LCMXO3L-6900C-5BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA

Quantity 105 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3L-6900C-5BG256C – MachXO3 Field Programmable Gate Array (FPGA), 206 I/O, ~0.246 Mbits RAM, 6,864 logic elements, 256-LFBGA

The LCMXO3L-6900C-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It provides a non-volatile, multi-time programmable logic fabric with on-chip embedded memory and a broad set of system-level functions aimed at board-level control, interface bridging and glue-logic applications in commercial electronic products.

This device balances integration and flexibility with 6,864 logic elements, approximately 245,760 bits (≈0.246 Mbits) of embedded RAM, and 206 user I/O in a 256-lead LFBGA package. It is designed for surface-mount assembly and operates from a 2.375 V to 3.465 V supply over a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — Approximately 6,864 logic elements suitable for glue logic, interface control and moderate-density processing tasks.
  • Embedded Memory — Approximately 245,760 bits (≈0.246 Mbits) of on-chip RAM for buffering, FIFOs and small data stores; documented sysMEM support in the MachXO3 family.
  • I/O and Interface — 206 user I/O pins with flexible, programmable I/O cells and pre-engineered source-synchronous I/O blocks to simplify interface implementation.
  • Non-volatile Configuration — Multi-time programmable, non-volatile configuration for persistent system logic without requiring external configuration flash.
  • Clocking and Timing — Flexible on-chip clocking including PLL support as described in the MachXO3 family documentation for system timing and clock-domain management.
  • Embedded IP and Peripherals — Hardened IP functions referenced in the family datasheet, including I²C, SPI, timers/counters and on-chip oscillator for common peripheral needs.
  • Package & Mounting — 256‑lead LFBGA package (supplier device package: 256‑CABGA 14×14), surface-mount for compact board-level integration.
  • Power & Environmental — Supply range 2.375 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic — Use the 206 I/O and flexible I/O cells to implement level translation, protocol adaptation and board-level interface consolidation.
  • Peripheral and Sensor Aggregation — Combine embedded I/O, timers and hardened serial IP (I²C/SPI) to collect, pre-process and forward sensor or peripheral data.
  • Control and System Management — Implement system control, configuration management and small state machines using non-volatile configuration and built-in timers.
  • Display and User Interface Control — Drive and manage user interfaces or small displays where moderate logic density and multiple I/O are required.

Unique Advantages

  • Non-volatile, Multi-time Programmable Configuration: Preserve system logic without external configuration memory and allow field updates when needed.
  • Integrated Peripheral IP: Hardened I²C, SPI and timer/counter IP reduce design effort and decrease bill-of-materials compared to discrete implementations.
  • Compact, High-I/O Package: 256‑lead LFBGA with 206 I/O provides a high pin-count solution in a compact 14×14 form factor for space-constrained boards.
  • Flexible On-chip Clocking: Built-in PLLs and clocking resources support multiple clock domains and timing topologies documented for the MachXO3 family.
  • Commercial-grade Fit: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial electronics manufacturing and environmental requirements.

Why Choose LCMXO3L-6900C-5BG256C?

The LCMXO3L-6900C-5BG256C positions itself as a compact, integrated FPGA for commercial applications that need reliable non-volatile configuration, flexible I/O and embedded peripheral support. Its combination of approximately 6,864 logic elements, ~0.246 Mbits of on-chip RAM and 206 I/O in a 256‑LFBGA package makes it a practical choice for board-level control, interface bridging and peripheral aggregation without adding external configuration memory.

Choose this MachXO3 device when you need modest logic capacity, built-in peripheral IP and a surface-mount, RoHS-compliant package suitable for mainstream commercial designs. The MachXO3 family documentation provides detailed architecture and system-level features to support design integration and scalability within the family.

Request a quote or submit an inquiry for LCMXO3L-6900C-5BG256C to receive pricing and availability information for your next design.

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