LCMXO3L-4300E-6MG256C

The LCMXO3L-4300E-6MG256C is a member of the MachXO3 family of field programmable gate arrays. It combines a flexible on-chip architecture with non-volatile, multi-time programmable configuration and a range of embedded system features derived from the MachXO3 data sheet.

Designed for compact, surface-mount implementations, this device provides 4,320 logic elements, 206 user I/O pins, and approximately 0.094 Mbits of embedded RAM in a 256-pin VFBGA/CSPBGA package. It targets commercial-temperature applications requiring integrated I/O, embedded peripherals, and system-level support.

Key Features

• Core Logic — 4,320 logic elements and 540 logic blocks provide a compact programmable fabric suitable for glue logic, control functions and small to mid-scale FPGA tasks.
• Embedded Memory — 94,208 bits (approximately 0.094 Mbits) of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described in the MachXO3 family documentation.
• Rich I/O — 206 user I/O pins with the MachXO3 family’s flexible I/O buffering and pre‑engineered source synchronous I/O capabilities for diverse interface requirements.
• Embedded Hardened IP — Includes hardened I2C and SPI IP cores and a hardened timer/counter block as documented for the MachXO3 family, reducing soft-IP overhead for common peripherals.
• On‑chip Clocking and Oscillator — Flexible on-chip clocking resources including PLLs and an on-chip oscillator are provided for system timing and clock management.
• Non‑volatile, Multi‑time Programmable — The MachXO3 family supports non‑volatile configuration and multi-time programmability, enabling persistent system configurations and field updates.
• Package and Mounting — Supplied in a 256‑VFBGA (256‑CSFBGA, 9×9) surface-mount package to support compact board layouts.
• Power and Temperature — Operates from 1.14 V to 1.26 V supply rails and specified for commercial operating temperatures of 0 °C to 85 °C.
• System Support — Features such as User Flash Memory (UFM), TraceID, TransFR reconfiguration and enhanced system-level support are part of the MachXO3 family feature set.
• Compliance — RoHS compliant for environmental regulatory requirements.

Typical Applications

• System Control and Glue Logic — Use the device’s 4,320 logic elements and flexible I/O to implement board-level control, protocol bridging and interface translation.
• Embedded Peripheral Offload — Hardened I2C and SPI IP cores plus timers allow offloading common peripheral tasks from the main MCU or processor.
• Security and Configuration Management — Non-volatile multi-time programmable configuration and User Flash Memory (UFM) support persistent system settings and field updates.
• Compact, High‑I/O Designs — 206 I/O pins and advanced I/O buffering make this device suitable for compact systems that require many external interfaces in a small package.

Unique Advantages

• Highly Integrated Logic and Memory: 4,320 logic elements combined with approximately 0.094 Mbits of embedded RAM reduce external component count for control and data buffering functions.
• Extensive I/O Capacity: 206 user I/O pins with MachXO3 family I/O features simplify multi-protocol designs and high-pin-count interfacing in a single device.
• Hardened Peripheral IP: Built-in I2C, SPI and timer/counter blocks minimize the need for soft-core implementations and speed time-to-market.
• Non-volatile Configuration: Multi-time programmable non-volatile configuration supports persistent device behavior and convenient field reconfiguration.
• Compact Package: 256‑pin VFBGA (256‑CSFBGA, 9×9) surface-mount package enables dense board integration for space-constrained designs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet typical commercial electronics deployment conditions.

Why Choose LCMXO3L-4300E-6MG256C?

The LCMXO3L-4300E-6MG256C brings MachXO3 family capabilities—non‑volatile configuration, hardened peripheral IP, flexible on‑chip clocking and a compact, high‑I/O package—into a single, surface-mount FPGA optimized for commercial applications. Its combination of 4,320 logic elements, approximately 0.094 Mbits of embedded RAM and 206 I/O pins makes it suitable for designers seeking integrated system control, interface bridging and embedded peripheral offload in space-limited designs.

This device is appropriate for engineering teams and procurement focused on compact hardware platforms requiring persistent configuration, a rich set of on-chip features, and RoHS-compliant packaging. The MachXO3 family documentation provides detailed architectural and programming guidance for system-level integration.

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