LCMXO3L-6900C-6BG400I

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 245760 6864 400-LFBGA

Quantity 25 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs858Number of Logic Elements/Cells6864
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits245760

Overview of LCMXO3L-6900C-6BG400I – MachXO3 Field Programmable Gate Array (FPGA) IC 335 245760 6864 400-LFBGA

The LCMXO3L-6900C-6BG400I is a MachXO3 family FPGA from Lattice Semiconductor, offering a non-volatile, reprogrammable logic device in a compact 400-LFBGA package. It combines 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and 335 I/Os to address control, I/O bridging and system integration tasks for industrial applications.

Designed for surface-mount assembly and rated for industrial temperatures (−40 °C to 100 °C), this device supports supply voltages from 2.375 V to 3.465 V and is RoHS compliant.

Key Features

  • Logic Capacity — 6,864 logic elements provide configurable resources for glue logic, state machines, and moderate-complexity custom logic implementations.
  • Embedded Memory — Approximately 0.246 Mbits of on-chip RAM (245,760 bits) for FIFOs, buffers, and small data stores.
  • High I/O Count — 335 general-purpose I/Os to support extensive peripheral connectivity and multi-interface designs.
  • Non-volatile, Multi-time Programmable — MachXO3 family architecture provides non-volatile configuration with multi-time programmability for in-field updates and configuration flexibility.
  • Flexible I/O and Clocking — Family-level features include flexible on-chip clocking and configurable I/O buffers to support a range of interface requirements.
  • Embedded Hardened IP — Series datasheet documents embedded IP functions (for example I2C, SPI, timers) to simplify common system functions.
  • Package and Mounting — 400-LFBGA (supplier package: 400-CABGA, 17×17) in a surface-mount form factor for compact board integration.
  • Industrial Temperature and Power — Rated for −40 °C to 100 °C operation and supplies from 2.375 V to 3.465 V for robust industrial use.
  • Standards and Compliance — RoHS compliant to meet current lead-free environmental requirements.

Typical Applications

  • Industrial Control — Implement control logic, interface aggregation, and protocol bridging in industrial equipment using the device’s industrial temperature rating and high I/O count.
  • System Glue Logic — Replace discrete glue components by consolidating control, sequencing, and interface adaptation into the FPGA’s logic fabric and embedded memory.
  • I/O Expansion and Bridging — Use the 335 I/Os to connect multiple peripherals and translate between interfaces while maintaining a small PCB footprint.
  • Configuration and System Supervision — Take advantage of non-volatile, multi-time programmable configuration for in-field updates and system-level configuration storage.

Unique Advantages

  • High integration density: 6,864 logic elements and on-chip memory reduce BOM and simplify board-level design by integrating logic, buffering, and small data storage.
  • Large peripheral connectivity: 335 I/Os enable direct connection of many sensors, actuators, and interface chips without additional expanders.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
  • Compact packaging: 400-LFBGA (400-CABGA, 17×17) provides a space-efficient solution for high-pin-count designs.
  • Reconfigurable, non-volatile operation: Multi-time programmable non-volatile configuration supports field updates and flexible system configuration strategies.
  • Family-level system features: MachXO3 family capabilities—such as flexible clocking, configurable I/O buffers, and embedded IP—help accelerate development and integration.

Why Choose LCMXO3L-6900C-6BG400I?

The LCMXO3L-6900C-6BG400I positions itself as a compact, industrial-grade, non-volatile FPGA suitable for designs that need significant I/O density, moderate logic capacity, and embedded RAM in a single surface-mount package. Its combination of 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and 335 I/Os makes it well suited to system glue, interface bridging, and control applications where board space and robust operation matter.

As a member of the MachXO3 family, it brings family-level features such as flexible I/O, on-chip clocking, and embedded IP functions that help reduce development time and simplify system integration for engineers and procurement teams focused on long-term reliability and field programmability.

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