LCMXO3L-640E-6MG121I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 100 65536 640 121-VFBGA, CSPBGA |
|---|---|
| Quantity | 1,947 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-CSFBGA (6x6) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-VFBGA, CSPBGA | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3L-640E-6MG121I – MachXO3 FPGA, 640 logic elements, 100 I/Os, 121‑VFBGA
The LCMXO3L-640E-6MG121I is a MachXO3 family Field Programmable Gate Array (FPGA) offered in a compact 121‑VFBGA (CSPBGA) package. It provides a small, non‑volatile FPGA fabric with 640 logic elements and 100 user I/Os, targeted at industrial-grade embedded control and board‑level interfacing tasks.
Designed for integration into space‑constrained designs, this device combines on‑chip memory, flexible I/O and hardened peripheral IP from the MachXO3 series while supporting industrial operating conditions and a low core supply voltage range of 1.14 V to 1.26 V.
Key Features
- Logic Capacity 640 logic elements suitable for glue logic, protocol bridging, and small control functions.
- On‑chip Memory 65,536 bits of RAM (approximately 64 Kbits) for embedded block RAM needs such as FIFOs, small buffers, or lookup tables.
- I/O Density 100 user I/Os in a single device, enabling multi‑interface and board interconnect tasks.
- Non‑volatile, Multi‑time Programmable Configuration Series‑level capability to retain configuration without external configuration memory and support multiple reprogram cycles.
- Flexible I/O and Clocking MachXO3 family features include source synchronous I/O, flexible on‑chip clocking and PLLs for system timing and interfacing requirements.
- Hardened Peripherals Family datasheet documents embedded hardened IP such as I2C and SPI controllers and a timer/counter block for common system functions.
- Advanced Packaging 121‑VFBGA (6 × 6 mm supplier package) surface‑mount package for compact board layouts.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Low Voltage Core Core supply specified between 1.14 V and 1.26 V for compatibility with low‑voltage system rails.
- System-Level Support MachXO3 family features documented in the datasheet include on‑chip oscillator, user flash memory (UFM), standby and power saving modes, and hot‑socketing behavior.
- Standards and Testing Family documentation includes configuration and testing support such as IEEE 1149.1‑compliant boundary scan testability.
- RoHS Compliant Meets RoHS environmental requirements.
Typical Applications
- Industrial Control Use the device’s industrial temperature rating, compact package and I/O density to implement board‑level control, interface logic and local supervision functions.
- Interface and Protocol Bridging Hardened I2C/SPI IP and flexible I/O/clocking make the device suitable for bridging peripherals and handling interface conversions between subsystems.
- Embedded System Glue Logic Small FPGA fabric and on‑chip RAM are ideal for consolidating discrete logic, implementing state machines, and managing peripheral sequencing.
Unique Advantages
- Compact, production‑ready package: The 121‑VFBGA CSPBGA package delivers 100 I/Os and dense functionality in a 6 × 6 mm footprint for space‑constrained boards.
- Non‑volatile configuration: On‑device multi‑time programmable configuration removes the need for external configuration flash, simplifying BOM and board design.
- Industrial robustness: Rated for −40 °C to 100 °C operation, enabling deployment in harsh industrial environments where extended temperature range is required.
- System integration: Embedded memory, hardened peripheral IP and on‑chip clocking reduce the number of external components required for common embedded tasks.
- Low core voltage operation: Narrow core supply range (1.14 V–1.26 V) supports low‑power system architectures and consistent power sequencing.
Why Choose LCMXO3L-640E-6MG121I?
The LCMXO3L-640E-6MG121I positions itself as a compact, industrial‑grade MachXO3 FPGA option for applications that need moderate logic capacity, ample I/O, and non‑volatile configuration in a small package. Its combination of 640 logic elements, approximately 64 Kbits of on‑chip RAM, hardened peripheral IP and family‑level system features provides a practical balance of integration and simplicity for embedded and board‑level designs.
This device is suitable for designers seeking a reliable, space‑efficient FPGA solution for industrial control, interface bridging and embedded glue logic, with long‑term value coming from its non‑volatile configuration, family documentation and system‑level features documented in the MachXO3 datasheet.
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