LCMXO3L-6900E-6MG256C

The LCMXO3L-6900E-6MG256C is a MachXO3 family field programmable gate array (FPGA) offered in a 256-ball VFBGA/CSPBGA package. It provides 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and 206 general-purpose I/Os in a commercial-grade, surface-mount package.

Designed for applications that require flexible on-chip logic, moderate embedded memory, and a large I/O count, this device delivers a combination of integration and configurability enabled by MachXO3 family architecture and on-chip features documented in the datasheet.

Key Features

• Logic Capacity — 6,864 logic elements suitable for glue logic, control functions, and moderate FPGA designs.
• Embedded Memory — Approximately 0.246 Mbits of on-chip RAM (245,760 bits) for buffering, small FIFOs, and state storage.
• I/O Density — 206 I/Os to support multiple peripherals, parallel interfaces, and board-level connectivity.
• Package and Mounting — Available in 256-VFBGA / CSPBGA package, supplier device package 256-CSFBGA (9×9); surface-mount mounting for standard PCB assembly.
• Low-Voltage Core — Core supply range from 1.14 V to 1.26 V, enabling compatibility with low-voltage system architectures.
• Commercial Temperature Grade — Specified operating temperature from 0 °C to 85 °C for commercial applications.
• Non-volatile, Multi-time Programmable — MachXO3 family capability for non-volatile configuration and multiple programming cycles as documented in the datasheet.
• Embedded Hardened IP — Family-level documentation includes hardened I²C, SPI, and timer/counter blocks for common peripheral functions.
• On-chip Clocking and Oscillator — Flexible on-chip clocking options and an on-chip oscillator are part of the MachXO3 feature set described in the datasheet.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Embedded Control and Glue Logic — Implement board-level control, protocol bridging, and sequencing tasks with the device’s logic and I/O resources.
• Interface and I/O Aggregation — Consolidate multiple interfaces or expand I/O capability where moderate logic and on-chip RAM are sufficient.
• Peripheral and Sensor Hubs — Use the embedded memory and I/O density to buffer sensor data, manage peripherals, or implement small FIFO-based interfaces.
• Prototype and Evaluation — Rapidly validate digital functions and system integration on a commercial-temperature FPGA platform.

Unique Advantages

• High I/O Count: 206 available I/Os enable broad board-level connectivity and multiple peripheral interfaces without external multiplexing.
• Integrated Non-volatile Configuration: MachXO3 family non-volatile, multi-time programmable architecture simplifies system boot behavior and reduces external configuration components.
• Balanced Logic and Memory: 6,864 logic elements paired with approximately 0.246 Mbits of embedded RAM provide a balance of combinational/sequential logic and local memory for common application tasks.
• Compact, Surface-Mount Package: 256-ball VFBGA/CSPBGA (256-CSFBGA 9×9) package supports densely packed PCB designs while keeping the device surface-mount compatible.
• Low-Voltage Operation: Core supply range of 1.14 V to 1.26 V aligns with low-voltage system domains and power-optimized platforms.
• Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial deployments.

Why Choose LCMXO3L-6900E-6MG256C?

The LCMXO3L-6900E-6MG256C positions itself as a flexible, commercially graded FPGA option within the MachXO3 family, offering a practical mix of logic capacity, embedded RAM, and a high I/O count in a compact surface-mount package. Its non-volatile, multi-time programmable architecture and family-level hardened IP blocks (I²C, SPI, timer/counter) support development of reliable system control, interface bridging, and peripheral aggregation designs.

This device is suitable for teams and projects that require a balanced FPGA resource set with low-voltage operation and commercial temperature range—providing design scalability and on-board integration while leveraging the documented MachXO3 family capabilities in the datasheet.

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