LCMXO3L-6900E-5MG324I

The LCMXO3L-6900E-5MG324I is a MachXO3 family FPGA from Lattice Semiconductor Corporation, delivering reprogrammable logic and flexible I/O in a compact 324-VFBGA package. It combines 6,864 logic elements across 858 logic blocks with approximately 0.246 Mbits of embedded RAM and 281 user I/Os, making it suitable for industrial designs that require configurable logic, on-chip memory and extensive I/O connectivity.

Device-level features described in the MachXO3 family data sheet include non-volatile multi-time programmability, TransFR reconfiguration, embedded hardened IP (I2C, SPI, timers/counters), on-chip oscillator and PLL-based clocking, and system-level power-saving and standby capabilities.

Key Features

• Core & Logic — 6,864 logic elements organized across 858 logic blocks provide flexible programmable fabric for custom logic and system glue functions.
• Embedded Memory — Approximately 0.246 Mbits (245,760 bits) of on-chip RAM suitable for buffering, FIFOs and small data structures.
• I/O & Interfaces — 281 user I/O pins with pre-engineered source-synchronous I/O and high-performance, flexible I/O buffer architecture as described for the MachXO3 family.
• Configuration & Reconfiguration — Non-volatile, multi-time programmable configuration with TransFR reconfiguration support for flexible system updates.
• Clocking & Timing — On-chip oscillator and sysCLOCK PLL support for flexible on-chip clock generation and distribution (documented in the MachXO3 data sheet).
• Embedded Hardened IP — Hardened I2C and SPI cores, and timer/counter IP blocks are included in the family data sheet, enabling common control and interface tasks without consuming fabric resources.
• Power Management — Standby mode and power-saving options described in the family data sheet help manage system-level power consumption.
• Package & Mounting — Surface-mount 324-VFBGA (supplier device package 324-CSFBGA (10x10)) for high-density board integration.
• Electrical & Environmental — Nominal voltage supply range 1.14 V to 1.26 V; industrial operating temperature range from -40 °C to 100 °C; RoHS compliant.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating (-40 °C to 100 °C), extensive I/O count and reprogrammable logic for factory automation and process-control tasks.
• Interface Bridging and Glue Logic — The combination of 6,864 logic elements, embedded RAM and hardened I/O/IP blocks supports protocol adaptation, signal aggregation and interface conversion functions.
• Embedded System Orchestration — On-chip timers, SPI and I2C IP and flexible clocking make the device suitable for coordinating sensors, peripherals and system management functions.

Unique Advantages

• Highly integrated logic and I/O: 6,864 logic elements and 281 I/Os reduce external glue logic and simplify board-level routing.
• On-chip memory and IP: Approximately 0.246 Mbits of embedded RAM plus hardened I2C, SPI and timer/counter IP preserve fabric for application logic.
• Reprogrammable, non-volatile configuration: Multi-time programmable, non-volatile configuration enables field updates and iterative development without external configuration memory.
• Industrial-ready thermal range: Rated from -40 °C to 100 °C to meet temperature requirements for many industrial deployments.
• Compact, manufacturable package: 324-VFBGA surface-mount packaging (324-CSFBGA (10x10)) supports dense PCB implementations.
• System-level clocking and power options: On-chip oscillator, PLLs and documented standby/power-saving modes facilitate integrated clock management and power optimization.

Why Choose LCMXO3L-6900E-5MG324I?

The LCMXO3L-6900E-5MG324I positions itself as a flexible, industrial-grade MachXO3 family FPGA that balances programmable logic, embedded memory and a high I/O count in a compact 324-VFBGA package. Its non-volatile, multi-time programmable configuration, TransFR reconfiguration capability, and family-documented hardened IP and clocking features make it suitable for designs requiring field-updatable logic, interface consolidation and on-chip peripheral control.

Engineers and procurement teams selecting this part gain a platform documented by the MachXO3 family data sheet that supports system-level power modes, robust I/O buffering and hardened peripheral cores, with a defined operating voltage window (1.14 V–1.26 V) and industrial temperature range for deployment in demanding environments.

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