LCMXO3L-4300E-5UWG81ITR1K

IC FPGA 63 I/O 81WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 63 94208 4320 81-UFBGA, WLCSP

Quantity 1,833 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package81-WLCSP (3.80x3.69)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case81-UFBGA, WLCSPNumber of I/O63Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3L-4300E-5UWG81ITR1K – MachXO3 Field Programmable Gate Array (FPGA) IC, 81-WLCSP

The LCMXO3L-4300E-5UWG81ITR1K is a MachXO3 family Field Programmable Gate Array IC supplied in an 81-WLCSP (3.80 × 3.69 mm) package and specified for industrial-grade operation. It provides 4,320 logic elements, approximately 0.094 Mbits of embedded RAM, and 63 general-purpose I/O pins in a compact surface-mount footprint.

Designed for space-constrained embedded systems, this device combines on-chip memory, flexible I/O, and non-volatile configuration options to support control, glue-logic and interface functions across industrial applications that require low-voltage operation and extended temperature range.

Key Features

  • Core Logic — 4,320 logic elements suitable for glue logic, state machines and small to mid-scale programmable functions.
  • Embedded Memory — 94,208 bits of on-chip RAM (approximately 0.094 Mbits) for data buffering, small FIFOs and state storage.
  • I/O and Packaging — 63 I/O pins in an 81-WLCSP (3.80 × 3.69 mm) surface-mount package for compact board-level integration.
  • Voltage and Temperature — Low-voltage operation with a supply range of 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C.
  • Non-volatile, Multi-time Programmable Configuration — On-device non-volatile configuration and multi-time programmability as described in the MachXO3 family data sheet.
  • Flexible On-chip Clocking and PLLs — Family-level architecture includes flexible clocking and PLL resources for on-chip timing control.
  • Pre‑engineered I/O and Buffers — Source-synchronous I/O, high-performance flexible I/O buffers and programmable I/O cells for interface flexibility.
  • Embedded IP and System Features — Family documentation lists hardened I²C and SPI IP cores, timers/counters, on-chip oscillator, user flash memory (UFM), and IEEE 1149.1 boundary-scan testability.
  • Power and System Management — Standby mode and power-saving options available per family datasheet to support low-power system states.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial control and automation — Use the industrial temperature rating and programmable logic to implement control functions, protocol bridging and interface glue-logic in factory and process equipment.
  • Embedded system glue logic — Small, dense WLCSP package and available I/O make the device well suited for implementing bus bridging, signal conditioning and custom timing logic on space-constrained PCBs.
  • Interface and peripheral control — On-chip I/O flexibility and embedded IP blocks support peripheral interfacing, sensor aggregation and local protocol handling.

Unique Advantages

  • Compact WLCSP footprint: 81-WLCSP (3.80 × 3.69 mm) packaging reduces PCB area and supports high-density board designs.
  • Industrial temperature range: Rated from −40 °C to 100 °C, enabling deployment in demanding environmental conditions.
  • Integrated non-volatile configuration: Multi-time programmable configuration eliminates the need for external configuration flash for many designs.
  • Flexible low-voltage operation: Operates across a 1.14 V to 1.26 V supply range to match modern low-voltage system rails.
  • Embedded interfaces and IP: Hardened I²C and SPI cores, timers, UFM and boundary-scan support simplify system integration and reduce external component count.

Why Choose LCMXO3L-4300E-5UWG81ITR1K?

The LCMXO3L-4300E-5UWG81ITR1K positions itself as a compact, industrial-grade FPGA option within the MachXO3 family, delivering 4,320 logic elements, on-chip RAM, flexible I/O and non-volatile configuration in an 81-WLCSP package. Its combination of small footprint, low-voltage operation and integrated system features makes it appropriate for designers needing reliable glue-logic, peripheral interfacing and control functions in space- and power-constrained embedded systems.

Because the MachXO3 family includes on-chip clocking, hardened peripheral IP and power-saving modes, this device provides a balance of integration and system-level capability that simplifies BOM and supports maintainable, scalable designs.

Request a quote or submit a firm-quote request to obtain pricing, lead time and availability for LCMXO3L-4300E-5UWG81ITR1K. Our team can assist with part selection and volume requirements.

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