LCMXO3L-6900C-6BG400C

The LCMXO3L-6900C-6BG400C is a MachXO3 family Field Programmable Gate Array (FPGA) provided in a 400‑LFBGA package. It delivers 6,864 logic elements, 245,760 bits of on-chip RAM and up to 335 I/Os in a surface-mount 400‑CABGA (17×17) footprint for commercial embedded and electronic designs.

Built on the MachXO3 architecture, the device combines configurable logic, embedded memory and flexible I/O capabilities with non-volatile, multi-time programmable configuration and on-chip system features described in the MachXO3 data sheet.

Key Features

• Programmable Logic Capacity — 6,864 logic elements provide configurable resources for glue logic, control functions and moderate-density FPGA implementations.
• Embedded Memory — 245,760 bits of on-chip RAM for data buffering, FIFOs and small embedded datasets.
• High I/O Count — Up to 335 I/Os to support dense external device interfacing and board-level connectivity.
• Flexible I/O and Clocking — MachXO3 family features like pre‑engineered source‑synchronous I/O, flexible I/O buffers and on‑chip clocking (PLLs and clock distribution) are available in the device architecture.
• Embedded Peripheral IP — Family-level hardened IP functions such as I²C, SPI and timer/counter blocks, plus user flash memory (UFM) and an on‑chip oscillator are included in the MachXO3 architecture.
• Non-volatile, Multi-time Programmable Configuration — Supports non‑volatile configuration and TransFR reconfiguration capability as part of the MachXO3 family feature set.
• Package & Mounting — 400‑LFBGA package (supplier device package: 400‑CABGA, 17×17) optimized for surface-mount assembly.
• Power and Temperature — Recommended supply range of 2.375 V to 3.465 V and operating temperature range of 0 °C to 85 °C for commercial applications.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the device for control logic, peripheral bridging and custom finite-state machines where 6,864 logic elements and abundant I/O are required.
• Interface and I/O Expansion — 335 I/Os and flexible I/O buffering make the part suitable for expanding or consolidating board-level interfaces and sensor connections.
• Protocol Bridging and Glue Logic — On-chip RAM and hardened peripheral IP enable implementation of protocol adapters, small FIFOs and timing-critical glue logic.
• Consumer and Communications Equipment — The combination of logic capacity, embedded memory and non‑volatile configuration supports feature integration in commercial consumer and communications products.

Unique Advantages

• Balanced Logic and Memory: 6,864 logic elements coupled with 245,760 bits of RAM allow efficient partitioning of control and data buffering functions on a single device.
• High-Density I/O: Up to 335 I/Os reduce the need for external bus expanders and simplify PCB routing for multi-device interfaces.
• Non-volatile Programmability: Multi-time programmable, non‑volatile configuration enables field updates and flexible deployment without external configuration flash.
• Integrated System IP: Embedded I²C, SPI, timer/counter blocks and UFM provide ready-to-use building blocks that simplify firmware and hardware development.
• Commercial-Focused Thermal Profile: Specified for 0 °C to 85 °C operation to match commercial electronics design requirements.
• Compact Surface-Mount Package: 400‑LFBGA (17×17) offers a compact footprint for space-constrained board designs while supporting high I/O counts.

Why Choose LCMXO3L-6900C-6BG400C?

The LCMXO3L-6900C-6BG400C positions MachXO3 family architecture into a commercially graded FPGA with a strong balance of logic, embedded memory and I/O density. Its non‑volatile, multi‑time programmable configuration, family-level hardened IP and flexible I/O/clocking architecture make it suitable for designers looking to consolidate glue logic, interface functions and small embedded data paths into a single, surface-mount device.

This part is targeted at commercial embedded and consumer electronics designs that require moderate logic capacity, significant I/O and on-chip memory while leveraging MachXO3 family features for integration and field reconfiguration.

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