LCMXO3L-6900E-5MG324C

The LCMXO3L-6900E-5MG324C is a MachXO3 family field-programmable gate array from Lattice Semiconductor Corporation. It provides reconfigurable logic, embedded memory, programmable I/O and on-chip system support in a compact 324-VFBGA package.

With approximately 6,864 logic elements, roughly 0.246 Mbits of embedded RAM, and up to 281 I/Os, this commercial-grade FPGA targets designs that require flexible I/O, on-chip memory, and non-volatile, multi-time programmable configuration in a surface-mount 10×10 324-CSFBGA footprint. Supply voltage ranges from 1.14 V to 1.26 V and the device is specified for 0 °C to 85 °C operation. The device is RoHS compliant.

Key Features

• Logic Capacity  Approximately 6,864 logic elements for implementing glue logic, control functions and custom digital processing.
• Embedded Memory  About 245,760 bits (~0.246 Mbits) of on-chip RAM for buffering, state storage and small lookup tables.
• High I/O Count  Up to 281 programmable I/O pins to support dense peripheral and bus interfacing in a single device.
• Non-volatile, Multi-time Programmable Configuration  MachXO3 family non-volatile configuration allows field reprogramming without external flash.
• Programmable I/O and Source-Synchronous Support  Flexible on-chip I/O buffering and pre-engineered source-synchronous I/O options to simplify timing for external interfaces.
• Clocking and PLLs  Flexible on-chip clocking with phase-locked loop (PLL) support for system clock management.
• Embedded Hardened IP  Includes hardened I²C and SPI IP cores plus timer/counter blocks to reduce logic utilization for common system functions.
• On-Chip Oscillator and UFM  Integrated oscillator and User Flash Memory (UFM) for small system needs and configuration storage.
• Power and Packaging  Surface-mount 324-VFBGA (supplier package: 324-CSFBGA, 10×10) in a commercial temperature grade (0 °C to 85 °C). Supply voltage: 1.14 V–1.26 V.
• Power Management Features  Standby mode and power-saving options described in the MachXO3 family documentation for reduced system power in idle states.

Typical Applications

• Interface and Peripheral Bridging  Use the device's high I/O count and hardened SPI/I²C blocks to implement protocol bridges and peripheral interfaces.
• System Glue Logic  Leverage the logic elements and on-chip memory for board-level control, signal multiplexing and timing adaptation between subsystems.
• Embedded Control and Sequencing  Implement control state machines, timers and configuration storage using the timer/counter blocks and UFM for reliable boot and operation sequences.
• User Interface and I/O Expansion  Drive and manage displays, buttons, LEDs and other user-interface elements with the device’s programmable I/O and embedded resources.

Unique Advantages

• High integration in a compact package: Combines thousands of logic elements, embedded RAM and up to 281 I/Os in a 324-VFBGA (10×10) surface-mount package to reduce board area and BOM complexity.
• Non-volatile configuration: Multi-time programmable non-volatile configuration removes the need for external configuration flash for many designs.
• Embedded peripheral IP: Hardened I²C, SPI and timer/counter blocks free up logic resources and simplify implementation of common system functions.
• Flexible clocking and I/O: On-chip PLLs and programmable I/O buffers support varied interface timing and source-synchronous requirements directly on the device.
• Documented family features: As part of the MachXO3 family, the device is supported by family-level documentation covering architecture, memory modes, I/O behavior and configuration options.
• RoHS compliant: Meets RoHS status for environmentally conscious assemblies.

Why Choose LCMXO3L-6900E-5MG324C?

The LCMXO3L-6900E-5MG324C offers a balance of reconfigurable logic density, embedded RAM and a high I/O count in a compact 324-VFBGA package. Its MachXO3 family features—non-volatile multi-time programming, hardened peripheral IP, flexible clocking and programmable I/O—make it well suited for designs that need on-board configuration, interface flexibility and integrated system functions without external configuration memory.

This device is aimed at designers who require a commercial-grade, surface-mount FPGA with documented MachXO3 architecture and system-level features, enabling scalable designs that consolidate glue logic, interface bridging and small embedded storage into a single component.

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