LCMXO3L-6900C-6BG324C

The LCMXO3L-6900C-6BG324C is a MachXO3 family Field Programmable Gate Array (FPGA) optimized for commercial designs that require flexible system logic, plentiful I/O and on‑chip memory. Built on the MachXO3 architecture, the device combines reconfigurable logic, embedded memory and a broad set of system-level features to address interface bridging, glue logic and control functions in commercial electronic products.

Key value comes from a balanced integration of 6,864 logic elements, 279 I/O pins and approximately 0.246 Mbits of embedded RAM, packaged in a compact 324‑LFBGA (15×15) surface‑mount package and designed for 2.375 V to 3.465 V supply operation.

Key Features

• Logic Capacity — 6,864 logic elements (logic element cells) suitable for mid-density glue logic, control and interface tasks.
• Embedded Memory — Approximately 0.246 Mbits of on‑chip RAM (245,760 bits) for local buffering, FIFOs and small on‑chip data structures.
• I/O Resources — 279 programmable I/O pins to support dense connectivity and multiple board-level interfaces.
• Power and Voltage — Single supply operation across 2.375 V to 3.465 V, suitable for common commercial system rails.
• Package and Mounting — 324‑LFBGA (324‑CABGA 15×15) package in a surface‑mount form factor for compact PCB integration.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation (commercial grade).
• Non‑volatile, Multi‑time Programmable — Series-level MachXO3 capability for non‑volatile configuration and repeated reprogramming.
• Flexible On‑chip Clocking and PLLs — MachXO3 family clocking architecture with PLL support for flexible clock distribution and system timing.
• Programmable I/O and I/O Buffering — High-performance, flexible I/O buffer architecture with source‑synchronous and programmable I/O cell features described in the MachXO3 family datasheet.
• Embedded System IP — Series-level hardened IP blocks include common functions such as I²C, SPI and timers/counters for system integration.
• System-Level Features — Series functions such as TransFR reconfiguration, on‑chip oscillator, standby and power‑saving options, hot‑socketing considerations and IEEE 1149.1 boundary scan support are described in the MachXO3 family documentation.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Commercial Embedded Control — Implement control logic, state machines and peripheral interfacing in commercial electronic products within the 0 °C to 85 °C range.
• Interface Bridging and Glue Logic — Use abundant I/O and programmable logic to bridge disparate buses, aggregate signals and offload board‑level glue functions.
• Prototyping and Mid‑Density FPGA Designs — Deploy for development and volume designs that require reprogrammable logic, on‑chip memory and flexible clocking.
• Configuration and System Initialization — Take advantage of the MachXO3 family’s non‑volatile, multi‑time programmable configuration for system boot, configuration management and in‑field updates.

Unique Advantages

• Balanced Logic and I/O Integration: 6,864 logic elements combined with 279 I/O pins provide ample resources for complex board‑level functions without excessive package overhead.
• On‑Chip Memory for Local Buffers: Approximately 0.246 Mbits of embedded RAM enables local data buffering and FIFO implementations that reduce external memory dependency.
• Compact, Surface‑Mount Package: 324‑LFBGA (15×15) packaging supports high I/O density in space‑constrained PCB designs.
• Commercial‑Grade Range: Rated for 0 °C to 85 °C operation and designed for common commercial supply voltages, aligning with a wide range of consumer and commercial systems.
• Series‑Level System Features: MachXO3 family capabilities such as programmable I/O cells, on‑chip oscillator, PLLs and hardened peripheral IP streamline system design and reduce BOM complexity.
• RoHS Compliance: Environmentally compliant manufacturing supports regulatory requirements for commercial electronics.

Why Choose LCMXO3L-6900C-6BG324C?

The LCMXO3L-6900C-6BG324C positions itself as a versatile mid‑density FPGA choice for commercial products that require a mix of programmable logic, plentiful I/O and embedded memory in a compact surface‑mount package. Its MachXO3 family features provide configuration flexibility, on‑chip system IP and clocking options that simplify board‑level integration and reduce external component count.

This device is well suited for design teams building commercial embedded systems, interface bridges and control logic where reprogrammability, moderate logic density and high I/O count are primary requirements. The combination of non‑volatile configuration, surface‑mount 324‑LFBGA packaging and RoHS compliance supports long‑term maintainability and regulatory needs.

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