LCMXO3L-6900C-5BG324I

The LCMXO3L-6900C-5BG324I is a MachXO3 family FPGA in a 324‑LFBGA package designed for industrial applications. It combines reconfigurable logic, embedded memory, and extensive I/O to address system control, glue-logic, and interface consolidation in embedded and industrial systems.

This device provides 6,864 logic elements, approximately 0.246 Mbits of embedded memory, and up to 279 I/Os, operating from a single supply range of 2.375 V to 3.465 V and across an industrial temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity — 6,864 logic elements to implement control, glue logic, and moderate-complexity state machines.
• Embedded Memory — Approximately 0.246 Mbits of on-chip RAM (245,760 total RAM bits) for data buffering, FIFOs, and small tables.
• High I/O Count — Up to 279 I/Os suitable for dense peripheral and bus interfacing needs.
• Industrial Operating Range — Specified for −40 °C to 100 °C operation and RoHS compliant for industrial deployments.
• Flexible Power — Supports a supply range from 2.375 V to 3.465 V for system-level power flexibility.
• Advanced Architecture Features — Series-level capabilities include non-volatile, multi-time programmable configuration, on-chip oscillator, PLLs for clocking, and TransFR reconfiguration (as documented for the MachXO3 family).
• Embedded IP and Peripherals — Hardened on-chip IP options referenced in the MachXO3 family (examples include I²C and SPI cores, timer/counter, and User Flash Memory) to simplify common interface and control functions.
• Package and Mounting — 324‑LFBGA (supplier package: 324‑CABGA, 15×15) in a surface‑mount form factor for compact PCB integration.

Typical Applications

• Industrial Control — Implement protocol bridging, I/O aggregation, and deterministic state machines for factory automation and equipment control.
• Interface Bridging — Consolidate multiple peripherals and bus interfaces into a single programmable device to reduce PCB complexity.
• Embedded System Glue‑Logic — Replace discrete logic for reset sequencing, clock management, and system supervision with reconfigurable logic and embedded IP.
• Communications and Networking Equipment — Use the device’s high I/O count and on-chip resources for management, control, and front-end interface tasks.

Unique Advantages

• Compact, High‑I/O Integration: 279 I/Os in a 324‑LFBGA package allow dense connectivity while keeping board area low.
• Reconfigurable Non‑Volatile Logic: Multi-time programmable configuration enables in-field updates and iterative hardware refinement without external configuration memory.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in challenging environments.
• On‑chip Resources Reduce BOM: Embedded RAM, hardened IP cores (I²C, SPI, timers) and clocking resources reduce or eliminate external components for common functions.
• Flexible Power Options: Support for a broad supply range (2.375 V–3.465 V) eases integration into varied system power architectures.

Why Choose LCMXO3L-6900C-5BG324I?

The LCMXO3L-6900C-5BG324I positions itself as a versatile, industrial‑grade FPGA delivering a balance of logic capacity, embedded memory, and a high I/O count in a compact BGA package. It is suited to designers who need reconfigurable glue logic, interface consolidation, and on-chip peripheral support while maintaining rugged operating temperature and flexible supply requirements.

For development teams and procurement, this MachXO3 device offers a clear path to reduce external components, simplify PCB routing, and enable field updates thanks to its non‑volatile programmable architecture and built‑in system resources documented for the MachXO3 family.

Request a quote or submit a procurement inquiry to get pricing and availability details for the LCMXO3L-6900C-5BG324I.