LCMXO3L-6900C-5BG400C

The LCMXO3L-6900C-5BG400C is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for configurable system control and I/O-intensive designs. It combines a mid-range fabric of 6,864 logic elements with abundant I/O and embedded memory to support flexible interfacing, on-chip buffering and in-system configurability.

Engineered for commercial-grade applications, the device provides non-volatile, multi-time programmable configuration and series-level features such as flexible on-chip clocking, programmable I/O, embedded block RAM, and hardened peripheral IP to simplify system design and integration.

Key Features

• Logic Capacity — 6,864 logic elements suitable for glue logic, control, and moderate-complexity programmable logic functions.
• Embedded Memory — Approximately 0.246 Mbits of on-chip RAM (245,760 total bits) for FIFOs, buffering and small data structures.
• I/O Density — 335 general-purpose I/Os to support wide interfacing and multiple peripheral connections.
• Flexible Power — Operates from a 2.375 V to 3.465 V supply range, enabling compatibility with common single- and multi-voltage systems.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Advanced Packaging — 400-LFBGA package (supplier package: 400-CABGA, 17×17) in a surface-mount form factor for compact board integration.
• Non-volatile, Multi-time Programmable Configuration — Series-level capability for persistent configuration without external flash.
• Programmable I/O and I/O Buffering — Series features include high-performance, flexible I/O buffers and pre‑engineered source synchronous I/O options for robust interface design.
• Clocking and Timing — Flexible on-chip clocking and sysCLOCK PLLs for system timing management.
• Embedded Peripherals — Series-level hardened IP functions such as I²C, SPI and timer/counter blocks for common peripheral control tasks.
• On-chip Oscillator and UFM — Integrated oscillator and user flash memory (UFM) for compact system architectures and configuration storage.
• System Reliability Features — Support for IEEE 1149.1 boundary-scan testability, hot-socketing options, standby mode and power-saving features described at the family level.
• Compliance — RoHS compliant and supplied as a commercial-grade device.

Typical Applications

• I/O Expansion & Interface Bridging — Use the high I/O count and flexible buffer options to implement protocol bridging, level translation and parallel/serial interfacing.
• System Control and Supervision — Implement supervisory logic, peripheral control and state machines using the on-chip logic fabric and hardened timer/IP blocks.
• Data Buffering and FIFO — Leverage approximately 0.246 Mbits of embedded RAM and FIFO modes supported at the family level for temporary data storage and stream alignment.
• Configuration and Boot Management — Non-volatile, multi-time programmable configuration and UFM simplify in-field updates and compact configuration storage.

Unique Advantages

• Highly integrated logic and I/O: 6,864 logic elements combined with 335 I/Os reduces external glue logic and simplifies board-level routing.
• On-chip memory for buffering: Approximately 0.246 Mbits of embedded RAM supports local FIFOs and small data structures without external memory.
• Persistent configuration: Non-volatile, multi-time programmable configuration removes the need for separate configuration flash in many designs.
• Flexible clocking and timing: On-chip PLLs and clock distribution options enable tailored timing architectures for diverse system requirements.
• Compact package: 400-LFBGA surface-mount package (400-CABGA, 17×17) enables dense board layouts while providing high pin count.
• Design-for-test and system-level support: Boundary-scan testability, hot-socketing and power-saving modes help streamline manufacturing test and system integration.

Why Choose LCMXO3L-6900C-5BG400C?

The LCMXO3L-6900C-5BG400C positions itself as a versatile, commercially graded MachXO3 family FPGA for designs that require significant I/O density, modest logic capacity and embedded memory in a compact package. Its combination of non-volatile configuration, hardened peripheral IP, and family-level features such as flexible on-chip clocking and programmable I/O make it well suited to control, interfacing and buffering roles in a wide range of commercial electronic products.

Choose this device when you need an integrated, programmable building block that simplifies board-level design, supports in-field reconfiguration, and offers series-level architecture and test features to accelerate development and deployment.

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