LCMXO3L-6900C-5BG324C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 279 245760 6864 324-LFBGA |
|---|---|
| Quantity | 1,252 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CABGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 279 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 858 | Number of Logic Elements/Cells | 6864 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 245760 |
Overview of LCMXO3L-6900C-5BG324C – MachXO3 Field Programmable Gate Array (FPGA), 6864 logic elements
The LCMXO3L-6900C-5BG324C is a MachXO3 family FPGA offering a compact, non-volatile programmable fabric with 6,864 logic elements and approximately 0.246 Mbits of embedded RAM. Designed for commercial-grade embedded designs, it provides a high I/O count and flexible on-chip resources for control, interfacing, and glue-logic functions.
This surface-mount 324-LFBGA device supports a 2.375 V to 3.465 V supply range, operates from 0 °C to 85 °C, and is RoHS compliant—making it suitable for general-purpose electronic and embedded system applications that require reprogrammable logic and integrated peripheral IP.
Key Features
- Logic Capacity 6,864 logic elements provide programmable fabric for glue logic, state machines, and custom control functions.
- Embedded Memory Approximately 0.246 Mbits of on-chip RAM for small FIFOs, buffers, and data storage inside the FPGA.
- I/O Density 279 user I/Os enable broad system interfacing and support for multiple parallel buses and external devices.
- Power and Mounting Surface mount 324-LFBGA package (324-CABGA, 15×15) with a supply voltage range of 2.375 V to 3.465 V to match common board designs.
- Commercial Grade Thermal Range Rated for operation from 0 °C to 85 °C for mainstream commercial applications.
- Non-volatile, Multi-time Programmable Built-in non-volatile configuration and multi-time programmability support field updates and in-system reconfiguration.
- On-chip System Resources Includes programmable I/O cells, on-chip oscillator, PLL-based clocking and sysMEM embedded block RAM as described by the MachXO3 family architecture.
- Embedded Hardened IP Datasheet references hardened I²C and SPI IP cores and a timer/counter block for common peripheral interfaces and timing functions.
- Configuration and Test Support Family documentation includes features such as boundary-scan testability and multiple configuration options.
- Regulatory RoHS compliant.
Typical Applications
- Interface Bridging Use the high I/O count and flexible I/O architecture to implement signal-level translation, bus bridging, and protocol adaptation between system components.
- Embedded Control Leverage 6,864 logic elements and on-chip peripherals (timers, SPI, I²C) for device control, sequencing, and local intelligence in embedded products.
- Glue Logic and Signal Conditioning Deploy as field-programmable glue logic to consolidate discrete logic, add optional features, or implement timing adjustments with on-chip clocking resources.
Unique Advantages
- High I/O Integration: With 279 I/Os, the device minimizes external interface components and simplifies board-level routing for complex systems.
- Non-volatile Configuration: Multi-time programmable, non-volatile configuration removes the need for an external configuration flash in many designs and enables field updates.
- Embedded Peripherals: Built-in hardened I²C and SPI IP cores and timer/counter blocks reduce development time and conserve logic resources for application-specific functions.
- Compact, SMT Package: The 324-LFBGA (15×15) package delivers a dense pinout and compact footprint for space-constrained applications.
- Commercial Temperature Rating: Rated 0 °C to 85 °C to match general commercial product requirements.
- Standby and Power Options: MachXO3 family documentation references standby mode and power-saving options to help manage system power.
Why Choose LCMXO3L-6900C-5BG324C?
The LCMXO3L-6900C-5BG324C delivers a balanced combination of programmable logic, embedded memory, and a high I/O count in a compact 324-LFBGA package. Its non-volatile, multi-time programmable architecture and on-chip peripheral IP make it well suited for commercial embedded designs that need in-system reconfiguration, interface consolidation, and integrated timing/peripheral support.
This device fits designers seeking a reprogrammable, commercially rated FPGA for control, interfacing, and glue-logic applications where board space, I/O density, and the ability to update firmware in the field are important. The MachXO3 family documentation provides detailed architecture and configuration options to support long-term design scalability and maintainability.
If you would like pricing, availability, or to request a quote for LCMXO3L-6900C-5BG324C, submit a quote request or contact sales through your usual procurement channel.

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