LCMXO3L-6900C-6BG256I

The LCMXO3L-6900C-6BG256I is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It combines a flexible programmable fabric with on-chip memory and a high I/O count in a compact 256-ball LFBGA package for space-constrained board designs.

Engineered for industrial-grade environments, this device offers 6,864 logic elements, 858 logic blocks, approximately 0.246 Mbits of embedded RAM and 206 user I/Os, with a supply voltage range of 2.375 V to 3.465 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  6,864 logic elements and 858 logic blocks enable moderate-density programmable logic integration for glue logic, control functions, and custom peripherals.
• Embedded Memory  Approximately 0.246 Mbits of on-chip RAM (245,760 total RAM bits) supports data buffering, FIFOs and small lookup tables without external memory.
• I/O and Interfaces  206 user I/Os provide broad external connectivity; the MachXO3 family datasheet highlights pre-engineered source-synchronous I/O and flexible I/O buffering options.
• Configuration and System IP  Based on MachXO3 family documentation, the device supports non-volatile, multi-time programmable configuration and embedded system-level features such as on-chip oscillators and hardened peripheral IP.
• Clocking  Integrated clocking resources are provided, including PLLs and flexible on-chip clock distribution as described in the MachXO3 family datasheet.
• Package and Assembly  256-ball LFBGA (supplier package listed as 256-CABGA 14×14) surface-mount package suited to high-density PCB layouts.
• Industrial Grade and Reliability  Rated for industrial operating temperatures from −40 °C to 100 °C and RoHS compliant.
• Power  Supported supply voltage range of 2.375 V to 3.465 V to accommodate common board power rails.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature range (−40 °C to 100 °C) and a high I/O count make the device suitable for interfacing sensors, actuators and control logic in factory and building automation equipment.
• Edge Logic and Glue  Compact BGA packaging, moderate logic density and embedded RAM support consolidation of glue logic, protocol bridging and custom peripheral functions on space-constrained boards.
• Communications and I/O Expansion  With 206 user I/Os and flexible I/O buffering noted in the MachXO3 documentation, the device can serve as an I/O expander or interface bridge between subsystems.

Unique Advantages

• High I/O Density: 206 user I/Os provide extensive external connectivity for mixed-signal and multi-peripheral systems.
• Compact, Board-Friendly Package: 256-LFBGA (256-CABGA 14×14) offers a small footprint for high-density PCB designs.
• Non-volatile, Reprogrammable Configuration: MachXO3 family features include multi-time programmable non-volatile configuration, simplifying in-field updates and iteration.
• Embedded Memory for Local Buffers: Approximately 0.246 Mbits of on-chip RAM reduces dependence on external memory for small buffering and FIFO needs.
• Wide Operating Range: Industrial temperature rating (−40 °C to 100 °C) and a 2.375 V–3.465 V supply range support robust operation across varied environments and power architectures.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs.

Why Choose LCMXO3L-6900C-6BG256I?

The LCMXO3L-6900C-6BG256I positions itself as a versatile, industrial-grade FPGA option within the MachXO3 family, balancing moderate logic capacity (6,864 logic elements) with a high I/O count (206) and on-chip memory (245,760 bits). Its compact 256-ball BGA footprint and wide supply and temperature ranges make it suitable for engineers seeking to consolidate control logic, interface functions, and small memory buffers into a single programmable device.

This part is well suited for designs that require reprogrammable, non-volatile configuration and system-level IP found in the MachXO3 family, offering a stable platform for mid-density embedded applications where board space, I/O density and industrial robustness are priorities.

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