggregation, bus bridging and protocol translation between multiple peripherals.
• Embedded System Management — On-chip memory and reprogrammable logic support local buffering, state machines and system supervision functions.
• Communications & Peripherals — Use the device’s flexible I/O and embedded peripherals for sensor aggregation, peripheral conditioning and low-latency interfacing.

Unique Advantages

• Highly integrated I/O and logic: 268 I/Os combined with 4,320 logic elements reduce external glue components and simplify PCB routing.
• Non-volatile, reprogrammable configuration: In-field updates and multi-time programmability allow design iteration and feature upgrades without external configuration memory.
• Industrial ready operating range: −40 °C to 100 °C rating supports deployment in demanding environments and industrial systems.
• Compact, high-density package: 324‑VFBGA (10×10) surface-mount package enables space-constrained board designs while maintaining robust I/O connectivity.
• Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern low-voltage power domains used in embedded platforms.
• Embedded memory for local buffering: Approximately 94,208 bits of RAM facilitate FIFO, temporary storage and fast on-chip data handling.

Why Choose LCMXO3L-4300E-5MG324I?

The LCMXO3L-4300E-5MG324I positions itself as a flexible, industrial-grade FPGA option for engineers who need moderate logic density, a high number of I/Os and on-chip memory in a compact surface‑mount package. Its non-volatile, multi-time programmable architecture and MachXO3 family capabilities make it suitable for designs that require field reconfiguration and reliable system-level integration.

This device is well suited to designers building industrial control modules, interface bridges, embedded system managers and communications peripherals that benefit from a small BOM, reduced external components and support for industrial temperature operation.

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