LCMXO3L-6900C-5BG256I

The LCMXO3L-6900C-5BG256I is a MachXO3 family FPGA in a 256-LFBGA package optimized for industrial applications. It combines 6,864 logic elements with on-chip embedded memory and a broad programmable I/O set to enable flexible system control, interface bridging, and glue-logic integration.

Designed for compact, surface-mount implementations, the device provides non-volatile, multi-time programmable configuration and system-level features such as embedded hardened IP, on-chip clocking, and power-saving modes to simplify board-level design and accelerate time-to-market.

Key Features

• Logic Capacity — 6,864 logic elements for implementing combinational and sequential logic, state machines, and custom glue logic.
• Embedded Memory — Approximately 0.246 Mbits of on-chip RAM (245,760 total bits) for FIFOs, buffers, and small data stores.
• I/O and Interface — 206 programmable I/O pins supporting flexible I/O buffering and pre-engineered source-synchronous I/O as documented in the family datasheet.
• On-chip System Functions — Built-in capabilities called out in the datasheet include an on-chip oscillator, sysCLOCK PLLs for flexible clocking, and user flash memory (UFM) for configuration and small storage.
• Hardened IP — Datasheet references embedded hardened IP blocks such as I²C, SPI and timer/counter cores for common peripheral interfacing and system control functions.
• Configuration and Reliability — Non-volatile, multi-time programmable configuration with TransFR reconfiguration and IEEE 1149.1 boundary-scan testability noted in the family documentation.
• Power and Modes — Standby and power-saving options are provided at the family level to support lower-power system states.
• Supply and Mounting — Surface-mount device with recommended supply range of 2.375 V to 3.465 V, suitable for common single-supply board designs.
• Package and Temperature — 256-LFBGA (supplier package 256-CABGA, 14×14) and industrial operating range of −40 °C to 100 °C.
• Standards and Handling — Hot-socketing behavior and typical I/O behavior during power-up are documented for system integration considerations.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Embedded System Control — Non-volatile configuration, on-chip oscillator and hardened peripherals (I²C, SPI) make the device suitable for supervisory and control logic in embedded systems.
• Interface Bridging and Glue Logic — 206 I/Os and flexible I/O buffering enable protocol conversion, bus bridging, and board-level glue logic between digital subsystems.
• Small Memory-Focused Functions — Approximately 0.246 Mbits of embedded RAM supports FIFOs, small buffers, and temporary data storage for real-time data handling.
• Industrial and Harsh-Environment Electronics — Industrial temperature range (−40 °C to 100 °C) and surface-mount 256-LFBGA packaging support deployment in industrial electronics where extended thermal range is required.

Unique Advantages

• Highly Integrated Logic and Memory: 6,864 logic elements combined with on-chip RAM reduce external component count for compact designs.
• Extensive I/O Capacity: 206 programmable I/Os support dense connectivity to sensors, controllers, and peripheral devices without additional I/O expanders.
• Industrial Temperature Support: Rated for −40 °C to 100 °C operation to meet many industrial thermal requirements.
• Flexible Power Requirements: Wide supply range (2.375 V to 3.465 V) eases integration into systems with varied supply rails.
• Embedded System Features: On-chip oscillator, PLLs, user flash memory, and hardened IP cores streamline common system tasks and speed development.
• Compact, Surface-Mount Package: 256-LFBGA (256-CABGA 14×14) provides a small footprint for space-constrained PCBs.

Why Choose LCMXO3L-6900C-5BG256I?

The LCMXO3L-6900C-5BG256I positions itself as a compact, industrial-grade MachXO3 FPGA option for designs that need moderate logic capacity, substantial I/O, and embedded system features in a single, non-volatile device. Its combination of 6,864 logic elements, approximately 0.246 Mbits of embedded RAM, and hardened peripheral IP reduces PCB complexity and accelerates development for control, interface, and glue-logic applications.

Engineers specifying this device benefit from the family-level system features documented in the datasheet—flexible clocking, configuration options, power-saving modes, and boundary-scan testability—making it suitable for long-lived, maintainable designs where robust system integration and vendor documentation are important.

Request a quote or submit an RFQ to get pricing and availability for the LCMXO3L-6900C-5BG256I and add this compact, feature-rich MachXO3 FPGA to your next design.