LCMXO3L-6900E-5MG256C

IC FPGA 206 I/O 256CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-VFBGA, CSPBGA

Quantity 529 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CSFBGA (9x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-VFBGA, CSPBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3L-6900E-5MG256C – MachXO3 Field Programmable Gate Array (FPGA) IC, 256-VFBGA

The LCMXO3L-6900E-5MG256C is a MachXO3 family FPGA in a 256-VFBGA surface-mount package designed for commercial applications. It integrates 6,864 logic elements, approximately 0.246 Mbits of embedded memory (245,760 bits), and 206 user I/Os to support flexible system integration and on-board glue logic.

Built on the MachXO3 architecture, the device offers family-level features such as non-volatile, multi-time programmable configuration, flexible on-chip clocking (including PLLs and an on-chip oscillator), and embedded hardened IP blocks for common serial interfaces and timers—enabling compact, lower-BOM system designs within a 1.14 V to 1.26 V supply window and 0 °C to 85 °C operating range.

Key Features

  • Core Logic 6,864 logic elements provide a mid-range programmable fabric suitable for glue logic, interface bridging, and control functions.
  • Embedded Memory Approximately 0.246 Mbits (245,760 bits) of on-chip RAM for small buffers, FIFOs, and state storage.
  • I/O and Packaging 206 user I/Os in a 256-VFBGA / 256-CSFBGA (9×9) surface-mount package to support dense connectivity in compact board layouts.
  • Configuration and Non-Volatility MachXO3 family non-volatile, multi-time programmable configuration and User Flash Memory (UFM) enable secure, persistent designs and in-field configurability.
  • Clocking and Timing Flexible on-chip clocking with PLLs and an internal oscillator supports a variety of timing and synchronization requirements.
  • Embedded Hardened IP Family-level hardened IP includes common serial controller cores (I2C, SPI) and timer/counter functions to reduce external components.
  • Power and Modes Standby mode and power-saving options are available at the family level to support lower-power system states.
  • Commercial Grade Rated for commercial operation with a specified operating temperature range of 0 °C to 85 °C and a supply range of 1.14 V to 1.26 V.

Typical Applications

  • Interface Bridging and Glue Logic — Use the high I/O count and programmable fabric to implement board-level protocol adaptation and signal conditioning without additional controllers.
  • Sensor and Perimeter I/O — Hardened I2C/SPI IP and flexible I/O buffering simplify integration with sensor buses and peripheral devices.
  • Clocking and Synchronization — On-chip PLLs and oscillator support timing, deskewing, and source-synchronous interfaces in mixed-signal systems.
  • Firmware-Configurable Control — Non-volatile configuration and User Flash Memory (UFM) enable in-field updates and persistent control logic for evolving product requirements.

Unique Advantages

  • Highly integrated mid-range logic: 6,864 logic elements and embedded RAM deliver a compact programmable solution for system control and interface tasks.
  • Dense I/O in a compact package: 206 I/Os in a 256-VFBGA (256-CSFBGA 9×9) package enable high pin-count designs in space-constrained layouts.
  • Non-volatile, field-programmable configuration: Multi-time programmable non-volatile configuration and UFM reduce reliance on external configuration memory.
  • Embedded serial IP and timers: Hardened I2C and SPI cores plus timer/counter blocks lower BOM and simplify software integration for common peripherals.
  • Flexible clocking and low-power options: PLLs, an on-chip oscillator, and standby/power-saving modes support robust timing architectures and power-aware designs.
  • Commercial reliability: Specified for 0 °C to 85 °C operation and a defined supply range (1.14 V–1.26 V) for mainstream electronic products.

Why Choose LCMXO3L-6900E-5MG256C?

The LCMXO3L-6900E-5MG256C positions itself as a compact, commercially graded FPGA option within the MachXO3 family—balancing programmable logic capacity, on-chip memory, and a high I/O count in a small 256-VFBGA footprint. Family-level features such as non-volatile configuration, embedded hardened IP, flexible clocking, and power modes make it well-suited for designers seeking to reduce board-level component count and improve system integration.

This device is targeted at teams implementing interface-rich, firmware-updatable control logic and timing-sensitive functions in commercial products. Its MachXO3 family lineage provides documented system-level features and migration paths that support longer-term design scalability and maintainability.

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