LCMXO3L-6900E-5MG256C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 245760 6864 256-VFBGA, CSPBGA |
|---|---|
| Quantity | 529 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CSFBGA (9x9) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-VFBGA, CSPBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO3L-6900E-5MG256C – MachXO3 Field Programmable Gate Array (FPGA) IC, 256-VFBGA
The LCMXO3L-6900E-5MG256C is a MachXO3 family FPGA in a 256-VFBGA surface-mount package designed for commercial applications. It integrates 6,864 logic elements, approximately 0.246 Mbits of embedded memory (245,760 bits), and 206 user I/Os to support flexible system integration and on-board glue logic.
Built on the MachXO3 architecture, the device offers family-level features such as non-volatile, multi-time programmable configuration, flexible on-chip clocking (including PLLs and an on-chip oscillator), and embedded hardened IP blocks for common serial interfaces and timers—enabling compact, lower-BOM system designs within a 1.14 V to 1.26 V supply window and 0 °C to 85 °C operating range.
Key Features
- Core Logic 6,864 logic elements provide a mid-range programmable fabric suitable for glue logic, interface bridging, and control functions.
- Embedded Memory Approximately 0.246 Mbits (245,760 bits) of on-chip RAM for small buffers, FIFOs, and state storage.
- I/O and Packaging 206 user I/Os in a 256-VFBGA / 256-CSFBGA (9×9) surface-mount package to support dense connectivity in compact board layouts.
- Configuration and Non-Volatility MachXO3 family non-volatile, multi-time programmable configuration and User Flash Memory (UFM) enable secure, persistent designs and in-field configurability.
- Clocking and Timing Flexible on-chip clocking with PLLs and an internal oscillator supports a variety of timing and synchronization requirements.
- Embedded Hardened IP Family-level hardened IP includes common serial controller cores (I2C, SPI) and timer/counter functions to reduce external components.
- Power and Modes Standby mode and power-saving options are available at the family level to support lower-power system states.
- Commercial Grade Rated for commercial operation with a specified operating temperature range of 0 °C to 85 °C and a supply range of 1.14 V to 1.26 V.
Typical Applications
- Interface Bridging and Glue Logic — Use the high I/O count and programmable fabric to implement board-level protocol adaptation and signal conditioning without additional controllers.
- Sensor and Perimeter I/O — Hardened I2C/SPI IP and flexible I/O buffering simplify integration with sensor buses and peripheral devices.
- Clocking and Synchronization — On-chip PLLs and oscillator support timing, deskewing, and source-synchronous interfaces in mixed-signal systems.
- Firmware-Configurable Control — Non-volatile configuration and User Flash Memory (UFM) enable in-field updates and persistent control logic for evolving product requirements.
Unique Advantages
- Highly integrated mid-range logic: 6,864 logic elements and embedded RAM deliver a compact programmable solution for system control and interface tasks.
- Dense I/O in a compact package: 206 I/Os in a 256-VFBGA (256-CSFBGA 9×9) package enable high pin-count designs in space-constrained layouts.
- Non-volatile, field-programmable configuration: Multi-time programmable non-volatile configuration and UFM reduce reliance on external configuration memory.
- Embedded serial IP and timers: Hardened I2C and SPI cores plus timer/counter blocks lower BOM and simplify software integration for common peripherals.
- Flexible clocking and low-power options: PLLs, an on-chip oscillator, and standby/power-saving modes support robust timing architectures and power-aware designs.
- Commercial reliability: Specified for 0 °C to 85 °C operation and a defined supply range (1.14 V–1.26 V) for mainstream electronic products.
Why Choose LCMXO3L-6900E-5MG256C?
The LCMXO3L-6900E-5MG256C positions itself as a compact, commercially graded FPGA option within the MachXO3 family—balancing programmable logic capacity, on-chip memory, and a high I/O count in a small 256-VFBGA footprint. Family-level features such as non-volatile configuration, embedded hardened IP, flexible clocking, and power modes make it well-suited for designers seeking to reduce board-level component count and improve system integration.
This device is targeted at teams implementing interface-rich, firmware-updatable control logic and timing-sensitive functions in commercial products. Its MachXO3 family lineage provides documented system-level features and migration paths that support longer-term design scalability and maintainability.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the LCMXO3L-6900E-5MG256C.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016