LCMXO3L-6900E-5MG256I

The LCMXO3L-6900E-5MG256I is a MachXO3 family FPGA IC offering 6,864 logic elements and approximately 0.246 Mbits of embedded RAM (245,760 bits) in a 256‑VFBGA / CSPBGA package. Designed for system-level integration, the device provides flexible on-chip resources and hardened peripheral IP that support a range of embedded control, interface, and glue-logic tasks.

With 206 user I/Os, non-volatile multi-time programmable configuration, and support for on-chip clocking and reconfiguration features described in the MachXO3 family datasheet, this part targets industrial applications requiring robust temperature range and compact surface-mount package options.

Key Features

• Core Capacity  Provides 6,864 logic elements for implementing custom logic, state machines, and glue logic within the MachXO3 architecture.
• Embedded Memory  Approximately 0.246 Mbits of on-chip RAM (245,760 bits) suitable for small frame buffers, FIFOs, and register storage; supports single/dual/pseudo-dual port and FIFO modes as described in the MachXO3 memory architecture.
• Rich I/O  206 user I/Os allow broad interfacing to external devices and subsystems, with pre-engineered source-synchronous I/O and flexible I/O buffer options included in the family architecture.
• Configurable Clocking  On-chip clocking features including PLLs and an internal oscillator provide flexible clock management and system timing options.
• Hardened IP and Peripherals  Includes embedded hardened functions such as I²C and SPI IP cores and timers/counters, plus User Flash Memory (UFM) for persistent storage as detailed in the MachXO3 family documentation.
• Non-volatile, Reconfigurable  Multi-time programmable non-volatile configuration and TransFR reconfiguration support enable field updates and system-level flexibility.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial-grade applications requiring extended temperature support.
• Low-Voltage Core Supply  Core voltage supply range 1.14 V to 1.26 V to match system power-rail designs.
• Package & Mounting  256‑VFBGA (256‑CSFBGA, 9×9) surface-mount package for compact PCB integration and high I/O density.
• Testability & Configuration  Supports IEEE 1149.1-compliant boundary-scan testability and documented device configuration and testing flows in the MachXO3 datasheet.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Use the FPGA for control logic, protocol bridging, and sensor interfacing where extended temperature range and robust I/O count are required.
• Embedded System Glue Logic  Implement custom timing, bus adaptation, and peripheral aggregation to reduce external components and simplify PCB design.
• Communications and Protocol Conversion  Leverage high I/O density and configurable I/O timing to perform protocol translation and interface buffering between subsystems.
• Instrumentation and Test Equipment  Integrate deterministic control, on-chip timers, and boundary-scan support to enhance testability and feature integration in compact instrument designs.

Unique Advantages

• Highly integrated I/O and logic density: 6,864 logic elements combined with 206 I/Os enable consolidation of multiple discrete functions into a single device, reducing BOM and board area.
• Field reprogrammability with non-volatile storage: Multi-time programmable configuration and UFM allow in-field updates and persistent data storage without external configuration memory.
• Built-in peripheral IP: Hardened I²C, SPI, and timer/counter blocks reduce design effort and free programmable logic for differentiated functions.
• Industrial-ready operating range: −40 °C to 100 °C rating supports deployment in industrial environments where temperature resilience is required.
• Compact, high-density packaging: 256‑VFBGA (9×9) surface-mount package provides a balance of I/O count and board footprint for space-constrained designs.
• Comprehensive system-level features: On-chip PLLs, oscillator, reconfiguration options, and boundary-scan testability simplify clocking, system integration, and manufacturing test flow.

Why Choose LCMXO3L-6900E-5MG256I?

The LCMXO3L-6900E-5MG256I positions itself as a versatile system integration device for engineers who need moderate logic capacity, significant I/O, and embedded memory in a compact, industrial-temperature package. Its MachXO3 family capabilities—non-volatile configuration, hardened peripheral IP, flexible clocking, and on-chip memory—help reduce external components and accelerate development cycles.

This FPGA is suitable for designs that require field reprogrammability, a reliable temperature range, and a dense pinout for interfacing. The combination of on-chip resources and system-level features makes it a pragmatic choice for embedded control, interface consolidation, and industrial automation applications where long-term supportability and design flexibility are priorities.

Request a quote or submit a sales inquiry to evaluate LCMXO3L-6900E-5MG256I for your next design and confirm availability and pricing for your project requirements.