LCMXO3L-6900E-6MG256I

The LCMXO3L-6900E-6MG256I is a MachXO3 family FPGA IC from Lattice Semiconductor, delivered in a compact 256‑VFBGA (CSPBGA) package. The device provides 6,864 logic elements, 245,760 bits of embedded RAM, and up to 206 general-purpose I/O pins in a surface-mount footprint designed for industrial temperature operation.

MachXO3 family capabilities documented in the product datasheet — including non‑volatile, multi‑time programmable configuration, flexible on‑chip clocking, hardened peripheral IP blocks, and flexible I/O buffering — are available on this part, enabling integration of configuration, I/O expansion, and system-level glue logic within a single device.

Key Features

• Core Logic — 6,864 logic elements provide the programmable fabric for custom logic, state machines, and glue logic.
• Embedded Memory — 245,760 bits of on‑chip RAM (approximately 0.246 Mbits) for data buffering, FIFOs, and small embedded storage.
• I/O Capacity & Flexibility — Up to 206 I/O pins supported; MachXO3 family documentation includes sysI/O buffer functionality and pre‑engineered source‑synchronous I/O options for flexible interface design.
• Non‑volatile Configuration — MachXO3 family supports non‑volatile, multi‑time programmable configuration and TransFR reconfiguration capability as described in the datasheet.
• Clocking & Timing — Family-level features include on‑chip oscillators and sysCLOCK PLLs for flexible on‑chip clocking and frequency synthesis.
• Hardened Peripheral IP — Datasheet references embedded hardened functions such as I²C and SPI IP cores, timers/counters, and user flash memory (UFM) for system integration.
• Power & Supply — Core operating voltage range from 1.14 V to 1.26 V to match low‑voltage designs.
• Package & Mounting — 256‑VFBGA (CSPBGA) surface‑mount package; supplier device package listed as 256‑CSFBGA (9×9).
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS‑compliant device.

Unique Advantages

• Highly integrated programmable fabric: 6,864 logic elements plus embedded RAM reduce external component count for glue‑logic and control functions.
• Non‑volatile field programmability: Multi‑time programmable configuration enables iterative development and in‑field updates without external configuration flash.
• Flexible I/O and clock resources: Family documentation highlights sysI/O buffering, source‑synchronous I/O and on‑chip PLLs/oscillators, simplifying interface timing and clocking requirements.
• Compact industrial package: 256‑VFBGA CSPBGA package offers a small footprint while supporting 206 I/O, helping preserve board space in dense designs.
• Low‑voltage core compatibility: 1.14–1.26 V supply range supports integration into modern low‑voltage system rails.
• Embedded peripheral IP: Hardened I²C, SPI, timers and UFM options reduce development effort and improve system reliability compared with fully soft implementations.

Why Choose LCMXO3L-6900E-6MG256I?

This MachXO3 part combines a mid‑density programmable fabric with family‑level features documented in the datasheet — non‑volatile configuration, embedded memory, flexible I/O buffering, on‑chip clocking and hardened peripheral IP — packaged in a compact 256‑VFBGA suitable for industrial temperature ranges. It is positioned for designs that require moderate logic capacity, substantial I/O count, and reliable non‑volatile programmability in a small surface‑mount form factor.

Backed by Lattice Semiconductor’s MachXO3 family documentation and IP resources, the LCMXO3L‑6900E‑6MG256I offers a practical balance of integration and configurability for system designers and embedded engineers seeking to consolidate glue logic, I/O expansion and control functions while maintaining industrial operating range and RoHS compliance.

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