LCMXO3L-4300E-6MG324I

The LCMXO3L-4300E-6MG324I is a MachXO3 family FPGA optimized for system control, interface consolidation and embedded peripheral integration. It combines a non-volatile, multi-time programmable architecture with on-chip clocking and hardened peripheral IP to simplify board-level designs.

Key device-level specifications include 4,320 logic elements, approximately 94 kbits (94,208 bits) of embedded RAM, 268 I/O pins, a 324-VFBGA surface-mount package, a 1.14–1.26 V supply range and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic — 4,320 logic elements providing flexible programmable resources for glue logic, control paths and custom finite-state machines.
• Embedded Memory — Approximately 94 kbits of sysMEM embedded block RAM to support FIFOs, buffering and small data structures.
• I/O Density and Flexibility — 268 I/O pins in a 324-VFBGA (supplier package: 324-CSFBGA, 10×10) package with programmable I/O cells and support for source-synchronous interfaces as documented for the MachXO3 family.
• Non‑volatile Configuration & Reconfiguration — Multi-time programmable, non-volatile configuration with TransFR reconfiguration and User Flash Memory (UFM) options described in the MachXO3 family datasheet.
• Embedded Hardened IP — On-chip hardened IP including I2C and SPI cores and a timer/counter to offload common peripheral tasks from external components.
• Clocking and Timing — Integrated clocking resources such as PLLs and an on-chip oscillator to support flexible clock management and source-synchronous designs.
• Power and Packaging — Surface-mount 324-VFBGA package with a recommended supply range of 1.14 V to 1.26 V; RoHS compliant.
• Industrial Reliability — Grade: Industrial with an operating temperature range of −40 °C to 100 °C and family-level features supporting standby modes and power-saving options.

Typical Applications

• Industrial Control and Automation — Use the device’s industrial temperature range, high I/O count and embedded timers to implement control logic and interface sensors or actuators.
• Interface Bridging & Protocol Conversion — Combine the 268 programmable I/Os with hardened SPI/I2C IP to consolidate protocol translation and board-level glue logic.
• Embedded Peripheral Consolidation — Offload SPI/I2C controllers and timing functions to the FPGA’s hardened IP and UFM to reduce external components and simplify system BOM.

Unique Advantages

• High I/O Count: 268 I/Os enable dense interfacing to peripherals, sensors and bus systems without additional I/O expanders.
• Non‑volatile, Multi‑time Programmability: Retain configuration across power cycles and support iterative development with reprogrammable, on-chip configuration memory.
• Integrated Peripheral IP: Hardened I2C, SPI and timer/counter cores reduce firmware and PCB complexity by providing tested on-chip building blocks.
• Compact, Industrial Packaging: 324‑VFBGA surface-mount package with RoHS compliance and −40 °C to 100 °C rating supports deployment in industrial environments.
• On‑chip Clocking and Power Options: Built‑in PLLs, an on‑chip oscillator and documented power‑saving modes enable flexible clock and power management.

Why Choose LCMXO3L-4300E-6MG324I?

The LCMXO3L-4300E-6MG324I positions MachXO3 family capabilities in a compact, industrial-grade package tailored for designs that require a balance of programmable logic, a large I/O count and embedded peripheral functions. Its non-volatile, multi-time programmable architecture and on-chip hardened IP simplify system integration, reduce external component count and accelerate development cycles.

This device is well suited to engineering teams building industrial control, interface bridging and embedded-peripheral consolidation solutions that need a reliable, field-reconfigurable FPGA with documented family-level features such as sysMEM block RAM, PLLs, on-chip oscillator and UFM.

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