LCMXO3L-6900C-5BG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-LFBGA |
|---|---|
| Quantity | 105 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO3L-6900C-5BG256C – MachXO3 Field Programmable Gate Array (FPGA), 206 I/O, ~0.246 Mbits RAM, 6,864 logic elements, 256-LFBGA
The LCMXO3L-6900C-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It provides a non-volatile, multi-time programmable logic fabric with on-chip embedded memory and a broad set of system-level functions aimed at board-level control, interface bridging and glue-logic applications in commercial electronic products.
This device balances integration and flexibility with 6,864 logic elements, approximately 245,760 bits (≈0.246 Mbits) of embedded RAM, and 206 user I/O in a 256-lead LFBGA package. It is designed for surface-mount assembly and operates from a 2.375 V to 3.465 V supply over a commercial temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity — Approximately 6,864 logic elements suitable for glue logic, interface control and moderate-density processing tasks.
- Embedded Memory — Approximately 245,760 bits (≈0.246 Mbits) of on-chip RAM for buffering, FIFOs and small data stores; documented sysMEM support in the MachXO3 family.
- I/O and Interface — 206 user I/O pins with flexible, programmable I/O cells and pre-engineered source-synchronous I/O blocks to simplify interface implementation.
- Non-volatile Configuration — Multi-time programmable, non-volatile configuration for persistent system logic without requiring external configuration flash.
- Clocking and Timing — Flexible on-chip clocking including PLL support as described in the MachXO3 family documentation for system timing and clock-domain management.
- Embedded IP and Peripherals — Hardened IP functions referenced in the family datasheet, including I²C, SPI, timers/counters and on-chip oscillator for common peripheral needs.
- Package & Mounting — 256‑lead LFBGA package (supplier device package: 256‑CABGA 14×14), surface-mount for compact board-level integration.
- Power & Environmental — Supply range 2.375 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic — Use the 206 I/O and flexible I/O cells to implement level translation, protocol adaptation and board-level interface consolidation.
- Peripheral and Sensor Aggregation — Combine embedded I/O, timers and hardened serial IP (I²C/SPI) to collect, pre-process and forward sensor or peripheral data.
- Control and System Management — Implement system control, configuration management and small state machines using non-volatile configuration and built-in timers.
- Display and User Interface Control — Drive and manage user interfaces or small displays where moderate logic density and multiple I/O are required.
Unique Advantages
- Non-volatile, Multi-time Programmable Configuration: Preserve system logic without external configuration memory and allow field updates when needed.
- Integrated Peripheral IP: Hardened I²C, SPI and timer/counter IP reduce design effort and decrease bill-of-materials compared to discrete implementations.
- Compact, High-I/O Package: 256‑lead LFBGA with 206 I/O provides a high pin-count solution in a compact 14×14 form factor for space-constrained boards.
- Flexible On-chip Clocking: Built-in PLLs and clocking resources support multiple clock domains and timing topologies documented for the MachXO3 family.
- Commercial-grade Fit: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial electronics manufacturing and environmental requirements.
Why Choose LCMXO3L-6900C-5BG256C?
The LCMXO3L-6900C-5BG256C positions itself as a compact, integrated FPGA for commercial applications that need reliable non-volatile configuration, flexible I/O and embedded peripheral support. Its combination of approximately 6,864 logic elements, ~0.246 Mbits of on-chip RAM and 206 I/O in a 256‑LFBGA package makes it a practical choice for board-level control, interface bridging and peripheral aggregation without adding external configuration memory.
Choose this MachXO3 device when you need modest logic capacity, built-in peripheral IP and a surface-mount, RoHS-compliant package suitable for mainstream commercial designs. The MachXO3 family documentation provides detailed architecture and system-level features to support design integration and scalability within the family.
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