LCMXO3L-640E-6MG121I

IC FPGA 100 I/O 121CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 100 65536 640 121-VFBGA, CSPBGA

Quantity 1,947 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package121-CSFBGA (6x6)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case121-VFBGA, CSPBGANumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3L-640E-6MG121I – MachXO3 FPGA, 640 logic elements, 100 I/Os, 121‑VFBGA

The LCMXO3L-640E-6MG121I is a MachXO3 family Field Programmable Gate Array (FPGA) offered in a compact 121‑VFBGA (CSPBGA) package. It provides a small, non‑volatile FPGA fabric with 640 logic elements and 100 user I/Os, targeted at industrial-grade embedded control and board‑level interfacing tasks.

Designed for integration into space‑constrained designs, this device combines on‑chip memory, flexible I/O and hardened peripheral IP from the MachXO3 series while supporting industrial operating conditions and a low core supply voltage range of 1.14 V to 1.26 V.

Key Features

  • Logic Capacity 640 logic elements suitable for glue logic, protocol bridging, and small control functions.
  • On‑chip Memory 65,536 bits of RAM (approximately 64 Kbits) for embedded block RAM needs such as FIFOs, small buffers, or lookup tables.
  • I/O Density 100 user I/Os in a single device, enabling multi‑interface and board interconnect tasks.
  • Non‑volatile, Multi‑time Programmable Configuration Series‑level capability to retain configuration without external configuration memory and support multiple reprogram cycles.
  • Flexible I/O and Clocking MachXO3 family features include source synchronous I/O, flexible on‑chip clocking and PLLs for system timing and interfacing requirements.
  • Hardened Peripherals Family datasheet documents embedded hardened IP such as I2C and SPI controllers and a timer/counter block for common system functions.
  • Advanced Packaging 121‑VFBGA (6 × 6 mm supplier package) surface‑mount package for compact board layouts.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Low Voltage Core Core supply specified between 1.14 V and 1.26 V for compatibility with low‑voltage system rails.
  • System-Level Support MachXO3 family features documented in the datasheet include on‑chip oscillator, user flash memory (UFM), standby and power saving modes, and hot‑socketing behavior.
  • Standards and Testing Family documentation includes configuration and testing support such as IEEE 1149.1‑compliant boundary scan testability.
  • RoHS Compliant Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control Use the device’s industrial temperature rating, compact package and I/O density to implement board‑level control, interface logic and local supervision functions.
  • Interface and Protocol Bridging Hardened I2C/SPI IP and flexible I/O/clocking make the device suitable for bridging peripherals and handling interface conversions between subsystems.
  • Embedded System Glue Logic Small FPGA fabric and on‑chip RAM are ideal for consolidating discrete logic, implementing state machines, and managing peripheral sequencing.

Unique Advantages

  • Compact, production‑ready package: The 121‑VFBGA CSPBGA package delivers 100 I/Os and dense functionality in a 6 × 6 mm footprint for space‑constrained boards.
  • Non‑volatile configuration: On‑device multi‑time programmable configuration removes the need for external configuration flash, simplifying BOM and board design.
  • Industrial robustness: Rated for −40 °C to 100 °C operation, enabling deployment in harsh industrial environments where extended temperature range is required.
  • System integration: Embedded memory, hardened peripheral IP and on‑chip clocking reduce the number of external components required for common embedded tasks.
  • Low core voltage operation: Narrow core supply range (1.14 V–1.26 V) supports low‑power system architectures and consistent power sequencing.

Why Choose LCMXO3L-640E-6MG121I?

The LCMXO3L-640E-6MG121I positions itself as a compact, industrial‑grade MachXO3 FPGA option for applications that need moderate logic capacity, ample I/O, and non‑volatile configuration in a small package. Its combination of 640 logic elements, approximately 64 Kbits of on‑chip RAM, hardened peripheral IP and family‑level system features provides a practical balance of integration and simplicity for embedded and board‑level designs.

This device is suitable for designers seeking a reliable, space‑efficient FPGA solution for industrial control, interface bridging and embedded glue logic, with long‑term value coming from its non‑volatile configuration, family documentation and system‑level features documented in the MachXO3 datasheet.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the LCMXO3L-640E-6MG121I.

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