LCMXO3L-6900C-6BG256C

The LCMXO3L-6900C-6BG256C is a MachXO3 family field‑programmable gate array from Lattice Semiconductor offering 6,864 logic elements and approximately 245,760 bits of on‑chip memory. It combines a flexible programmable core with up to 206 I/O pins in a 256‑LFBGA (256‑CABGA, 14×14) surface‑mount package, targeting embedded control, board‑level glue logic and connectivity applications that require non‑volatile configuration and rich peripheral capabilities.

Built with the MachXO3 architecture, the device includes on‑chip clocking (PLLs), programmable I/O cells, embedded block RAM modes, hardened peripheral IP and reconfiguration support, while operating from a 2.375 V to 3.465 V supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 6,864 logic elements (cells) to implement glue logic, state machines and moderate‑complexity programmable functions.
• Embedded Memory — Approximately 245,760 bits of on‑chip RAM with support for single, dual, pseudo‑dual port and FIFO modes for flexible data buffering and local storage.
• I/O and Packaging — 206 programmable I/O pins in a 256‑LFBGA package (supplier device package: 256‑CABGA, 14×14); surface mount mounting type for compact board integration.
• Power and Temperature — Operates from 2.375 V to 3.465 V and rated for commercial operation from 0 °C to 85 °C. RoHS compliant.
• Non‑volatile, Multi‑time Programmable Configuration — MachXO3 family non‑volatile configuration enables power‑up programmability and field reconfiguration without external volatile configuration memory.
• Flexible On‑chip Clocking — Integrated sysCLOCK PLLs and clock distribution resources for synchronized designs and source‑synchronous interfaces.
• Programmable I/O and SysI/O Buffering — Programmable I/O cells, input/output gearbox functions and multiple I/O buffer banks to accommodate varied signaling and timing requirements.
• Hardened Peripheral IP — Embedded hardened functions including I2C and SPI IP cores and timer/counter resources for common peripheral tasks.
• Configuration, Test and Reliability — On‑chip configuration and IEEE‑1149.1 boundary scan testability, user flash memory (UFM) and standby/power saving options referenced in the MachXO3 family documentation.
• Reconfiguration and System Support — TransFR reconfiguration capability and MachXO3 family system‑level support including migration options across the family.

Typical Applications

• Embedded Control — Implement board control logic, state machines and supervisory functions using the on‑chip logic elements and timers.
• Connectivity & Protocol Bridging — Use programmable I/O, hardened I2C/SPI IP and abundant I/O to bridge peripheral buses and interface legacy or custom peripherals.
• User Interface & Display Control — Drive and manage multiplexed buttons, LEDs and displays with local RAM and I/O resources for buffering and timing.
• Test & Measurement — Implement instrument control, data buffering (FIFO modes) and test sequencers leveraging non‑volatile configuration and boundary scan testability.

Unique Advantages

• Non‑volatile, field‑reprogrammable — Multi‑time programmable configuration eliminates the need for external configuration memory and simplifies system power‑up behavior.
• Balanced integration — Combines moderate logic density, substantial embedded RAM and 206 I/Os in a single 256‑LFBGA package to reduce BOM and board area.
• Flexible I/O and clocking — Programmable I/O cells, gearbox functions and integrated PLLs support a range of signaling and synchronized interfaces without additional components.
• Embedded peripheral IP — Hardened I2C, SPI and timer/counter blocks accelerate development of common control and communication functions.
• Design and test support — On‑chip boundary scan, user flash memory and documented MachXO3 family features help streamline verification and field updates.

Why Choose LCMXO3L-6900C-6BG256C?

The LCMXO3L-6900C-6BG256C is positioned for designers who need a compact, non‑volatile FPGA with a balance of logic, embedded memory and high I/O count for board‑level control, bridging and embedded system tasks. Its MachXO3 family capabilities—on‑chip PLLs, programmable I/O, hardened peripheral IP and reconfiguration features—provide a practical integration point that can reduce external components and simplify system design.

With a commercial temperature rating, surface‑mount 256‑LFBGA packaging and a 2.375 V–3.465 V supply range, this device is suited to a wide range of consumer and equipment designs where verified family‑level support and in‑system programmability are valuable for long‑term maintainability and scalability.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3L-6900C-6BG256C. Our team can provide ordering information and help assess suitability for your design.