LCMXO3L-4300E-5UWG81CTR

The LCMXO3L-4300E-5UWG81CTR is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a compact, non-volatile programmable fabric with integrated memory and hardened peripheral functions, packaged in an 81-WLCSP (3.80 × 3.69 mm) surface-mount package.

Designed for commercial applications, this device delivers configurable logic, on-chip RAM and flexible I/O in a low-profile package, enabling board-level glue logic, I/O expansion and embedded control functions while meeting RoHS requirements.

Key Features

• Core Logic 4,320 logic elements provide programmable logic capacity for glue logic, state machines and control functions.
• Embedded Memory 94,208 bits of on-chip RAM (sysMEM) for data buffering, FIFOs and small embedded storage needs.
• I/O and Interfaces 63 I/O pins with programmable I/O cells and support for pre‑engineered source-synchronous I/O and flexible on-chip clocking (PLLs) as described in the MachXO3 family documentation.
• On-chip Peripherals Hardened IP functions documented for the MachXO3 family include I²C, SPI and timer/counter blocks, plus an on-chip oscillator and user flash memory (UFM) for system functions and configuration storage.
• Non-volatile, Reprogrammable Configuration Multi-time programmable, non-volatile configuration with TransFR reconfiguration capability detailed in the MachXO3 family materials.
• Power Operates from a core supply range of 1.14 V to 1.26 V to match low-voltage system rails.
• Package & Mounting 81-WLCSP (3.80 × 3.69 mm) package, surface-mount mounting type for compact board designs.
• Commercial Grade & Temperature Range Commercial grade device rated for 0 °C to 85 °C operating temperature.
• System Reliability & Test Features include IEEE 1149.1-compliant boundary-scan testability and other configuration/testing capabilities described in the MachXO3 family data sheet.
• RoHS Compliant Device is RoHS compliant.

Typical Applications

• Board-level Glue and Control Use the LCMXO3L-4300E for flexible logic consolidation, protocol bridging and control tasks where compact programmable logic is required.
• I/O Expansion and Interface Bridging The programmable I/O cells and source-synchronous I/O support make this device suitable for expanding or adapting signal interfaces on space-constrained PCBs.
• Embedded Peripheral Integration Integrate on-chip I²C/SPI peripherals, timers and user flash to reduce external components for commercial equipment control functions.
• Consumer and Commercial Electronics Compact WLCSP packaging and commercial temperature rating suit a range of consumer and commercial applications that require low-profile, reprogrammable logic.

Unique Advantages

• Highly integrated programmable fabric: 4,320 logic elements plus 94,208 bits of embedded RAM reduce the need for external glue logic and discrete memory.
• Compact board footprint: 81-WLCSP (3.80 × 3.69 mm) package minimizes PCB area for space-constrained designs.
• Low-voltage core compatibility: 1.14 V–1.26 V supply range aligns with modern low-voltage system rails.
• On-chip peripherals and configuration: Hardened I²C, SPI, timer/counter blocks, on-chip oscillator and UFM simplify peripheral integration and configuration storage.
• Reprogrammable non-volatile configuration: Multi-time programmable non-volatile configuration and TransFR reconfiguration support iterative development and in-field updates.
• Design and test support: Boundary-scan testability and other configuration/testing features help streamline board-level validation and manufacturing test.

Why Choose LCMXO3L-4300E-5UWG81CTR?

The LCMXO3L-4300E-5UWG81CTR positions itself as a compact, commercially rated MachXO3 family FPGA with a blend of usable logic capacity, embedded memory and hardened peripheral functions in an 81-WLCSP package. It is well suited to engineers who need a low-profile, reprogrammable device for board-level logic consolidation, I/O adaptation and embedded peripheral integration in commercial products.

Backed by MachXO3 family features documented in the data sheet—such as programmable I/O, sysMEM, PLLs, on-chip peripherals and non-volatile configuration—this device offers a scalable option for designs that require reduced BOM, on-board configurability and RoHS compliance.

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